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11. 发明授权

US6005292A Lead-free interconnection for electronic devices 有权
公开(公告)号：US6005292A
公开(公告)日：1999-12-21
申请号：US135415
申请日：1998-08-14
申请人： Judith Marie Roldan , Ravi F. Saraf
发明人： Judith Marie Roldan , Ravi F. Saraf
IPC分类号： H01L21/60 , H01L23/485 , H05K3/32 , H01L23/538
CPC分类号： H05K3/321 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/83 , H01L2224/11 , H01L2224/11505 , H01L2224/13 , H01L2224/13099 , H01L2224/16058 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/81191 , H01L2224/81193 , H01L2224/8319 , H01L2224/838 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H05K2201/0129 , H05K2201/0379 , H05K2201/10674 , H05K2201/10984 , H05K2203/0783 , H05K2203/176
摘要： An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles based on the total volume of the metal particles and the thermoplastic polymer. The present invention is also directed to a method of making electrical interconnections to an electronic device by pressing a plurality of composite bumps of a polymeric based material against a substrate having an electrically conductive surface by mechanical means under a sufficient temperature and/or a sufficient pressure. The present invention is further directed to a method of debonding an electronic device bonded by a composite binder by first providing an electronic device that is bonded by composite bumps consists of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles and then exposing the composite bumps to a solvent or to a temperature not less than about 50%.degree. C. below the glass transition temperature of the composite bump.

12. 发明授权

US5985458A Housing for electromagnetic interference shielding 失效
标题翻译：外壳用于电磁干扰屏蔽
公开(公告)号：US5985458A
公开(公告)日：1999-11-16
申请号：US928464
申请日：1997-09-12
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , B32B15/08
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.
摘要翻译：提供含有聚合物基质和导电填料组分的组合物。导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔，及其混合物，及其共聚物。本发明的组合物可用作金属基材的防腐层，用于静电放电保护，电磁干扰屏蔽，以及作为焊接互连替代物的互连技术的粘合剂。此外，聚苯胺的膜可用作具有或不具有导电金属颗粒的防腐蚀层。

13. 发明授权

US5854514A Lead-free interconnection for electronic devices 失效
公开(公告)号：US5854514A
公开(公告)日：1998-12-29
申请号：US693923
申请日：1996-08-05
申请人： Judith Marie Roldan , Ravi F. Saraf
发明人： Judith Marie Roldan , Ravi F. Saraf
IPC分类号： H01L21/60 , H01L23/485 , H05K3/32 , H01L23/48
CPC分类号： H05K3/321 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/83 , H01L2224/11 , H01L2224/11505 , H01L2224/13 , H01L2224/13099 , H01L2224/16058 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/81191 , H01L2224/81193 , H01L2224/8319 , H01L2224/838 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H05K2201/0129 , H05K2201/0379 , H05K2201/10674 , H05K2201/10984 , H05K2203/0783 , H05K2203/176
摘要： An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles based on the total volume of the metal particles and the thermoplastic polymer. The present invention is also directed to a method of making electrical interconnections to an electronic device by pressing a plurality of composite bumps of a polymeric based material against a substrate having an electrically conductive surface by mechanical means under a sufficient temperature and/or a sufficient pressure. The present invention is further directed to a method of debonding an electronic device bonded by a composite binder by first providing an electronic device that is bonded by composite bumps consists of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles and then exposing the composite bumps to a solvent or to a temperature not less than about 50% .degree. C. below the glass transition temperature of the composite bump.

14. 发明授权

US5776587A Electronic package comprising a substrate and a semiconductor device bonded thereto 失效
标题翻译：电子封装，包括衬底和与其结合的半导体器件
公开(公告)号：US5776587A
公开(公告)日：1998-07-07
申请号：US928497
申请日：1997-09-12
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , B32B9/00 , H01B1/06
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. The compositions of the present invention are useful as adhesives for interconnecting a semiconductor chip to a substrate.
摘要翻译：提供含有聚合物基质和导电填料组分的组合物。导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔及其混合物，及其共聚物。本发明的组合物可用作将半导体芯片与衬底互连的粘合剂。

15. 发明授权

US5922466A Composite comprising a metal substrate and a corrosion protecting layer 失效
标题翻译：复合材料包括金属基底和腐蚀保护层
公开(公告)号：US5922466A
公开(公告)日：1999-07-13
申请号：US928468
申请日：1997-09-12
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , B32B15/08
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： A composite comprising a metal substrate and as a corrosion protecting layer on at least one major surface of said substrate, a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles.
摘要翻译：一种复合材料，其包含金属基材和作为所述基材的至少一个主表面上的腐蚀保护层，包含热固性或热塑性聚合物基质的组合物和导电填料组分，其中所述填料组分包含导电颗粒。

16. 发明授权

US5916486A Method for providing discharge protection or shielding 失效
标题翻译：提供放电保护或屏蔽的方法
公开(公告)号：US5916486A
公开(公告)日：1999-06-29
申请号：US928496
申请日：1997-09-12
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , B05D5/12 , B29D9/00
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： Electrostatic discharge protection and electromagnetic interference shielding is provided by applying to a dielectric substrate a composition comprising a polymeric matrix and a conductive filler component. The conductive filler component comprises electrically conductive metal particles and at least one electrically conducting polymer.
摘要翻译：通过向电介质基片施加包含聚合物基质和导电填料组分的组合物来提供静电放电保护和电磁干扰屏蔽。导电填料组分包括导电金属颗粒和至少一种导电聚合物。

17. 发明授权

US5866044A Lead free conductive composites for electrical interconnections 失效
标题翻译：无铅导电复合材料用于电气互连
公开(公告)号：US5866044A
公开(公告)日：1999-02-02
申请号：US734492
申请日：1996-10-21
申请人： Ravi F. Saraf , Judith Marie Roldan , Michael Anthony Gaynes , Richard Benton Booth , Steven Paul Ostrander , Emanuel I. Cooper , Carlos J. Sambucetti
发明人： Ravi F. Saraf , Judith Marie Roldan , Michael Anthony Gaynes , Richard Benton Booth , Steven Paul Ostrander , Emanuel I. Cooper , Carlos J. Sambucetti
IPC分类号： H01B1/22 , H01L21/60 , H01L23/498 , H05K3/32 , H05K3/46 , H01B1/12
CPC分类号： H01L24/81 , H01B1/22 , H01L23/49883 , H05K3/321 , H01L2224/13009 , H01L2224/81801 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K2201/0129 , H05K2201/0133 , H05K2201/0162 , H05K2203/0783 , H05K3/4614 , H05K3/4632
摘要： An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
摘要翻译：公开了一种包括热塑性聚合物，导电金属粉末和有机溶剂系统的导电浆料。本发明还包括一种包含上述热塑性和金属的导电复合材料，其中基于复合材料的总体积，金属占体积的至少约30体积％。复合材料由高温下的糊料形成。该糊剂用于涉及将糊料转化为复合材料的工艺条件下的电气和电子部件电连接的工艺。

18. 发明授权

US5700398A Composition containing a polymer and conductive filler and use thereof 失效
标题翻译：含有聚合物和导电填料的组合物及其用途
公开(公告)号：US5700398A
公开(公告)日：1997-12-23
申请号：US356026
申请日：1994-12-14
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , H01B1/06
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.
摘要翻译：提供含有聚合物基质和导电填料组分的组合物。导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔，及其混合物，及其共聚物。本发明的组合物可用作金属基材的防腐层，用于静电放电保护，电磁干扰屏蔽，以及作为焊接互连替代物的互连技术的粘合剂。此外，聚苯胺的膜可用作具有或不具有导电金属颗粒的防腐蚀层。

19. 发明申请

US20090304908A1 Methods of fabricating plasticized, antiplasticized and crystalline conducting polymers and precursors thereof 有权
标题翻译：制造增塑的，抗增塑的和结晶的导电聚合物及其前体的方法
公开(公告)号：US20090304908A1
公开(公告)日：2009-12-10
申请号：US12583030
申请日：2009-08-12
申请人： Marie Angelopoulos , Yun-Hsin Liao , Ravi F. Saraf
发明人： Marie Angelopoulos , Yun-Hsin Liao , Ravi F. Saraf
IPC分类号： B05D5/12 , H01B1/12
CPC分类号： H01B1/128
摘要： Methods of forming materials containing precursors to electrically conductive polymers and electrically conductive polymers are described which have a high degree of crystallinity. The high degree of crystallinity is achieved by preparing the materials under conditions which provide a high degree of mobility to the polymer molecules permitting them to associate with one another to form a crystalline state. High levels of electrical conductivity are achieved in in the electrically conductive materials without stretch orienting the material. The enhanced electrical conductivity is isotropic as compared to a stretch oriented film which has isotropic electrical conductivity. In the preferred embodiment, additives are added to a solution containing a solvent and the precursor or electrically conductive polymer. The additives are preferably plasticizer of diluents. As the solvent is removed the material dries and contains a higher degree of crystallinity than in the absence of the additive.
摘要翻译：描述了形成具有高结晶度的导电聚合物和导电聚合物前体的材料的方法。通过在允许它们彼此结合以形成结晶状态的聚合物分子提供高度迁移率的条件下制备材料来实现高结晶度。在导电材料中实现高水平的导电性而不使材料拉伸定向。与具有各向同性电导率的拉伸取向膜相比，增强的导电性是各向同性的。在优选的实施方案中，将添加剂加入到含有溶剂和前体或导电聚合物的溶液中。添加剂优选稀释剂的增塑剂。当除去溶剂时，与没有添加剂相比，材料干燥并含有更高的结晶度。

20. 发明申请

US20090032775A1 POLYCRYSTALLINE CONDUCTING POLYMERS AND PRECURSORS THEREOF HAVING ADJUSTABLE MORPHOLOGY AND PROPERTIES 审中-公开
标题翻译：具有可调节形态和性质的多晶硅导电聚合物及其前驱体
公开(公告)号：US20090032775A1
公开(公告)日：2009-02-05
申请号：US12137646
申请日：2008-06-12
申请人： Marie Angelopoulos , Yun-Hsin Liao , Ravi F. Saraf
发明人： Marie Angelopoulos , Yun-Hsin Liao , Ravi F. Saraf
IPC分类号： H01B1/12 , C08K5/09 , C08K5/10 , C08K5/5317
CPC分类号： C08G61/12 , H01B1/128 , Y10T428/249958
摘要： Polycrystalline materials containing crystallies of precursors to electrically conductive polymers and electrically conductive polymers are described which have an adjustable high degree of crystallinity. The intersticial regions between the crystallites contains amorphous material containing precursors to electrically conductive polymers and/or electrically conductive polymers. The degree of crystallinity is achieved by preparing the materials under conditions which provide a high degree of mobility to the polymer molecules permitting them to associate with one another to form a crystalline state. This is preferable achieved by including additives, such as plasticizers and diluents, to the solution from which the polycrystalline material is formed. The morphology of the polycrystalline material is adjustable to modify the properties of the material such as the degree of crystallinity, crystal grain size, glass transition temperature, thermal coefficient of expansion and degree of electrical conductivity. High levels of electrical conductivity are achieved in in the electrically conductive polycrystalline materials without stretch orienting the material. The enhanced electrical conductivity is isotropic as compared to a stretch oriented film which has isotropic electrical conductivity.
摘要翻译：描述了具有可调节高结晶度的导电聚合物和导电聚合物的前体结晶的多晶材料。微晶之间的区域包含含有导电聚合物和/或导电聚合物的前体的无定形材料。通过在允许它们彼此结合以形成结晶状态的聚合物分子提供高度迁移率的条件下制备材料来实现结晶度。优选通过将诸如增塑剂和稀释剂的添加剂添加到形成多晶材料的溶液中来实现。可以调节多晶材料的形态，以改变材料的性质，例如结晶度，晶粒尺寸，玻璃化转变温度，热膨胀系数和电导率。在导电多晶材料中实现高水平的导电性，而不拉伸定向该材料。与具有各向同性电导率的拉伸取向膜相比，增强的导电性是各向同性的。

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