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    • 13. 发明授权
    • Methods of forming silicon carbide switching devices including P-type channels
    • 形成包括P型通道的碳化硅切换装置的方法
    • US07883949B2
    • 2011-02-08
    • US11740687
    • 2007-04-26
    • Mrinal Kanti DasQingchun ZhangSei-Hyung Ryu
    • Mrinal Kanti DasQingchun ZhangSei-Hyung Ryu
    • H01L21/337
    • H01L21/324H01L21/046H01L21/049H01L29/045H01L29/1608H01L29/66068H01L29/7395H01L29/7838Y10S438/931
    • Methods of forming a p-channel MOS device in silicon carbide include forming an n-type well in a silicon carbide layer, and implanting p-type dopant ions to form a p-type region in the n-type well at a surface of the silicon carbide layer and at least partially defining a channel region in the n-type well adjacent the p-type region. A threshold adjustment region is formed in the channel region. The implanted ions are annealed in an inert atmosphere at a temperature greater than 1650° C. A gate oxide layer is formed on the channel region, and a gate is formed on the gate oxide layer. A silicon carbide-based transistor includes a silicon carbide layer, an n-type well in the silicon carbide layer, and a p-type region in the n-type well at a surface of the silicon carbide layer and at least partially defining a channel region in the n-type well adjacent the p-type region. A threshold adjustment region is in the channel region and includes p-type dopants at a dopant concentration of about 1×1016 cm−3 to about 5×1018 cm−3. The transistor further includes a gate oxide layer on the channel region, and a gate on the gate oxide layer. The transistor may exhibit a hole mobility in the channel region in excess of 5 cm2/V-s at a gate voltage of −25V.
    • 在碳化硅中形成p沟道MOS器件的方法包括在碳化硅层中形成n型阱,以及注入p型掺杂离子以在n型阱的表面形成p型区域 并且在邻近p型区域的n型阱中至少部分地限定沟道区。 在通道区域中形成阈值调整区域。 注入的离子在惰性气氛中在大于1650℃的温度下进行退火。在沟道区上形成栅极氧化层,栅极氧化层上形成栅极。 基于碳化硅的晶体管包括碳化硅层,碳化硅层中的n型阱以及在碳化硅层的表面处的n型阱中的p型区域,并且至少部分地限定沟道 邻近p型区域的n型阱区域。 阈值调整区域在通道区域中,并且包括掺杂剂浓度为约1×10 16 cm -3至约5×10 18 cm -3的p型掺杂剂。 晶体管还包括在沟道区上的栅极氧化层和栅极氧化物层上的栅极。 晶体管可以在-25V的栅极电压下在沟道区中表现出超过5cm 2 / V-s的空穴迁移率。
    • 20. 发明申请
    • Silicon Carbide Switching Devices Including P-Type Channels
    • 包括P型通道的碳化硅切换装置
    • US20110121318A1
    • 2011-05-26
    • US13019723
    • 2011-02-02
    • Mrinal Kanti DasQingchun ZhangSei-Hyung Ryu
    • Mrinal Kanti DasQingchun ZhangSei-Hyung Ryu
    • H01L29/772H01L21/336
    • H01L21/324H01L21/046H01L21/049H01L29/045H01L29/1608H01L29/66068H01L29/7395H01L29/7838Y10S438/931
    • Methods of forming a p-channel MOS device in silicon carbide include forming an n-type well in a silicon carbide layer, and implanting p-type dopant ions to form a p-type region in the n-type well at a surface of the silicon carbide layer and at least partially defining a channel region in the n-type well adjacent the p-type region. A threshold adjustment region is formed in the channel region. The implanted ions are annealed in an inert atmosphere at a temperature greater than 1650° C. A gate oxide layer is formed on the channel region, and a gate is formed on the gate oxide layer. A silicon carbide-based transistor includes a silicon carbide layer, an n-type well in the silicon carbide layer, and a p-type region in the n-type well at a surface of the silicon carbide layer and at least partially defining a channel region in the n-type well adjacent the p-type region. A threshold adjustment region is in the channel region and includes p-type dopants at a dopant concentration of about 1×1016 cm−3 to about 5×1018 cm−3. The transistor further includes a gate oxide layer on the channel region, and a gate on the gate oxide layer. The transistor may exhibit a hole mobility in the channel region in excess of 5 cm2/V-s at a gate voltage of −25V.
    • 在碳化硅中形成p沟道MOS器件的方法包括在碳化硅层中形成n型阱,以及注入p型掺杂离子以在n型阱的表面形成p型区域 并且在邻近p型区域的n型阱中至少部分地限定沟道区。 在通道区域中形成阈值调整区域。 注入的离子在惰性气氛中在大于1650℃的温度下进行退火。在沟道区上形成栅极氧化层,栅极氧化层上形成栅极。 基于碳化硅的晶体管包括碳化硅层,碳化硅层中的n型阱以及在碳化硅层的表面处的n型阱中的p型区域,并且至少部分地限定沟道 邻近p型区域的n型阱区域。 阈值调整区域在通道区域中,并且包括掺杂剂浓度为约1×10 16 cm -3至约5×10 18 cm -3的p型掺杂剂。 晶体管还包括在沟道区上的栅极氧化层和栅极氧化物层上的栅极。 晶体管可以在-25V的栅极电压下在沟道区中表现出超过5cm 2 / V-s的空穴迁移率。