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11. 发明授权

US07184111B2 Phosphor for use in white semiconductor light sources and a white light source utilizing the same 有权
标题翻译：用于白色半导体光源的荧光体和利用其的白色光源
公开(公告)号：US07184111B2
公开(公告)日：2007-02-27
申请号：US10425860
申请日：2003-04-28
申请人： Janet Bee Yin Chua , Kee Yean Ng , Tong Fatt Chew
发明人： Janet Bee Yin Chua , Kee Yean Ng , Tong Fatt Chew
IPC分类号： G02F1/1333
CPC分类号： H01L33/486 , C09K11/7774 , H01L33/502 , H01L33/54 , H01L33/62 , H01L2224/48091 , Y02B20/181 , Y10S362/80 , H01L2924/00012 , H01L2924/00014
摘要： A light source having an LED that is covered by a layer containing a phosphor is disclosed. The LED emits light in a first wavelength band. The phosphor containing layer includes particles that contain a phosphor having the formula Dy3A5O12, where A is at least one of the elements aluminum, gallium, indium, magnesium or silicon. The layer is positioned to receive a portion of the light from the LED and convert the light to light in a second wavelength band. The phosphor may be doped with Ce. Eu, and Tb, or a combination thereof.
摘要翻译：公开了一种具有由包含磷光体的层覆盖的LED的光源。 LED在第一波长带发光。含荧光体层包括含有具有下式的荧光体的颗粒：其中A是至少一种元素铝，镓，铟，镁或硅。该层定位成接收来自LED的一部分光并将光转换成第二波长带中的光。磷光体可以掺杂Ce。 Eu和Tb，或它们的组合。

12. 发明授权

US07463825B2 Camera flash with improved color balance 有权
标题翻译：相机闪光灯具有改善的色彩平衡
公开(公告)号：US07463825B2
公开(公告)日：2008-12-09
申请号：US11248795
申请日：2005-10-10
申请人： Rene P. Helbing , Kee Yean Ng , Janet Bee Yin Chua , Wooi Kin Goon , Thye Linn Mok , Gim-Eng Chew
发明人： Rene P. Helbing , Kee Yean Ng , Janet Bee Yin Chua , Wooi Kin Goon , Thye Linn Mok , Gim-Eng Chew
IPC分类号： G03B15/06 , G03B15/03
CPC分类号： G03B15/0442
摘要： A camera flash is disclosed for producing a warm light having a desired color temperature. In one embodiment, the flash has a xenon flash component producing a light with a spectrum having a color temperature at a higher Kelvin rating than the warm light, and a light emitting diode flash component producing a light with a spectrum having a color temperature at a lower Kelvin rating than the warm light. The color temperature of the light of the xenon flash component and the color temperature of the light of the light emitting diode flash component together produce the warm light having the desired color temperature.
摘要翻译：公开了一种用于产生具有所需色温的暖光的相机闪光灯。在一个实施例中，闪光灯具有产生具有光谱的光的氙闪光组件，该光谱具有比暖光更高的开尔文等级的色温，并且产生具有色温为a的光谱的光的发光二极管闪光组件开尔文评级低于暖灯。氙闪光部件的光的色温和发光二极管闪光部件的色温一起产生具有所需色温的暖光。

13. 发明授权

US07350933B2 Phosphor converted light source 有权
标题翻译：磷光转换光源
公开(公告)号：US07350933B2
公开(公告)日：2008-04-01
申请号：US11135712
申请日：2005-05-23
申请人： Kee Yean Ng , Heng Yow Cheng , Janet Bee Yin Chua
发明人： Kee Yean Ng , Heng Yow Cheng , Janet Bee Yin Chua
IPC分类号： F21V9/16
CPC分类号： H05B33/0818 , H05B33/0821 , H05B33/0863 , H05B33/0869 , Y10S362/80
摘要： A light source having first and second phosphor-converted component light sources is disclosed. The first component light source includes a first LED that emits light at a first wavelength and a first luminescent conversion material layer that converts light of the first wavelength to light of a first output wavelength, and the second component light source includes a second LED that emits light at a second wavelength and a second luminescent conversion material layer that converts light of the second wavelength to light of a second output wavelength that is different from the first output wavelength. The first and second LEDs are constructed in the same material system, preferably in the same batch of wafers on the fabrication line. A controller generates a current through each of the first and second LEDs that results in the light source generating light that is perceived to be a predetermined color.
摘要翻译：公开了具有第一和第二磷光体转换组件光源的光源。第一分量光源包括发射第一波长的光的第一LED和将第一波长的光转换成第一输出波长的光的第一发光转换材料层，并且第二分量光源包括发射的第二LED 第二波长的光和将第二波长的光转换成与第一输出波长不同的第二输出波长的光的第二发光转换材料层。第一和第二LED被构造在相同的材料系统中，优选地在制造线上的同一批晶圆中。控制器通过导致光源产生感知为预定颜色的光的每个第一和第二LED产生电流。

14. 发明授权

US07318651B2 Flash module with quantum dot light conversion 有权
标题翻译：闪光灯模块采用量子点光转换
公开(公告)号：US07318651B2
公开(公告)日：2008-01-15
申请号：US11010206
申请日：2004-12-10
申请人： Janet Bee Yin Chua , Klan Shin Lee , Kee Yean Ng
发明人： Janet Bee Yin Chua , Klan Shin Lee , Kee Yean Ng
IPC分类号： G03B15/02
CPC分类号： G03B15/05 , B82Y10/00 , B82Y20/00 , G03B2215/0567 , H01L33/502 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48465 , H01L2224/8592 , H04N5/2256 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： A flash module includes a first light source emitting a first primary light has a first wavelength-converting overlay disposed on the first light source to provide a first color of light. The first wavelength-converting overlay includes a first plurality of quantum dots dispersed in a matrix material. The flash module also includes a second light source providing a second color of light.
摘要翻译：闪光灯模块包括发射第一原色光的第一光源具有布置在第一光源上的第一波长转换覆盖层以提供第一颜色的光。第一波长转换覆盖层包括分散在基质材料中的第一多个量子点。闪光灯模块还包括提供第二颜色的光的第二光源。

15. 发明授权

US07105863B1 Light source with improved life 有权
标题翻译：光源寿命更长
公开(公告)号：US07105863B1
公开(公告)日：2006-09-12
申请号：US11145140
申请日：2005-06-03
申请人： Kee Yean Ng , Kheng Leng Tan
发明人： Kee Yean Ng , Kheng Leng Tan
IPC分类号： H01L29/22 , H01L33/00 , F21S13/10
CPC分类号： H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light source has an attachment element attached to a hollow outer element. First and second leads extend through the attachment element. A light-emitting diode (“LED”) die is attached to a substrate portion of a lead. Elastomeric encapsulant disposed within the hollow outer element surrounds the LED die. The light source includes a chamber between the elastomeric encapsulant and the attachment element.
摘要翻译：光源具有附接到中空外部元件的附接元件。第一和第二引线延伸通过附接元件。发光二极管（“LED”）管芯附接到引线的衬底部分。设置在中空外部元件内的弹性密封剂围绕LED管芯。光源包括在弹性密封剂和附接元件之间的腔室。

16. 发明授权

US07547583B2 Light emitting diode package with direct leadframe heat dissipation 有权
标题翻译：具有直接引线框散热的发光二极管封装
公开(公告)号：US07547583B2
公开(公告)日：2009-06-16
申请号：US12044904
申请日：2008-03-07
申请人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
发明人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L21/495 , H01L23/34 , H01L31/0203
CPC分类号： H01L23/49568 , H01L24/48 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.
摘要翻译：公开了一种用于封装集成电路的封装电路和方法。封装电路具有引线框，集成电路芯片和封装层。引线框架具有第一和第二部分，第一部分包括横向部分，芯片安装区域和第一延伸部分。集成电路芯片安装在芯片安装区域并与芯片安装区域热接触。封装层具有顶部，底部以及第一和第二侧表面。第一延伸部被弯曲以提供从芯片安装区域到底部表面的第一热路径。热路将热芯片安装区域连接到底面而不通过第一和第二侧表面，并且提供比通过横向部分或第二部分的热路径具有更小热阻的热路径。

17. 发明申请

US20080153190A1 Light Emitting Diode Package With Direct Leadframe Heat Dissipation 有权
标题翻译：具有直接引线框架散热的发光二极管封装
公开(公告)号：US20080153190A1
公开(公告)日：2008-06-26
申请号：US12044904
申请日：2008-03-07
申请人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
发明人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
IPC分类号： H01L33/00
CPC分类号： H01L23/49568 , H01L24/48 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.
摘要翻译：公开了一种用于封装集成电路的封装电路和方法。封装电路具有引线框，集成电路芯片和封装层。引线框架具有第一和第二部分，第一部分包括横向部分，芯片安装区域和第一延伸部分。集成电路芯片安装在芯片安装区域并与芯片安装区域热接触。封装层具有顶部，底部以及第一和第二侧表面。第一延伸部被弯曲以提供从芯片安装区域到底部表面的第一热路径。热路将热芯片安装区域连接到底面而不通过第一和第二侧表面，并且提供比通过横向部分或第二部分的热路径热阻小的热路径。

18. 发明授权

US07727041B2 Method of applying light-converting material and device thereof 有权
标题翻译：光转换材料的应用方法及其装置
公开(公告)号：US07727041B2
公开(公告)日：2010-06-01
申请号：US11937380
申请日：2007-11-08
申请人： Kee Yean Ng , Kheng Leng Tan , Wen Ya Ou
发明人： Kee Yean Ng , Kheng Leng Tan , Wen Ya Ou
IPC分类号： H01J9/24
CPC分类号： C09K11/02 , C09K11/08 , H01L33/505 , H01L2224/48247 , H01L2224/73265
摘要： A light emitting device having a die that includes a light source that generates light of a first wavelength and a layer of phosphor particles covering the die is disclosed. The phosphor particles convert a portion of the light of the first wavelength to light of a second wavelength. The light source can be fabricated by attaching the light source to a substrate, and converting the light source by applying a light converting layer that includes a volatile carrier material and particles of a phosphor that convert light of the first wavelength to light of the second wavelength over the light source. The volatile carrier material is then caused to evaporate leaving a layer of the phosphor particles over the light source. A binder material can be incorporated in the volatile carrier for binding the phosphor particles to one another after the volatile carrier material is evaporated.
摘要翻译：公开了一种具有芯片的发光器件，该裸片包括产生第一波长的光的光源和覆盖该裸片的荧光体粒子层。荧光体颗粒将第一波长的光的一部分转换成第二波长的光。光源可以通过将光源附着到基板上来制造，并且通过将包括挥发性载体材料的光转换层和将第一波长的光转换成第二波长的光的荧光体的颗粒来转换光源在光源上。然后使挥发性载体材料蒸发，在光源上留下一层荧光体颗粒。在挥发性载体材料蒸发之后，可以将粘合剂材料引入挥发性载体中以将荧光体颗粒彼此粘合。

19. 发明授权

US07315119B2 Light-emitting device having a phosphor particle layer with specific thickness 有权
标题翻译：具有特定厚度的荧光体颗粒层的发光装置
公开(公告)号：US07315119B2
公开(公告)日：2008-01-01
申请号：US10841755
申请日：2004-05-07
申请人： Kee Yean Ng , Kheng Leng Tan , Wen Ya Ou
发明人： Kee Yean Ng , Kheng Leng Tan , Wen Ya Ou
IPC分类号： H01J1/62
CPC分类号： C09K11/02 , C09K11/08 , H01L33/505 , H01L2224/48247 , H01L2224/73265
摘要： A light emitting device having a die that includes a light source that generates light of a first wavelength and a layer of phosphor particles covering the die is disclosed. The phosphor particles convert a portion of the light of the first wavelength to light of a second wavelength. The light source can be fabricated by attaching the light source to a substrate, and converting the light source by applying a light converting layer that includes a volatile carrier material and particles of a phosphor that convert light of the first wavelength to light of the second wavelength over the light source. The volatile carrier material is then caused to evaporate leaving a layer of the phosphor particles over the light source. A binder material can be incorporated in the volatile carrier for binding the phosphor particles to one another after the volatile carrier material is evaporated.
摘要翻译：公开了一种具有芯片的发光器件，该裸片包括产生第一波长的光的光源和覆盖该裸片的荧光体粒子层。荧光体颗粒将第一波长的光的一部分转换成第二波长的光。光源可以通过将光源附着到基板上来制造，并且通过将包括挥发性载体材料的光转换层和将第一波长的光转换成第二波长的光的荧光体的颗粒来转换光源在光源上。然后使挥发性载体材料蒸发，在光源上留下一层荧光体颗粒。在挥发性载体材料蒸发之后，可以将粘合剂材料引入挥发性载体中以将荧光体颗粒彼此粘合。

20. 发明授权

US07365407B2 Light emitting diode package with direct leadframe heat dissipation 有权
标题翻译：具有直接引线框散热的发光二极管封装
公开(公告)号：US07365407B2
公开(公告)日：2008-04-29
申请号：US11415548
申请日：2006-05-01
申请人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Alzar Abdul Karim Norfidathul
发明人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Alzar Abdul Karim Norfidathul
IPC分类号： H01L31/0203 , H01L23/495 , H01L29/267 , H01L29/22 , H01L29/24 , H01L21/00 , H01L21/50
CPC分类号： H01L23/49568 , H01L24/48 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.
摘要翻译：公开了一种用于封装集成电路的封装电路和方法。封装电路具有引线框，集成电路芯片和封装层。引线框架具有第一和第二部分，第一部分包括横向部分，芯片安装区域和第一延伸部分。集成电路芯片安装在芯片安装区域并与芯片安装区域热接触。封装层具有顶部，底部以及第一和第二侧表面。第一延伸部被弯曲以提供从芯片安装区域到底部表面的第一热路径。热路将热芯片安装区域连接到底面而不通过第一和第二侧表面，并且提供比通过横向部分或第二部分的热路径热阻小的热路径。

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