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11. 发明授权

US5365402A Cooling apparatus of electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5365402A
公开(公告)日：1994-11-15
申请号：US800268
申请日：1991-11-29
申请人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
发明人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
IPC分类号： H01L23/36 , H01L23/367 , H01L23/40 , H01L23/433 , H05K7/20
CPC分类号： H01L23/433 , H01L23/3677 , H01L23/4006 , H01L2023/405 , H01L2224/32188 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195
摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.
摘要翻译：一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

12. 发明授权

US5646824A Electronic equipment and lap-top type electronic equipment 失效
标题翻译：电子设备和膝上型电子设备
公开(公告)号：US5646824A
公开(公告)日：1997-07-08
申请号：US489623
申请日：1995-06-12
申请人： Shigeo Ohashi , Toshio Hatada , Takeo Tanaka , Susumu Iwai
发明人： Shigeo Ohashi , Toshio Hatada , Takeo Tanaka , Susumu Iwai
IPC分类号： F28D15/02 , G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , F28D15/00 , F28D15/0266 , H01L23/473 , G06F2200/201 , H01L2924/0002
摘要： A flat shaped header having a heat receiving side is attached to a semiconductor element mounted on a circuit board. The header having the heat receiving side is connected to another header having a heat receiving side attached to a plurality of heat radiating fins so as to form a heat exchanging radiator which heat radiating fins are installed at a peripheral portion of a body of electronic equipment. The heat generated by the semiconductor element is transmitted by liquid moving between the headers via flexible tubes and then to the heat radiating fins, which heat is discharged outside of the body of equipment. Since the flat shaped header and the flexible tubes are employed, a high heat generating semiconductor element and the heat radiating fins are thermally connected with ease without being influenced by the configurational condition in the equipment even when many semiconductor elements are mounted inside a small space.
摘要翻译：具有热接收侧的扁平头部安装在安装在电路板上的半导体元件上。具有热接收侧的集管连接到具有附接到多个散热片的热接收侧的另一个集管，以形成散热片安装在电子设备主体的周边部分的散热片。由半导体元件产生的热量通过液体通过柔性管在集管之间移动，然后传递到散热片，热量被排放到设备本体外部。由于使用扁平形的集管和柔性管，因此即使在许多半导体元件安装在小空间内的情况下，高发热半导体元件和散热片也容易热连接而不受设备的结构条件的影响。

13. 发明授权

US08937390B2 Semiconductor device having a liquid cooling module 有权
标题翻译：具有液体冷却模块的半导体装置
公开(公告)号：US08937390B2
公开(公告)日：2015-01-20
申请号：US14199078
申请日：2014-03-06
申请人： Nae Hisano , Shigeo Ohashi , Yasuo Osone , Yasuhiro Naka , Hiroyuki Tenmei , Kunihiko Nishi , Hiroaki Ikeda , Masakazu Ishino , Hideharu Miyake , Shiro Uchiyama
发明人： Nae Hisano , Shigeo Ohashi , Yasuo Osone , Yasuhiro Naka , Hiroyuki Tenmei , Kunihiko Nishi , Hiroaki Ikeda , Masakazu Ishino , Hideharu Miyake , Shiro Uchiyama
IPC分类号： H01L23/48 , H01L23/02 , H01L23/00 , H01L23/31 , H01L23/473 , H01L23/34
CPC分类号： H01L24/14 , H01L23/3128 , H01L23/34 , H01L23/473 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06565 , H01L2924/1461 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/18161 , H01L2924/00
摘要： A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.
摘要翻译：半导体器件包括安装基板，设置在所述安装基板上方的半导体元件，设置在所述安装基板上方的封装基板，其间具有所述半导体元件，并通过主连接凸块与所述半导体元件电连接;冷却所述半导体液体制冷剂的热接收部分设置在所述半导体元件和所述安装基板之间，以及设置在所述封装基板和所述安装基板之间的多个次级连接凸块。

14. 发明申请

US20110050654A1 LIQUID CRYSTAL DISPLAY APPARATUS AND BACK LIGHT APPARATUS 审中-公开
标题翻译：液晶显示装置和背光装置
公开(公告)号：US20110050654A1
公开(公告)日：2011-03-03
申请号：US12788019
申请日：2010-05-26
申请人： Toshihiro Tsutsui , Hidenao Kubota , Shigeo Ohashi , Koichi Sakita , Katsuki Ochiai
发明人： Toshihiro Tsutsui , Hidenao Kubota , Shigeo Ohashi , Koichi Sakita , Katsuki Ochiai
IPC分类号： G06F3/038
CPC分类号： G02B6/0078 , G02B6/0046 , G02B6/0055 , G02B6/0068 , G02B6/0073 , G02B6/0083 , G02B6/0085 , G02F1/133603 , G02F2001/133628 , H01L33/644 , H05K1/0203 , H05K1/181 , H05K2201/10106 , H05K2201/10545
摘要： A backlight apparatus includes a plurality of LEDs as light-sources, a plurality of light-guiding plates, lights from the LEDs being made incident into the light-guiding plates, the incident lights being then converted into a surface-like light, and being guided onto the liquid-crystal panel side by the light-guiding plates, a plurality of LED drivers for supplying currents to the plurality of LEDs, and a plurality of LED driving boards on which the plurality of LEDs and LED drivers are implemented, wherein the plurality of LEDs are implemented on one surface of each LED driving board, and each light-guiding plate is also provided thereon, each of the LED drivers being implemented on the other surface of each LED driving board.
摘要翻译：背光装置包括作为光源的多个LED，多个导光板，来自LED的光入射到导光板中，然后将入射光转换成表面状光，并且通过导光板引导到液晶面板侧，用于向多个LED供电的多个LED驱动器和多个LED驱动板，多个LED驱动板和LED驱动器在其上被实现，其中，在每个LED驱动板的一个表面上实现多个LED，并且每个导光板也设置在其上，每个LED驱动器被实施在每个LED驱动板的另一个表面上。

15. 发明授权

US07210789B2 Liquid crystal display device and liquid crystal cooling unit 有权
标题翻译：液晶显示装置和液晶冷却装置
公开(公告)号：US07210789B2
公开(公告)日：2007-05-01
申请号：US10919289
申请日：2004-08-17
申请人： Masakazu Hoshino , Shigeo Ohashi , Tatsuo Morita , Katsuyuki Watanabe
发明人： Masakazu Hoshino , Shigeo Ohashi , Tatsuo Morita , Katsuyuki Watanabe
IPC分类号： G03B21/16 , G03B21/18 , G03B21/26
CPC分类号： G02F1/133385
摘要： A liquid crystal display device in which light from a light source enters a liquid crystal panel and exits therefrom for projection of an image and includes a heat conducting member and a cooling unit. The heat conducting member is contacted with at least one of a light incident surface and a light outgoing surface of the liquid crystal panel, is light-transmissive, and has a larger area than a light transmitting area of the liquid crystal panel. The cooling jacket, which comprises a flow channel for a cooling medium in its inside, is provided around the heat conducting member so that the flow channel exists only outside of the light transmitting area in a surface direction of the liquid crystal panel.
摘要翻译：一种液晶显示装置，其中来自光源的光进入液晶面板并从其中离开以投影图像，并且包括导热构件和冷却单元。导热构件与液晶面板的光入射面和光出射面中的至少一个接触是透光性的，并且具有比液晶面板的透光面积大的面积。在导热构件周围设置有包括用于其内部的冷却介质的流路的冷却套，使得流路仅在液晶面板的表面方向上存在于透光区域的外侧。

16. 发明申请

US20060185826A1 Liquid cooling system 有权
标题翻译：液体冷却系统
公开(公告)号：US20060185826A1
公开(公告)日：2006-08-24
申请号：US11288097
申请日：2005-11-29
申请人： Shigeo Ohashi
发明人： Shigeo Ohashi
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： For providing a liquid cooling system for an electronic apparatus having a heat-generating element within a housing thereof, enabling small-sizes thereof and being effective for lowering noises when the apparatus is operated, equipped with a new type of a driving means for a liquid coolant therein, comprises a heat-receiving jacket 100 for transferring heat generated from the heat-generating element to a liquid coolant, to evaporate it, within an inside thereof; a radiator 200 for guiding the evaporated coolant supplied from the heat-receiving jacket into an inside thereof, so as to cool it to be liquefied; and a driving means 300 for applying driving force for circulating the liquid coolant, through repetition of heating and cooling upon a portion of the liquefied liquid coolant supplied from the radiator, while restricting a flow direction of the liquid coolant within an inside thereof into one direction, whereby circulating said liquid coolant within a circulation loop including the heat-receiving jacket, the radiator, and the driving means.
摘要翻译：为了提供一种用于具有在其壳体内的发热元件的电子设备的液体冷却系统，能够使其小型化并且在设备运行时有效地降低噪声，配备有新型的用于液体的驱动装置冷却剂包括：热接收套管100，用于将发热元件产生的热量传递到液体冷却剂，以使其在其内部蒸发; 散热器200，用于将从受热套管供给的蒸发的冷却剂引导到其内部，以使其冷却以液化; 以及驱动装置300，用于施加用于使液体冷却剂循环的驱动力，通过对从散热器供应的液化冷却剂的一部分重复进行加热和冷却，同时将其内部的液体冷却剂的流动方向限制在一个方向使循环回路中的液体冷却剂循环，该循环回路包括受热套，散热器和驱动装置。

17. 发明申请

US20050213018A1 Liquid crystal display device and liquid crystal cooling unit 有权
标题翻译：液晶显示装置和液晶冷却装置
公开(公告)号：US20050213018A1
公开(公告)日：2005-09-29
申请号：US10919289
申请日：2004-08-17
申请人： Masakazu Hoshino , Shigeo Ohashi , Tatsuo Morita , Katsuyuki Watanabe
发明人： Masakazu Hoshino , Shigeo Ohashi , Tatsuo Morita , Katsuyuki Watanabe
IPC分类号： G02F1/13 , G02F1/133 , G02F1/1333 , G03B21/00 , G03B21/16 , H05K7/20
CPC分类号： G02F1/133385
摘要： The present invention provides a liquid crystal display device and a liquid crystal cooling unit, which are reduced in noise and have high cooling capability, and in which air is not directly blown on a liquid crystal panel module or a polarizing plate. A cooling jacket having an internal flow channel is formed by being adhered to a periphery of a light-transmissive, highly heat-conducting sapphire plate larger than a light transmitting area to which a polarizing film is applied or attached, by means of a highly heat-conducting adhesive. A liquid crystal cooling unit is formed by clamping the liquid crystal panel module by inserting a light-transmissive, highly heat-conducting substance. Further, the liquid crystal panel module and the polarizing film are cooled by circulating a cooling medium in the internal flow channel of the cooling jacket.
摘要翻译：本发明提供了一种液晶显示装置和液晶冷却装置，其噪声降低并且具有高冷却能力，并且其中空气不直接吹在液晶面板模块或偏振板上。具有内部流动通道的冷却套管通过粘附到透光性高的导热蓝宝石板的周边上，该蓝宝石板大于通过高度热量施加或附着偏光膜的透光区域导电胶。通过插入透光性高导热性物质来夹持液晶面板模块来形成液晶冷却单元。此外，通过在冷却套的内部流路中循环冷却介质来冷却液晶面板模块和偏振膜。

18. 发明授权

US06885556B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US06885556B2
公开(公告)日：2005-04-26
申请号：US10874232
申请日：2004-06-24
申请人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
发明人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
IPC分类号： G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.
摘要翻译：一种电子设备，包括在其内部安装半导体元件的壳体，与半导体元件热连接的受热部件，设置在壳体的内侧表面上的散热部件和用于驱动液体的液体驱动器散热构件和受热构件之间的冷却剂。该装置还包括储存有至少预定体积的冷却剂的液体冷却剂的罐，以限定罐内的冷却剂表面，其中罐，散热构件和受热构件与管连接，连接到罐中的吸入管的吸入端部位于始终低于冷却剂表面的位置，而与罐的位置的变化无关。

19. 发明授权

US06847113B2 Electronic apparatus with plate-like member having plural recesses containing heat accumulating material 失效
标题翻译：具有板状构件的电子设备具有包含蓄热材料的多个凹部
公开(公告)号：US06847113B2
公开(公告)日：2005-01-25
申请号：US10419943
申请日：2003-04-22
申请人： Masato Nakanishi , Shigeo Ohashi , Shigeki Hirasawa
发明人： Masato Nakanishi , Shigeo Ohashi , Shigeki Hirasawa
IPC分类号： H05K7/20 , H01L23/34 , H01L23/36 , H01L23/427
CPC分类号： H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus, including a plate-like member, enclosing a heat-accumulating material of latent heat type within an inside thereof; a semiconductor element, being connected with the member, thermally; and a housing covering the semiconductor element and the member. A surface of the member, in contact with the semiconductor element, is provided with recess-portions in plural numbers thereof, each being recessed in a direction of the heat-accumulating material of latent heat type, so as to enclose the heat-accumulating material of latent heat type into the recess portions. The plate-like member and the housing are connected with each other, thermally, thereby providing a cooling device, being able to cool the electronic circuit component(s) building up the electronic apparatus, as well as being superior in operability.
摘要翻译：一种包括板状构件的电子设备，其内部包围有潜热型蓄热材料; 与该构件连接的半导体元件; 以及覆盖半导体元件和构件的壳体。与半导体元件接触的构件的表面设置有多个凹部，每个凹部沿着潜热型蓄热材料的方向凹陷，以包围蓄热材料潜热型进入凹部。板状构件和壳体彼此热连接，从而提供冷却装置，能够冷却构成电子设备的电子电路部件，并且具有优异的可操作性。

20. 发明授权

US06430042B1 Electronic apparatus having means for cooling a semiconductor element mounted therein 有权
标题翻译：具有用于冷却安装在其中的半导体元件的装置的电子设备
公开(公告)号：US06430042B1
公开(公告)日：2002-08-06
申请号：US09653584
申请日：2000-08-31
申请人： Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Tsuyoshi Nakagawa
发明人： Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Tsuyoshi Nakagawa
IPC分类号： H05K720
CPC分类号： G06F1/203 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus comprises a semiconductor element mounted inside a housing, a keyboard fitted to the housing, a heat radiating member provided on one face of the semiconductor element and a thermal conductive duct provided on the other face of the element. The electronic apparatus further comprises a wall thermally connecting an upper wall and a lower wall of the duct. The duct is provided with a fan.
摘要翻译：电子设备包括安装在壳体内的半导体元件，装配到壳体的键盘，设置在半导体元件的一个面上的散热构件和设置在元件的另一个面上的导热管。电子设备还包括热连接管道的上壁和下壁的壁。管道设有风扇。

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