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    • 15. 发明申请
    • Automatically passivated n-p junction and a method for making it
    • 自动钝化n-p结及其制作方法
    • US20050121747A1
    • 2005-06-09
    • US10501778
    • 2003-01-17
    • Jarek AntoszewskiJohn DellCharles MuscaLorenzo FaraoneBrett NenerJohn Siliquini
    • Jarek AntoszewskiJohn DellCharles MuscaLorenzo FaraoneBrett NenerJohn Siliquini
    • H01L21/8238H01L27/06H01L27/14H01L27/146H01L29/00H01L29/22H01L31/0296H01L31/102H01L31/103H01L31/18
    • H01L27/0605H01L27/14643H01L27/14696H01L29/22H01L31/1032H01L31/1828Y02E10/543
    • An automatically passivated n-p junction is formed from a p-type body containing Group II and Group VI elements, one of which is mercury. A passivation layer is then formed having at least one window provided therein on a surface of the p-type body. The p-type body is then subjected to a reactive ion etching process using the passivation layer as a mask to form the n-p junction. Ohmic contacts are then formed on the n-type and p-type regions. The method may be extended to form an array of n-p junctions on a semiconductor body having a plurality of p-type material layers. This method comprises the further step of: etching the body to expose a portion of each layer; forming a passivation layer over the body; forming windows in the passivation layer; subjecting the body to a reactive ion etching process using the passivation layer as a mask to form an n-p junction in each layer or to form n-p junctions that extend substantially to the substrate; forming an ohmic contact to each of the n-type regions; and forming an ohmic contact to a common p-type layer or each layer of the portions. A semiconductor material comprising an n-p junction formed according to the aforementioned methods is also described, having a substrate, a layer of p-type material surmounting the substrate, a region of converted n-type material formed on a localised portion of the surface of the p-type material, so as to define an n-p junction between the p-type and the n-type material; a passivation layer surmounting the surface of the p-type material and the n-p junction, including windows respectively exposing part of the surface of the converted n-type material and a portion of the surface of the p-type material distant from the n-type material, such that ohmic contacts may be disposed on the exposed surface, without exposing the n-p junction.
    • 由含有II族和VI族元素的p型体形成自动钝化的n-p结,其中之一是汞。 然后形成钝化层,其中在p型体的表面上设置有至少一个窗口。 然后使用钝化层作为掩模对p型体进行反应离子蚀刻工艺以形成n-p结。 然后在n型和p型区域上形成欧姆接触。 该方法可以扩展以在具有多个p型材料层的半导体主体上形成n-p结阵列。 该方法还包括以下步骤:蚀刻所述主体以暴露每层的一部分; 在身体上形成钝化层; 在钝化层中形成窗; 使用钝化层作为掩模对体进行反应离子蚀刻工艺,以在每个层中形成n-p结或形成基本上延伸到衬底的n-p结; 与n型区域中的每一个形成欧姆接触; 并且形成与共同的p型层或各层的欧姆接触。 还描述了包括根据上述方法形成的np结的半导体材料,其具有衬底,覆盖衬底的p型材料层,形成在表面的局部部分上的转换的n型材料的区域 p型材料,以便在p型和n型材料之间限定np结; 覆盖p型材料和np结的表面的钝化层,包括分别暴露转换的n型材料的表面的一部分和远离n型材料的p型材料的表面的一部分的窗口 材料,使得欧姆接触可以设置在暴露的表面上,而不暴露np结。