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11. 发明申请

US20080274608A1 STRUCTURE AND METHOD FOR ENHANCING RESISTANCE TO FRACTURE OF BONDING PADS 有权
标题翻译：结构和方法提高结合力的破坏
公开(公告)号：US20080274608A1
公开(公告)日：2008-11-06
申请号：US12174074
申请日：2008-07-16
申请人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
发明人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
IPC分类号： H01L21/768
CPC分类号： H01L24/05 , H01L24/13 , H01L2224/02235 , H01L2224/02351 , H01L2224/0401 , H01L2224/05073 , H01L2224/05094 , H01L2224/05095 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/13006 , H01L2224/131 , H01L2224/16 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/00014 , H01L2224/05599 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.
摘要翻译：本发明提供了半导体集成电路和芯片封装之间的接合焊盘结构，其具有增强的抗断裂性和改进的可靠性。在粘结结构中使用的材料之间的温度膨胀系数（CTE）的不匹配会对其造成应力和剪切，这可能导致后端介质堆叠中的断裂，并导致包装的可靠性问题。通过设置通过多个金属通孔连接到接合焊盘的多个金属焊盘，增强了接合焊盘和后端电介质叠层之间的粘附力。

12. 发明申请

US20080111250A1 STRUCTURE AND METHOD FOR ENHANCING RESISTANCE TO FRACTURE OF BONDING PADS 有权
公开(公告)号：US20080111250A1
公开(公告)日：2008-05-15
申请号：US11559130
申请日：2006-11-13
申请人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
发明人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
IPC分类号： H01L23/52 , H01L21/768
CPC分类号： H01L24/05 , H01L24/13 , H01L2224/02235 , H01L2224/02351 , H01L2224/0401 , H01L2224/05073 , H01L2224/05094 , H01L2224/05095 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/13006 , H01L2224/131 , H01L2224/16 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/00014 , H01L2224/05599 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.

13. 发明授权

US07221410B2 Television receiving module and display apparatus and television receiving system using the same 失效
标题翻译：电视接收模块及其使用的显示装置和电视接收系统
公开(公告)号：US07221410B2
公开(公告)日：2007-05-22
申请号：US10625682
申请日：2003-07-24
申请人： Nam Su Choi , Jong Jin Lee , Dae Young Jung , Jin Seog Kang
发明人： Nam Su Choi , Jong Jin Lee , Dae Young Jung , Jin Seog Kang
IPC分类号： H04N5/63
CPC分类号： H04N5/64 , H04N5/44 , H04N5/63 , H04N21/4183
摘要： A TV receiving module and a display apparatus and a TV receiving system using the same, wherein the TV receiving module is small in size and is detachably mounted outside or inside of the display apparatus. The TV receiving module is adapted to select and receive a TV signal of a desired broadcast from among TV signals inputted from a TV broadcast receiving antenna or cable, and provide the received TV signal. A detachable connector unit includes a first connector installed in the TV receiving module for receiving external power and an external control signal and providing the TV signal received by the TV receiving module externally, and a second connector detachably coupled with the first connector. The display apparatus is connected to the TV receiving module via the second connector of the detachable connector unit to provide the external power and external control signal to the TV receiving module, receive the TV signal from the TV receiving module and output video and audio signals of the received TV signal. The display apparatus may be an LCD monitor or a PDP TV receiver.
摘要翻译：一种电视接收模块和显示装置以及使用该TV接收系统的TV接收系统，其中TV接收模块的尺寸小，并且可拆卸地安装在显示装置的外部或内部。电视接收模块适于从从TV广播接收天线或电缆输入的TV信号中选择并接收所需广播的TV信号，并提供所接收的TV信号。可拆卸连接器单元包括安装在TV接收模块中的用于接收外部电力的第一连接器和外部控制信号，并且将外部由TV接收模块接收的TV信号提供，以及可拆卸地与第一连接器耦合的第二连接器。显示装置通过可拆卸连接器单元的第二连接器连接到TV接收模块，以将外部电源和外部控制信号提供给TV接收模块，从TV接收模块接收TV信号，并输出视频和音频信号收到的电视信号。显示装置可以是LCD监视器或PDP TV接收器。

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