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11. 发明授权

US06863705B2 Exhaust gas purifying filter and manufacturing method therefor 失效
标题翻译：废气净化过滤器及其制造方法
公开(公告)号：US06863705B2
公开(公告)日：2005-03-08
申请号：US10224629
申请日：2002-08-21
申请人： Mikio Ishihara , Mamoru Nishimura
发明人： Mikio Ishihara , Mamoru Nishimura
IPC分类号： F01N3/02 , B01D39/00 , B01D39/20 , B01J35/04 , B28B11/00 , F01N3/022 , F01N3/031 , B01D46/00
CPC分类号： F01N3/031 , B01J35/04 , B28B11/006 , F01N2240/20 , F01N2330/06 , F01N2410/08 , Y02T10/20 , Y10S55/05 , Y10S55/30 , Y10S264/48
摘要： A ceramic material containing organic binder is formed by extrusion, dried and cut off so as to make the honeycomb body 100 having the bulkheads 11 and a plurality of cells 12 partitioned by the bulkheads 11 and penetrating between both end faces of the honeycomb body 100. The tapered jig 3 having a tapered forward end portion 31 is inserted into the opening 13 of the cell 12 of the honeycomb body 100. Then, the bulkheads 11 are heated and softened and deformed by a pushing force given by the tapered jig 3 so that the opening 13 of the cell 12 is expanded to form the large opening 131, and the opening 13 of the adjoining cell 12 is reduced at the same time so as to form the small opening 132. After that, the honeycomb body 100 is fired. In this way, the exhaust gas purifying filter for collecting particulates is manufactured.
摘要翻译：通过挤出，干燥和切断形成含有有机粘合剂的陶瓷材料，以使具有隔板11的蜂窝体100和由隔板11分隔开并在蜂窝体100的两个端面之间穿过的多个单元12。具有锥形前端部31的锥形夹具3插入到蜂窝体100的电池12的开口部13中。然后，通过锥形夹具3的推力使隔壁11加热软化变形，电池单元12的开口13被扩张以形成大开口131，同时相邻单元12的开口13同时缩小以形成小开口132.之后，蜂窝体100被点燃。以这种方式制造用于收集微粒的废气净化过滤器。

12. 发明申请

US20060197252A1 Manufacturing method of exhaust gas purifying filter 失效
公开(公告)号：US20060197252A1
公开(公告)日：2006-09-07
申请号：US11362208
申请日：2006-02-27
申请人： Satoshi Ishikawa , Mikio Ishihara , Kazuhide Sato
发明人： Satoshi Ishikawa , Mikio Ishihara , Kazuhide Sato
IPC分类号： B29C47/00 , B29C57/00
CPC分类号： F01N3/0222 , B28B11/006 , F01N2330/06 , F01N2330/30 , Y02T10/20
摘要： In a method of manufacturing an exhaust gas purifying filter that captures and purifies particulates involved in an exhaust gas emitted from an internal combustion engine, a honeycomb mold body of a desired length is firstly made by an extrusion molding step. In a sealing and enlarging step, tapered front parts of a multi-taper jig are inserted into the corresponding openings of the cells. The multi-taper jig is then oscillatory moved in a direction perpendicular to a longitudinal length of the ceramic mold body while heating the partition walls forming the cells, so that the opening of one cell is closed and sealed completely and the opening of the adjacent cell is enlarged in area. Finally, the honeycomb mold body is burned.

13. 发明授权

US07884455B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07884455B2
公开(公告)日：2011-02-08
申请号：US12051221
申请日：2008-03-19
申请人： Taishi Sasaki , Mikio Ishihara
发明人： Taishi Sasaki , Mikio Ishihara
IPC分类号： H01L23/02
CPC分类号： H01L23/3107 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/49111 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A power module includes: an encapsulation-target portion having at least one semiconductor element; and an encapsulation member that has first and second planes between which the encapsulation-target portion is interposed, and that encapsulates the encapsulation-target portion. The encapsulation member has, on the at least one semiconductor element, at least one opening that exposes part of a surface of the encapsulation-target portion the surface being on a side of the first plane. Thus, a semiconductor device of which size can be reduced can be provided.
摘要翻译：功率模块包括：具有至少一个半导体元件的封装目标部分; 以及封装构件，其具有插入封装目标部分之间的第一和第二平面，并且封装封装目标部分。所述封装构件在所述至少一个半导体元件上具有至少一个开口，所述至少一个开口暴露所述封装 - 目标部分的表面位于所述第一平面侧的表面的一部分。因此，可以提供可以减小尺寸的半导体器件。

14. 发明申请

US20050163675A1 Exhaust gas purifying filter and method of manufacturing the same 审中-公开
标题翻译：废气净化过滤器及其制造方法
公开(公告)号：US20050163675A1
公开(公告)日：2005-07-28
申请号：US11087802
申请日：2005-03-24
申请人： Mamoru Nishimura , Mikio Ishihara , Yoshitsugu Ogura
发明人： Mamoru Nishimura , Mikio Ishihara , Yoshitsugu Ogura
IPC分类号： B01D39/14 , B01D39/00 , B01D39/20 , B01D46/00 , B01D46/24 , B01D53/94 , B01J32/00 , B01J35/04 , B01J35/10 , C04B38/00 , C04B38/02 , C04B38/04 , F01N3/022 , F01N3/035 , B01J21/04 , B01D53/34
CPC分类号： B01D46/2474 , B01D46/0001 , B01D46/2418 , B01D46/2429 , B01D46/2451 , B01D53/94 , B01D2046/2496 , B01D2275/30 , B01J35/04 , B01J35/10 , C04B38/0006 , C04B2111/00793 , F01N3/0222 , F01N3/035 , F01N2330/38 , C04B35/195 , C04B38/00
摘要： The present invention provides an exhaust gas purifying filter that has an increased contact area, between a catalyst supported on the dividing walls of a honeycomb structural body and particulate matter deposited thereon, and can improve the capacity of the catalyst to oxidize the particulate matter, and a method of manufacturing the same. According to the present invention, the exhaust gas purifying filter 1 comprising the honeycomb structural body 10 made of ceramic and the catalyst 2 supported on the surface of the dividing walls 11 of the honeycomb structural body 10 has void ratio, of the dividing wall 11 of the honeycomb structural body 10, in a range from 55 to 80%, and the proportion of surface pores is 20% or higher.
摘要翻译：本发明提供一种废气净化过滤器，其在蜂窝结构体的分隔壁上负载的催化剂和沉积在其上的颗粒物质之间具有增加的接触面积，并且可以提高催化剂氧化颗粒物质的能力，以及其制造方法。根据本发明，由陶瓷制的蜂窝结构体10和支承在蜂窝结构体10的分隔壁11的表面上的催化剂2构成的排气净化过滤器1具有空隙率，蜂窝结构体10的范围为55〜80％，表面孔的比例为20％以上。

15. 发明授权

US06800107B2 Exhaust gas purifying filter 失效
标题翻译：废气净化过滤器
公开(公告)号：US06800107B2
公开(公告)日：2004-10-05
申请号：US10123207
申请日：2002-04-17
申请人： Mikio Ishihara , Mamoru Nishimura , Makoto Saito
发明人： Mikio Ishihara , Mamoru Nishimura , Makoto Saito
IPC分类号： B01D4600
CPC分类号： B01D46/2459 , B01D46/2429 , B01D46/244 , B01D46/2466 , B01D46/2474 , B01D2046/2433 , B01D2046/2496 , F01N3/0222 , Y02T10/20 , Y10S55/30
摘要： An exhaust gas purifying filter employs plugs that can be used as part of filter. The exhaust gas purifying filter has a honeycomb structure including a multitude of cells each surrounded by walls. Each of the cells is stopped with a plug on one end and the walls and the plugs are all made of a porous material. The value of M=(L/t)×(P1/P2) is in a range of 10
摘要翻译：废气净化过滤器采用可用作过滤器一部分的塞子。废气净化过滤器具有蜂窝结构，其包括多个由壁围绕的单元。每个细胞在一端用塞子停止，并且壁和塞子均由多孔材料制成。 M =（L / t）×（P1 / P2）的值在10

16. 发明授权

US06764527B2 Honeycomb structure constituted by main and sub honeycomb structures 失效
标题翻译：蜂窝结构主要由蜂窝结构构成
公开(公告)号：US06764527B2
公开(公告)日：2004-07-20
申请号：US10062475
申请日：2002-02-05
申请人： Mikio Ishihara , Mamoru Nishimura
发明人： Mikio Ishihara , Mamoru Nishimura
IPC分类号： B01D5000
CPC分类号： F01N3/031 , F01N3/0222 , F01N13/0097 , F01N2240/20 , F01N2410/08 , Y02T10/20 , Y10T428/24149
摘要： A honeycomb structure comprising at least one main honeycomb structure 10 and sub-honeycomb structures 21, 22 axially disposed, in series, on both end surfaces of the main honeycomb structure 10. Partial plugs 15 are constituted for some of the cells 11 of the main honeycomb structure 10 by facing the intersecting portions of partitioning walls 211, surrounding the cells of the sub-honeycomb structure 21 disposed adjacent to the main honeycomb structure with some of the cells of main honeycomb structure, and the arrangement of the partial plugs 15 at one end surface 101 of the main honeycomb structure differs from that at the other end surface of the main honeycomb structure 10.
摘要翻译：蜂窝结构体包括至少一个主蜂窝结构体10和在主蜂窝结构体10的两个端面上轴向设置的子蜂窝结构体21,22。部分塞子15构成主要蜂窝结构体10的一些单元11 蜂窝结构体10通过面对间隔壁211的交叉部分，围绕主蜂巢结构的一些单元围绕设置在与主蜂窝结构相邻的子蜂窝结构21的单元，并且部分插塞15的布置在一个主蜂巢结构的端面101与主蜂窝结构体10的另一端面的端面101不同。

17. 发明授权

US08933568B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08933568B2
公开(公告)日：2015-01-13
申请号：US12907468
申请日：2010-10-19
申请人： Tsuyoshi Takayama , Yukio Yasuda , Hajime Kato , Kazuaki Hiyama , Taishi Sasaki , Mikio Ishihara
发明人： Tsuyoshi Takayama , Yukio Yasuda , Hajime Kato , Kazuaki Hiyama , Taishi Sasaki , Mikio Ishihara
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/142 , H01L23/492 , H01L24/29 , H01L24/32 , H01L24/33 , H01L2224/29076 , H01L2224/29101 , H01L2224/2919 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/351 , H01L2924/00
摘要： A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.
摘要翻译：根据本发明的半导体器件包括：作为半导体元件的功率半导体元件; 用于接合半导体元件的上表面和下表面的接合部分; 以及通过所述接合部从上下接合到所述功率半导体元件的金属板，其中所述接合部包括设置在所述半导体元件和所述金属板之间的网状金属体以及嵌入所述网状金属体的接合构件。

18. 发明授权

US08765068B2 Honeycomb structural body and electrical heated catalyst device 有权
标题翻译：蜂窝结构体和电加热催化装置
公开(公告)号：US08765068B2
公开(公告)日：2014-07-01
申请号：US13238333
申请日：2011-09-21
申请人： Mikio Ishihara
发明人： Mikio Ishihara
IPC分类号： B01D50/00
CPC分类号： F01N3/2026 , B01D53/00 , B01J35/0033 , H05B3/12 , H05B3/42 , H05B2203/024 , Y02T10/26
摘要： A honeycomb structural body has a honeycomb body and a pair of electrodes. The honeycomb body has a cell formation part and an outer skin part of a cylindrical hollow shape. The electrodes are formed on an outer peripheral surface of the outer skin part so that the electrodes face to each other in a diameter direction of the honeycomb body. Each of the electrodes has a reference electrode part formed at a central part of the electrode and one or more outside electrode parts formed at both ends of the reference electrode part. The reference electrode parts of the electrode face to each other. The outside electrode parts of the electrodes face to each other. An electrical resistivity of the reference electrode part is smaller than an electrical resistivity of each of the outside electrode parts in each of the electrodes.
摘要翻译：蜂窝结构体具有蜂窝体和一对电极。蜂窝体具有细胞形成部分和圆柱形中空形状的外皮部分。电极形成在外皮部的外周面上，使得电极在蜂窝体的直径方向上彼此面对。每个电极具有形成在电极的中心部分处的参考电极部分和形成在参考电极部分两端的一个或多个外部电极部分。电极的参考电极部分彼此面对。电极的外部电极部分彼此面对。参考电极部分的电阻率小于每个电极中每个外部电极部分的电阻率。

19. 发明申请

US20130199165A1 ELECTRICALLY HEATED CATALYST DEVICE 审中-公开
标题翻译：电加热催化装置
公开(公告)号：US20130199165A1
公开(公告)日：2013-08-08
申请号：US13539800
申请日：2012-07-02
申请人： Tomoo KAWASE , Mikio Ishihara
发明人： Tomoo KAWASE , Mikio Ishihara
IPC分类号： F01N3/28
CPC分类号： F01N3/2828 , F01N3/101 , F01N3/2013 , F01N2240/16 , Y02T10/22 , Y02T10/26
摘要： An electrically heated catalyst device has a cylindrical outer skin part and a cell formation part. A pair of electrodes formed on the outer skin park faces relative to each other in a radial direction of the honeycomb structural body. An electrode terminal is formed on the corresponding electrode in an outer radial direction of the honeycomb structural body. A length edge line of each electrode is inclined to a virtual reference line at a predetermined angle. The virtual reference line is a virtual line defined on the outer circumferential surface of the outer skin part and is parallel to the axial direction of the honeycomb structural body. The electrode terminals are formed at a predetermined interval in the axial direction of the honeycomb structural body to make an angle of less than 180° when viewed from one end surface perpendicular to the axial direction of the honeycomb structural body.
摘要翻译：电加热的催化剂装置具有圆柱形外皮部分和细胞形成部分。形成在外皮公园上的一对电极在蜂窝结构体的径向上相对于彼此面对。在蜂窝结构体的外径向上的相应电极上形成电极端子。每个电极的长度边缘线以预定角度倾斜到虚拟参考线。虚拟参考线是限定在外皮部分的外周表面上并且平行于蜂窝结构体的轴向的虚拟线。当从与蜂窝结构体的轴向垂直的一个端面观察时，电极端子沿蜂窝结构体的轴向以预定的间隔形成为小于180°的角度。

20. 发明申请

US20110221076A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20110221076A1
公开(公告)日：2011-09-15
申请号：US12907468
申请日：2010-10-19
申请人： Tsuyoshi TAKAYAMA , Yukio Yasuda , Hajime Katou , Kazuaki Hiyama , Taishi Sasaki , Mikio Ishihara
发明人： Tsuyoshi TAKAYAMA , Yukio Yasuda , Hajime Katou , Kazuaki Hiyama , Taishi Sasaki , Mikio Ishihara
IPC分类号： H01L23/48
CPC分类号： H01L23/142 , H01L23/492 , H01L24/29 , H01L24/32 , H01L24/33 , H01L2224/29076 , H01L2224/29101 , H01L2224/2919 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/351 , H01L2924/00
摘要： A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.
摘要翻译：根据本发明的半导体器件包括：作为半导体元件的功率半导体元件; 用于接合半导体元件的上表面和下表面的接合部分; 以及通过所述接合部从上下接合到所述功率半导体元件的金属板，其中所述接合部包括设置在所述半导体元件和所述金属板之间的网状金属体以及嵌入所述网状金属体的接合构件。

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