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    • 11. 发明授权
    • Device and method for mounting electronic components
    • 用于安装电子元件的装置和方法
    • US08646174B2
    • 2014-02-11
    • US13381245
    • 2010-05-07
    • Kenichi KaidaHideki SumiMasahiro KiharaKenichirou IshimotoNoboru Higashi
    • Kenichi KaidaHideki SumiMasahiro KiharaKenichirou IshimotoNoboru Higashi
    • H05K3/30H05K3/20
    • H05K13/0452H01L23/552H01L25/50H01L2924/0002H05K13/0812Y10T29/49128Y10T29/4913Y10T29/49131Y10T29/53022H01L2924/00
    • An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing section 28d which determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item. In a mounting availability determining process, an availability of an execution of a mounting operation for the mounting object component is automatically determined based on preset failure patterns of the detection result.
    • 本发明的目的是提供一种电子部件安装方法,其中能够正确反映检查结果的适当部件安装工作,并且可以同时满足故障发生率的降低和工作效率的提高。 一种电子部件安装装置,其中检查板以检测故障项目的存在或不存在的外观检查部分以及将分配的安装对象部件传送并安装到检查结束的板的部件安装部分 一体地设置有基于故障项目的检测结果的安装可用性判定处理部28d,其确定安装对象部件的安装的动作的可行性。 在安装可用性确定过程中,基于检测结果的预设故障模式自动确定对安装对象部件的安装操作的执行的可用性。
    • 12. 发明授权
    • Method of inspecting mount state of component
    • 检查部件安装状态的方法
    • US08453526B2
    • 2013-06-04
    • US12599593
    • 2008-07-18
    • Kenichi KaidaNoboru Higashi
    • Kenichi KaidaNoboru Higashi
    • G01D3/08
    • H05K13/08
    • A mount state of components is inspected in a mounting apparatus 1b at total two divisions of a component mounting division b where the mounting apparatus 1b performs mounting and a component mounting division a where a mounting apparatus 1a disposed on an upstream side performs the mounting; the mount state of components is inspected in a mounting apparatus 1c at total three divisions of a component mounting division c where the mounting apparatus 1c performs the mounting and the component mounting divisions a and b where the mounting apparatus 1a and 1b disposed on the upstream side perform the mounting; and the mount state of components is inspected in a mounting apparatus 1d at total four divisions of a component mounting division d where the mounting apparatus 1d performs the mounting and the component mounting divisions a, b, and c where the mounting apparatus 1a, 1b, and 1c disposed on the upstream side perform the mounting. In this way, since a step in which abnormal mounting occurs can be easily specified and an effective solution can be established at a predetermined location or item, the abnormality can be easily solved.
    • 在安装设备1b中,安装设备1b执行安装的部件安装部分b和安装在上游侧的安装设备1a执行安装的部件安装部分a的组件安装部分b的总共两个部分检查部件的安装状态; 在安装设备1c执行安装的部件安装部分c和安装设备1a和1b配置在上游侧的部件安装部分a和b的组件安装部分c的总共三个部分,在安装设备1c中检查部件的安装状态 执行安装; 在安装装置1d进行安装的部件安装部d和安装装置1a,1b等的部件安装部a,b,c的总共四个部分的安装装置1d中检查部件的安装状态, 并且设置在上游侧的1c执行安装。 以这种方式,由于可以容易地指定发生异常安装的步骤,并且可以在预定位置或项目处建立有效的解决方案,所以可以容易地解决异常。
    • 13. 发明申请
    • COMPONENT MOUNT SYSTEM
    • 组件安装系统
    • US20110115899A1
    • 2011-05-19
    • US13002873
    • 2009-07-09
    • Kenichi KaidaNoboru HigashiKazuhide NagaoYoshiaki AwataHideki Sumi
    • Kenichi KaidaNoboru HigashiKazuhide NagaoYoshiaki AwataHideki Sumi
    • H04N7/18G06K9/00
    • H05K13/0486H05K13/081
    • A component mount system includes: a component placing unit; an inspection unit; a repair station; an image display device; a defective portion image display unit configured to display an image of a defective portion of a board on the image display device; an input device; and a repair required portion display unit configured to display a defective portion detected by the inspection unit, which is indicated as a true defective portion in a determination result input through the input device and selected from the defective portion detected by the inspection unit, as a repair required portion on the image display device. The image display device is provided at a location where an operator who performs a repair work can watch the image displayed on the image display device, and the input device is provided at a location where the operator can operate the input device.
    • 组件安装系统包括:组件放置单元; 检查单位; 维修站; 图像显示装置; 缺陷部分图像显示单元,被配置为在图像显示装置上显示板的缺陷部分的图像; 一个输入设备; 以及修理需要部分显示单元,被配置为显示由检查单元检测到的缺陷部分,其在通过输入设备输入的确定结果中被指示为真实缺陷部分,并且从由检查单元检测到的缺陷部分中选择为缺陷部分,作为 修复图像显示设备上的所需部分。 图像显示装置设置在执行维修工作的操作者可以观看图像显示装置上显示的图像的位置,并且输入装置设置在操作者可以操作输入装置的位置。
    • 14. 发明授权
    • Method for inspection of circuit boards and apparatus for inspection of circuit boards
    • 电路板检查方法和电路板检查装置
    • US06765667B2
    • 2004-07-20
    • US09916181
    • 2001-07-26
    • Noboru HigashiDaisuke NagaiKenichi Kaida
    • Noboru HigashiDaisuke NagaiKenichi Kaida
    • G01N2100
    • G01N21/956G01N2021/95638H05K13/08
    • A method for inspection of circuit boards is described which includes: a process of measuring surface-shape data of a circuit board on which inspection objects are placed; an approximated curved surface generation process for generating an approximated curved surface from the measured surface-shape data, which is an estimated surface-shape of the circuit board, on which no inspection object is placed; a process of subtracting said approximated curved surface from the measured surface-shape data; a region of interest determination process of determining regions which are different from the approximated curved surface in accordance with data obtained by said subtraction process; and a process of inspecting whether electronic parts placed on said circuit board and connecting materials for connecting the electronic parts are in a desired state or not.
    • 一种检测电路板的方法,其特征在于包括:测量放置有检查对象的电路板的表面形状数据的处理; 近似曲面生成处理,用于根据测量的表面形状数据生成近似曲面,该表面形状数据是电路板的估计表面形状,其上没有放置检查对象; 从所测量的表面形状数据中减去所述近似曲面的处理; 根据由所述减法处理获得的数据确定与近似曲面不同的区域的感兴趣区域确定过程; 以及检查放置在所述电路板上的电子部件和用于连接电子部件的连接材料是否处于期望状态的处理。
    • 15. 发明授权
    • Apparatus for the inspection of printed circuit boards on which
components have been mounted
    • 用于检查其上安装有部件的印刷电路板的装置
    • US5017864A
    • 1991-05-21
    • US369160
    • 1989-06-21
    • Kenichi KaidaOsamu YamadaEiji Okuda
    • Kenichi KaidaOsamu YamadaEiji Okuda
    • G01R31/309
    • G01R31/309
    • An inspection apparatus for inspecting printed circuit boards on which components have been mounted, wherein a light source that generates a light beam in a concentrated spot fashion is mounted on a rotary object and radiates the beam spot onto the printed circuit board at approximately right angles thereto while the rotary object is rotating, so that the surface of the printed circuit board is scanned by the beam spot. Changes of at least either one of the reflection angle and the intensity of the light reflected from the printed circuit board is detected by photoelectric converters provided on the rotary object, and at least either one of the height and the brightness of the position at which the beam spot and the printed circuit board are intersected is measured, thereby performing the inspection of the printed circuit board.
    • 一种用于检查其上安装有部件的印刷电路板的检查装置,其中以集中点形式产生光束的光源安装在旋转物体上,并将束斑以大致直角辐射到印刷电路板上 同时旋转物体旋转,使得印刷电路板的表面被光束点扫描。 从印刷电路板反射的光的反射角度和强度中的至少一方的变化被设置在旋转体上的光电转换器所检测,并且位置的高度和亮度中的至少一个 测量光斑和印刷电路板的相交,从而进行印刷电路板的检查。