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11. 发明授权

US07874067B1 Manufacturing method for single chip COB USB devices with optional embedded LED 有权
标题翻译：具有可选嵌入式LED的单芯片COB USB设备的制造方法
公开(公告)号：US07874067B1
公开(公告)日：2011-01-25
申请号：US12137432
申请日：2008-06-11
申请人： Siew S. Hiew , Frank I-Kang Yu , Nan Nan , Paul Hsueh , Abraham C. Ma , Ming-Shiang Shen
发明人： Siew S. Hiew , Frank I-Kang Yu , Nan Nan , Paul Hsueh , Abraham C. Ma , Ming-Shiang Shen
IPC分类号： H05K3/30 , G06F13/36
CPC分类号： G06F1/1632 , H01L24/73 , H01L24/97 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K3/0052 , H05K3/284 , H05K5/0278 , H05K2201/10159 , H05K2203/049 , H05K2203/1316 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49149 , Y10T29/49169 , Y10T29/49179 , H01L2224/85 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.
摘要翻译：根据本发明的某些实施例，单芯片COB USB制造在具有多个单独的USB PCB基板的PCB面板上使用芯片上（COB）工艺。这种单芯片COB USB以N×M矩阵阵列布置。该方法的优点是：1）使用PCBA成型，与传统的SMT工艺相比，在基板上安装所有必要的部件以形成PCBA; 2）更简单的矩形结构，适合任何外部装饰外壳包装附加值; 和3）如果不防水，包装是防潮的。

12. 发明授权

US07420803B2 Universal serial bus flash drive with deploying and retracting functionalities 失效
标题翻译：通用串行总线闪存驱动器具有部署和撤销功能
公开(公告)号：US07420803B2
公开(公告)日：2008-09-02
申请号：US11682261
申请日：2007-03-05
申请人： Paul Hsueh , Jin Kyu Kim , Nan Nan , David Nguyen , Ming-Shiang Shen
发明人： Paul Hsueh , Jin Kyu Kim , Nan Nan , David Nguyen , Ming-Shiang Shen
IPC分类号： G06F1/16
CPC分类号： H01R13/629 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G07C9/00087
摘要： A universal serial bus (USB) flash drive pen device for deploying and retracting a USB plug connector having a pusher assembly including a USB flash drive and a USB plug connector, in accordance with an embodiment of the present invention. The USB flash drive pen device further includes a housing assembly at least partially enclosing said pusher assembly for deploying said USB plug connector, said USB flash drive being coupled to said USB plug connector, said pusher assembly retracting said USB plug connector into said housing assembly, said USB flash drive pen device for deploying said USB plug connector to couple said USB flash drive to a USB port.
摘要翻译：根据本发明的实施例的通用串行总线（USB）闪存驱动笔装置，用于部署和缩回具有包括USB闪存驱动器和USB插头连接器的推动器组件的USB插头连接器。所述USB闪存驱动器笔装置还包括至少部分地封闭所述推动器组件以用于展开所述USB插头连接器的壳体组件，所述USB闪存驱动器耦合到所述USB插头连接器，所述推动器组件将所述USB插头连接器缩回到所述壳体组件中，所述USB闪存笔设备用于部署所述USB插头连接器以将所述USB闪存驱动器耦合到USB端口。

13. 发明申请

US20080003882A1 Super-Digital (SD) Flash Card with Asymmetric Circuit Board and Mechanical Switch 失效
标题翻译：具有不对称电路板和机械开关的超级数字（SD）闪存卡
公开(公告)号：US20080003882A1
公开(公告)日：2008-01-03
申请号：US11846725
申请日：2007-08-29
申请人： Jim Ni , Abraham Ma , Paul Hsueh , Ming-Shiang Shen
发明人： Jim Ni , Abraham Ma , Paul Hsueh , Ming-Shiang Shen
IPC分类号： H01R13/66
CPC分类号： G06K19/07743 , A45C2011/188 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G06K19/077 , G06K19/07732 , G07C9/00087 , H05K1/117 , H05K1/118 , H05K1/189 , H05K3/284 , H05K3/4691 , H05K2201/091 , H05K2201/10159 , H05K2203/1527
摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB. A user-slidable switch may be slanted to compensate for the PCB slant. The PCB may have a flex section to facilitate the slant without a slanted switch.
摘要翻译：闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。控制器芯片包括一个外部安全数字（SD）接口，以及一个处理单元，用于从闪存芯片中读取数据块。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。暴露SD接触垫的上壳体中的开口之间的分隔线也以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以便为安装在PCB底部表面的芯片提供更大的厚度。用户可滑动的开关可以倾斜以补偿PCB倾斜。 PCB可以具有弯曲部分以便于倾斜而没有倾斜的开关。

14. 发明申请

US20070130414A1 Secure-Digital (SD) Flash Card with Slanted Asymmetric Circuit Board 失效
标题翻译：具有倾斜不对称电路板的安全数字（SD）闪存卡
公开(公告)号：US20070130414A1
公开(公告)日：2007-06-07
申请号：US11309844
申请日：2006-10-11
申请人： Jim Ni , Abraham Ma , Paul Hsueh , Ming-Shiang Shen
发明人： Jim Ni , Abraham Ma , Paul Hsueh , Ming-Shiang Shen
IPC分类号： G06F12/00
CPC分类号： G06K19/077 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G06K19/07732 , G07C9/00087 , Y02D10/13
摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an external computer over a Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Supporting end ribs under each of the SD contact pads and middle ribs support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline.
摘要翻译：闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。控制器芯片包括通过安全数字（SD）接口连接到外部计算机的输入/输出接口电路，以及从闪速存储器芯片读取数据块的处理单元。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。在每个SD接触垫和中肋下的支撑端肋以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以允许安装在PCB底部表面的芯片的厚度更大，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。

15. 发明申请

US20080003883A1 Manufacturing Process for a Super-Digital (SD) Flash Card with Slanted Asymmetric Circuit Board 失效
标题翻译：具有倾斜不对称电路板的超级数字（SD）闪存卡的制造工艺
公开(公告)号：US20080003883A1
公开(公告)日：2008-01-03
申请号：US11846733
申请日：2007-08-29
申请人： Jim Ni , Abraham Ma , Paul Hsueh , Ming-Shiang Shen
发明人： Jim Ni , Abraham Ma , Paul Hsueh , Ming-Shiang Shen
IPC分类号： H01R13/66
CPC分类号： G06K19/07743 , A45C2011/188 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G06K19/077 , G06K19/07732 , G07C9/00087 , H05K1/117 , H05K1/118 , H05K1/189 , H05K3/284 , H05K3/4691 , H05K2201/091 , H05K2201/10159 , H05K2203/1527
摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline. A metal switch-bar or an over-molded controller die may be substituted.
摘要翻译：闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。控制器芯片包括一个外部安全数字（SD）接口，以及一个处理单元，用于从闪存芯片中读取数据块。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。暴露SD接触垫的上壳体中的开口之间的分隔线也以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜以允许安装到PCB的底表面的芯片具有更大的厚度，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。金属开关杆或过模制的控制器管芯可以被替代。

16. 发明申请

US20080006927A1 Manufacturing Process For Single-Chip MMC/SD Flash Memory Device With Molded Asymmetric Circuit Board 失效
标题翻译：具有模制不对称电路板的单芯片MMC / SD闪存器件的制造工艺
公开(公告)号：US20080006927A1
公开(公告)日：2008-01-10
申请号：US11831888
申请日：2007-07-31
申请人： Siew Hiew , Jim Ni , Paul Hsueh , Charles Lee , Ming-Shiang Shen
发明人： Siew Hiew , Jim Ni , Paul Hsueh , Charles Lee , Ming-Shiang Shen
IPC分类号： H01L23/488 , H01L21/52
CPC分类号： H05K3/284 , H01L23/544 , H01L24/48 , H01L24/97 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/117 , H05K2201/09936 , H05K2201/10159 , Y10T29/49126 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.
摘要翻译： MMC / SD核心单元包括PCBA，其中所有无源组件和未封装的IC芯片附接到与金属触点相对的PCB的单侧。 IC芯片例如包括控制器芯片和闪存芯片，或单芯片（组合的控制器/闪存）芯片。可选择堆叠多个闪存IC芯片以增加存储容量。 IC芯片通过引线接合或其他芯片上（COB）芯片技术连接到PCB。无源元件通过传统的表面贴装技术（SMT）技术连接起来。然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。然后将MMC / SD核心单元插入或以其他方式安装在永久壳体中以提供完成的MMC / SD设备。

17. 发明申请

US20070184685A1 UNIVERSAL SERIAL BUS FLASH DRIVE WITH DEPLOYING AND RETRACTING FUNCTIONALITIES 失效
标题翻译：通用串行总线闪光驱动器具有分配和延迟功能
公开(公告)号：US20070184685A1
公开(公告)日：2007-08-09
申请号：US11682261
申请日：2007-03-05
申请人： Paul Hsueh , Jin Kim , Nan Nan , David Nguyen , Ming-Shiang Shen
发明人： Paul Hsueh , Jin Kim , Nan Nan , David Nguyen , Ming-Shiang Shen
IPC分类号： H05K1/00
CPC分类号： H01R13/629 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G07C9/00087
摘要： A universal serial bus (USB) flash drive pen device for deploying and retracting a USB plug connector having a pusher assembly including a USB flash drive and a USB plug connector, in accordance with an embodiment of the present invention. The USB flash drive pen device further includes a housing assembly at least partially enclosing said pusher assembly for deploying said USB plug connector, said USB flash drive being coupled to said USB plug connector, said pusher assembly retracting said USB plug connector into said housing assembly, said USB flash drive pen device for deploying said USB plug connector to couple said USB flash drive to a USB port.
摘要翻译：根据本发明的实施例的通用串行总线（USB）闪存驱动笔装置，用于部署和缩回具有包括USB闪存驱动器和USB插头连接器的推动器组件的USB插头连接器。所述USB闪存驱动器笔装置还包括至少部分地封闭所述推动器组件以用于展开所述USB插头连接器的壳体组件，所述USB闪存驱动器耦合到所述USB插头连接器，所述推动器组件将所述USB插头连接器缩回到所述壳体组件中，所述USB闪存笔设备用于部署所述USB插头连接器以将所述USB闪存驱动器耦合到USB端口。

18. 发明授权

US07830666B2 Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board 失效
标题翻译：具有模制非对称电路板的单芯片MMC / SD闪存器件的制造工艺
公开(公告)号：US07830666B2
公开(公告)日：2010-11-09
申请号：US11831888
申请日：2007-07-31
申请人： Siew S. Hiew , Jim C. Ni , Paul Hsueh , Charles C. Lee , Ming-Shiang Shen
发明人： Siew S. Hiew , Jim C. Ni , Paul Hsueh , Charles C. Lee , Ming-Shiang Shen
IPC分类号： H05K7/02 , H05K3/28
CPC分类号： H05K3/284 , H01L23/544 , H01L24/48 , H01L24/97 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/117 , H05K2201/09936 , H05K2201/10159 , Y10T29/49126 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.
摘要翻译： MMC / SD核心单元包括PCBA，其中所有无源组件和未封装的IC芯片附接到与金属触点相对的PCB的单侧。 IC芯片例如包括控制器芯片和闪存芯片，或单芯片（组合的控制器/闪存）芯片。可选择堆叠多个闪存IC芯片以增加存储容量。 IC芯片通过引线接合或其他芯片上（COB）芯片技术连接到PCB。无源元件通过传统的表面贴装技术（SMT）技术连接起来。然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。然后将MMC / SD核心单元插入或以其他方式安装在永久壳体中以提供完成的MMC / SD设备。

19. 发明授权

US06395156B1 Sputtering chamber with moving table producing orbital motion of target for improved uniformity 失效
标题翻译：具有移动台的溅射室产生目标的轨道运动，以提高均匀性
公开(公告)号：US06395156B1
公开(公告)日：2002-05-28
申请号：US09681962
申请日：2001-06-29
申请人： Paul Hsueh , Abraham C. Ma
发明人： Paul Hsueh , Abraham C. Ma
IPC分类号： C23C1446
CPC分类号： H01J37/3414 , C23C14/46 , H01J37/34
摘要： A sputtering chamber has a target that moves with an orbital motion relative to an ion beam. An X-Y assembly allows for target movement in both the horizontal and vertical directions. The X-Y assembly has a base plate, an intermediate plate, and a target mounting plate that attaches to the target. The plates are connected together by bearing blocks that slide along rails in the X and Y directions. A rotating shaft has gears that rotate a center shaft through the base and intermediate plates. The rotating center shaft has an arm on its end that attaches to the target mounting plate. The arm produces an orbital movement of the target. Rather than simply rotating the target around the center shaft, the center of the target orbits around the center of the center shaft. Ion-beam wear is spread across the target surface, extending target life and improving deposition uniformity.
摘要翻译：溅射室具有相对于离子束以轨道运动移动的靶。 X-Y组件允许水平和垂直方向上的目标移动。 X-Y组件具有附接到目标的基板，中间板和目标安装板。板通过在X和Y方向上沿轨道滑动的轴承座连接在一起。旋转轴具有使中心轴穿过底座和中间板的齿轮。旋转中心轴在其端部具有附接到目标安装板的臂。手臂产生目标的轨道运动。而不是简单地围绕中心轴旋转目标，目标的中心围绕中心轴的中心轨道。离子束磨损扩散到目标表面，延长靶的寿命并提高沉积均匀性。

20. 发明申请

US20080195817A1 SD Flash Memory Card Manufacturing Using Rigid-Flex PCB 审中-公开
标题翻译：使用刚性PCB的SD闪存卡制造
公开(公告)号：US20080195817A1
公开(公告)日：2008-08-14
申请号：US12106517
申请日：2008-04-21
申请人： Siew S. Hiew , Nan Nan , Paul Hsueh , I-Kang Yu , Abraham C. Ma
发明人： Siew S. Hiew , Nan Nan , Paul Hsueh , I-Kang Yu , Abraham C. Ma
IPC分类号： G06F13/00 , H05K3/20
CPC分类号： H05K3/284 , G06K19/077 , G06K19/07732 , H01L23/49855 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/19041 , H05K1/023 , H05K1/117 , H05K1/189 , H05K3/0052 , H05K2201/10159 , H05K2201/2009 , H05K2203/1316 , Y10T29/49128 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A memory card (e.g., SD or MMC) device including a PCBA in which components are mounted on a “rigid-flex” PCB including at least one rigid PCB section and at least one flexible PCB section, and a housing that includes both a pre-molded upper housing portion and a molded casing. The rigid-flex PCB is mounted into the upper housing portion such that standard metal contacts disposed on an upper surface of the rigid-flex PCB are exposed through openings defined the upper housing portion, and such that the flexible section of the rigid-flex PCB over any contours formed on the inside surface of the upper housing portion. The molded casing is then formed by depositing thermoset plastic over the lower surface of rigid-flex PCB.
摘要翻译：包括PCBA的存储卡（例如，SD或MMC）装置，其中部件安装在包括至少一个刚性PCB部分和至少一个柔性PCB部分的“刚性柔性”PCB上，以及壳体，模制的上壳体部分和模制壳体。刚性柔性PCB被安装到上部壳体部分中，使得设置在刚性 - 柔性PCB的上表面上的标准金属触点通过限定上部壳体部分的开口暴露，并且使得柔性柔性PCB的柔性部分超过形成在上壳体部分的内表面上的任何轮廓。然后通过在刚性柔性PCB的下表面上沉积热固性塑料形成模制套管。

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