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11. 发明申请

US20110306294A1 PORTABLE INFORMATION TERMINAL, PORTABLE INFORMATION SYSTEM, AND COMPUTER-READABLE STORAGE MEDIUM HAVING STORED THEREON PORTABLE INFORMATION TERMINAL CONTROL PROGRAM 有权
标题翻译：便携式信息终端，便携式信息系统和具有存储的便携式信息终端控制程序的计算机可读存储介质
公开(公告)号：US20110306294A1
公开(公告)日：2011-12-15
申请号：US12948050
申请日：2010-11-17
申请人： Masatoshi Yamazaki , Tooru Ooe , Masahiro Shoji , Hiroaki Adachi , Takashi Kubota
发明人： Masatoshi Yamazaki , Tooru Ooe , Masahiro Shoji , Hiroaki Adachi , Takashi Kubota
IPC分类号： H04B7/00 , H04B5/00
CPC分类号： H04W48/20 , H04L67/16 , H04L67/322 , H04L67/325 , H04L67/34 , H04L67/38 , H04W4/04 , H04W48/16 , Y02D70/00 , Y02D70/142 , Y02D70/166
摘要： When a portable information terminal operates in an unused state, a predetermined access point is searched for. As a result, when the predetermined access point is detected, a connection to the predetermined access point is established, and a predetermined data communication process is performed.
摘要翻译：当便携式信息终端在未使用状态下操作时，搜索预定接入点。结果，当检测到预定的接入点时，建立到预定接入点的连接，并执行预定的数据通信处理。

12. 外观设计

USD623292S1 Puncture adapter for a probe of an ultrasonic diagnosis apparatus 有权
标题翻译：用于超声诊断装置的探针的穿刺适配器
公开(公告)号：USD623292S1
公开(公告)日：2010-09-07
申请号：US29352306
申请日：2009-12-18
申请人： Takashi Kubota
设计人： Takashi Kubota

13. 发明授权

US07531904B2 Al-Ni-B alloy wiring material and element structure using the same 有权
标题翻译： Al-Ni-B合金布线材料及使用其的元件结构
公开(公告)号：US07531904B2
公开(公告)日：2009-05-12
申请号：US11666300
申请日：2006-03-30
申请人： Hironari Urabe , Yoshinori Matsuura , Takashi Kubota
发明人： Hironari Urabe , Yoshinori Matsuura , Takashi Kubota
IPC分类号： H01L23/48
CPC分类号： H01L29/458 , C22C21/00 , C22C21/10 , C23C14/3414 , H01L27/124 , H01L29/4908 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides Al-based wiring material that allows, in a display device including thin film transistors and transparent electrode layers, direct bonding to the transparent electrode layer made of ITO, IZO or the like as well as direct bonding to the semiconductor layer, such as n+-Si. The Al—Ni—B alloy wiring material according to the present invention is configured such that the nickel content X at %, the nickel atomic percent, and the boron content Y at %, the boron atomic percent, satisfy the following equations: 0.5≦X≦10.0, 0.05≦Y≦11.0, Y+0.25X≧1.0 and Y+1.15X≦11.5, and the remainder is aluminum.
摘要翻译：本发明提供了一种Al系布线材料，其在包括薄膜晶体管和透明电极层的显示装置中直接接合到由ITO，IZO等制成的透明电极层以及直接结合到半导体层，例如n + -Si。根据本发明的Al-Ni-B合金布线材料被配置为使得镍含量X at％，镍原子百分比和硼含量Y at％，硼原子百分比满足以下等式：0.5 < = X <= 10.0,0.05 <= Y <= 11.0，Y + 0.25X> = 1.0，Y + 1.15X <= 11.5，其余为铝。

14. 发明申请

US20090115577A1 RFID TAG 失效
标题翻译： RFID标签
公开(公告)号：US20090115577A1
公开(公告)日：2009-05-07
申请号：US12193364
申请日：2008-08-18
申请人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota , Hidehiko Kira
发明人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota , Hidehiko Kira
IPC分类号： H04Q5/22
CPC分类号： G06K19/07749 , G06K19/07728 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191
摘要： An RFID tag includes: a sheet-like base; an antenna provided on the base and extending along the base; a circuit chip mounted on the base and connected to the antenna for performing radio communication through the antenna; a protection body wider than the circuit chip and narrower than the antenna, which is located at least either above the circuit chip or on a backside of the circuit chip with the base interposed therebetween for protecting the circuit chip; and a connection section provided as a portion of the antenna at a location where an edge of the protection body and the antenna intersect with each other as viewed from a direction intersecting with a surface of the base, which includes one or more conductor patterns narrower than other portion of the antenna, and which connects inner and outer antenna portions of the edge with each other.
摘要翻译： RFID标签包括：片状基底; 设置在基座上并沿基座延伸的天线; 安装在基座上并连接到天线的电路芯片，用于通过天线进行无线电通信; 比电路芯片更宽的保护体，并且比天线窄，其位于电路芯片的上方或电路芯片的背面，其中插入基板，用于保护电路芯片; 以及连接部，其在从与所述基部的表面相交的方向观察时，在所述保护体和所述天线的边缘彼此相交的位置处设置为所述天线的一部分，所述方向包括一个或多个导体图案，所述导体图案比天线的其他部分，并且将边缘的内天线部分和外天线部分彼此连接。

15. 发明授权

US07507477B2 Conductive microparticle, process for producing the same and anisotropic conductive material 有权
标题翻译：导电微粒，其制造方法和各向异性导电材料
公开(公告)号：US07507477B2
公开(公告)日：2009-03-24
申请号：US11632148
申请日：2005-07-14
申请人： Takashi Kubota
发明人： Takashi Kubota
IPC分类号： B32B5/66
CPC分类号： H01R4/04 , B22F1/025 , B22F2998/00 , C23C18/1635 , C23C18/1651 , C23C18/36 , C23C18/50 , C23C18/54 , H01B1/02 , H01B1/023 , H01B1/22 , H05K3/323 , Y10T428/2982 , Y10T428/2991 , Y10T428/2993 , Y10T428/2995 , Y10T428/2996 , B22F2207/07
摘要： It is an object of the present invention to provide a conductive fine particle having excellent conductivity, furthermore high adhesiveness with a core particle and little cohesion, a method for producing the conductive fine particle where the plating bath is highly stable and an anisotropic conductive material using the conductive fine particle.The present invention is a conductive fine particle, wherein an alloy plated coating film containing nickel, copper and phosphorous is formed on a surface of a core particle by an electroless plating method; preferably the conductive fine particle, wherein a content of phosphorous in the alloy plated coating film in a direction of a thickness is lower on a surface side of the alloy plated coating film than on a core particle side; a method for producing the conductive fine particle, wherein a first electroless plating reaction is carried out by adding a plating solution containing a nickel salt, a phosphorous reducing agent and a pH adjustor to an aqueous suspension of the core particles supporting a metal catalyst, and then, a second electroless plating reaction is carried out by adding a plating solution containing the nickel salt, a copper salt, the phosphorous based reducing agent and the pH adjustor.
摘要翻译：本发明的目的是提供一种导电性优良的导电性细颗粒，与芯颗粒的粘合性高，凝聚力小，电镀液高度稳定的导电性微粒的制造方法以及使用了各向异性导电材料的方法导电细粒。本发明是一种导电性细颗粒，其中通过化学镀方法在芯颗粒的表面上形成含有镍，铜和磷的合金镀覆膜; 优选所述导电性微粒，其中，所述合金镀覆膜中的厚度方向的磷的含量比所述合金镀覆膜的表面侧比所述芯粒子侧低。一种导电性微粒的制造方法，其中，通过将含有镍盐，磷还原剂和pH调节剂的电镀溶液添加到负载金属催化剂的核粒子的水性悬浮液中，进行第一无电镀电镀反应，以及然后，通过加入含有镍盐，铜盐，磷系还原剂和pH调节剂的电镀液进行第二无电镀反应。

16. 发明申请

US20070184582A1 Method of flip-chip mounting 有权
标题翻译：倒装芯片安装方法
公开(公告)号：US20070184582A1
公开(公告)日：2007-08-09
申请号：US11435851
申请日：2006-05-18
申请人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
发明人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
IPC分类号： H01L21/00
CPC分类号： H01L24/75 , H01L24/83 , H01L24/90 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75304 , H01L2224/75744 , H01L2224/83139 , H01L2224/8314 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/3511 , H01L2924/00
摘要： A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.
摘要翻译：一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合，基板向凹部弯曲。

17. 发明申请

US20070102289A1 Sputtering target material 审中-公开
标题翻译：溅射靶材
公开(公告)号：US20070102289A1
公开(公告)日：2007-05-10
申请号：US10580222
申请日：2005-07-08
申请人： Kazuteru Kato , Takashi Kubota , Hiroshi Kimura , Yoshinori Matsuura , Kenji Matsuzaki
发明人： Kazuteru Kato , Takashi Kubota , Hiroshi Kimura , Yoshinori Matsuura , Kenji Matsuzaki
IPC分类号： C23C14/00
CPC分类号： C23C14/3414
摘要： The provided is a sputtering target material that is made not to cause an arcing phenomenon and splash phenomenon at the time of sputtering as completely as possible. A portion to be used for sputtering of the sputtering target material is subjected to a friction stir processing. Even with a sputtering target material made of a carbon-containing aluminum alloy or a large-sized sputtering target material, the arcing phenomenon and the splash phenomenon at the time of sputtering can be certainly suppressed.
摘要翻译：所提供的是溅射靶材料，其在溅射时不会引起电弧现象和飞溅现象，尽可能完全。用于溅射靶材料溅射的部分进行摩擦搅拌处理。即使使用由含碳铝合金或大尺寸溅射靶材料制成的溅射靶材料，也可以确实地抑制溅射时的电弧现象和飞溅现象。

18. 发明授权

US06592812B1 Aluminum alloy thin film target material and method for forming thin film using the same 失效
标题翻译：铝合金薄膜靶材及使用其形成薄膜的方法
公开(公告)号：US06592812B1
公开(公告)日：2003-07-15
申请号：US09787434
申请日：2001-03-26
申请人： Takashi Kubota , Hiroshi Watanabe
发明人： Takashi Kubota , Hiroshi Watanabe
IPC分类号： C22C2106
CPC分类号： C23C14/3414 , C22C21/06 , C23C14/14
摘要： The present invention provides a heat-resistant and low-electric-resistance aluminum alloy thin film which, even after heat treatment at 300-400° C., exhibits no hillock generation and has a specific resistance of 7 &mgr;&OHgr;·cm or less and also provides a sputtering target material employed for forming such aluminum alloy thin film. The thin film of aluminum alloy of the present invention contains, as components of the alloy, aluminum, carbon, and magnesium, wherein the carbon content and the magnesium content fall within a region defined by the following formulas: X=0.61; X=8; Y=2; and Y=−0.13X+1.3, wherein Y (at %) represents the carbon content by atomic percent and X (at %) represents the magnesium content by atomic percent, and the balance of (X+Y) contains aluminum and unavoidable impurities. The sputtering target material of the present invention for forming thin film of aluminum alloy, containing, as components of the material, aluminum, carbon, magnesium, and unavoidable impurities, wherein the carbon content and the magnesium content fall within a region defined by the aforementioned formulas, and the balance of (X+Y) is aluminum and unavoidable impurities.
摘要翻译：本发明提供一种耐热低电阻铝合金薄膜，即使在300-400℃热处理后，也不发生小丘产生，电阻率为7μΩEG·cm以下，提供了用于形成这种铝合金薄膜的溅射靶材料。本发明的铝合金薄膜作为合金成分，含有铝，碳，镁，其中碳含量和镁含量在下述式所定义的范围内：其中Y（at％）表示碳原子百分比和X（原子％）表示原子百分比的镁含量，（X + Y）的余量包含铝和不可避免的杂质。本发明的用于形成铝合金薄膜的溅射靶材料，其含有作为材料成分的铝，碳，镁和不可避免的杂质，其中碳含量和镁含量落入由上述式中，（X + Y）的平衡是铝和不可避免的杂质。

19. 发明授权

US4737415A Magnetic recording medium and production thereof 失效
标题翻译：磁记录介质及其制造
公开(公告)号：US4737415A
公开(公告)日：1988-04-12
申请号：US800144
申请日：1985-11-20
申请人： Minoru Ichijo , Tsunemi Ohiwa , Fumio Kokai , Takashi Kubota , Kunio Wakai
发明人： Minoru Ichijo , Tsunemi Ohiwa , Fumio Kokai , Takashi Kubota , Kunio Wakai
IPC分类号： G11B5/72 , G11B5/84 , G11B5/71
CPC分类号： G11B5/722 , G11B5/84 , Y10S428/90 , Y10T428/31663
摘要： A magnetic recording medium comprising a substrate, a magnetic layer and a protective layer which consists of an organic polymeric material comprising carbon atoms, hydrogen atoms and oxygen atoms, the content of the oxygen atoms increasing towards the outer surface of the protective layer, which has improved durability and corrosion resistance.
摘要翻译：一种磁记录介质，包括由包含碳原子，氢原子和氧原子的有机聚合材料组成的衬底，磁性层和保护层，氧原子的含量朝向保护层的外表面增加，其具有提高耐久性和耐腐蚀性。

20. 发明授权

US4086093A Dry planographic printing plate 失效
标题翻译：干版印刷版
公开(公告)号：US4086093A
公开(公告)日：1978-04-25
申请号：US713576
申请日：1976-08-11
申请人： Yuh Ezumi , Masaharu Kobayashi , Takashi Kubota , Yoichi Shimokawa
发明人： Yuh Ezumi , Masaharu Kobayashi , Takashi Kubota , Yoichi Shimokawa
IPC分类号： G03F7/075
CPC分类号： G03F7/0752 , Y10S430/136
摘要： A laminated negative acting presensitized planographic printing plate for use in dry planography having(a) a base layer.(b) a silicone rubber layer overlying the base layer, and(c) a photoadhesive layer overlying the silicone rubber layer comprising at least one photopolymerizable unsaturated compound having a boiling point above 100.degree. C and a photoinitiator.Under exposure to light through a negative transparency, the photoadhesive layer polymerizes in the exposed image area and adheres to the underlying silicone rubber layer, while remaining non-adhesive to the underlying silicone rubber layer in the unexposed non-image area.The unexposed photoadhesive layer only is removed to bare the underlying silicone rubber layer which is made an ink-repellent non-image area and the photoadhesive layer remaining in the exposed area is made an ink-receptive image area.The surface of the photoadhesive layer accepts ink from inking rollers, while the silicone rubber background area will not remove ink from the rollers and thus remains ink free.
摘要翻译：一种用于干平面图的层压负性预觉平版印刷版，具有（A）基层。

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