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    • 17. 发明申请
    • SITE FLATTENING TOOL AND METHOD FOR CIRCUIT BOARD REPAIR
    • 用于电路板维修的现场平铺工具和方法
    • US20060163330A1
    • 2006-07-27
    • US10905919
    • 2005-01-26
    • Brian ChapmanJames PetroneNandakumar Ranadive
    • Brian ChapmanJames PetroneNandakumar Ranadive
    • B23K31/02
    • H05K3/225H05K2203/0195H05K2203/0278H05K2203/1105
    • Disclosed are a tool and a procedure for flattening a site on a printed circuit board. The tool comprises three sections: a nozzle, a throat and a flattening block. The nozzle connects the tool to a hot air source and receives hot air from said source, and the throat is connected to the nozzle section for receiving the hot air from the nozzle section. The flattening block has a generally planar bottom surface for engaging a site on a printed circuit board. The flattening block forms a vent for venting the hot air from the flattening block to the ambient to help maintain said site at an approximately constant temperature when said bottom surface engages said site. A resilient mechanism is mounted on the throat section, for forcing said bottom surface against said site, with a constant, known force.
    • 公开了用于使印刷电路板上的部位平坦化的工具和程序。 该工具包括三个部分:喷嘴,喉部和扁平块。 喷嘴将工具连接到热空气源并且从所述源接收热空气,并且喉部连接到喷嘴部分以从喷嘴部分接收热空气。 平整块具有用于接合印刷电路板上的位置的大致平坦的底表面。 平坦块形成用于将热空气从平坦块排放到周围的通风口,以在所述底表面接合所述位置时帮助将所述位置维持在近似恒定的温度。 弹性机构安装在喉部,用于以恒定的已知力将所述底面强制抵靠所述部位。