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11. 发明授权

US09132519B2 Directly connected heat exchanger tube section and coolant-cooled structure 有权
标题翻译：直接连接热交换器管段和冷却剂冷却结构
公开(公告)号：US09132519B2
公开(公告)日：2015-09-15
申请号：US13711854
申请日：2012-12-12
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Timothy J. Chainer , Patrick A. Coico , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H05K7/20 , B23P15/26
CPC分类号： B23P15/26 , H05K7/20781 , H05K7/20827 , Y10T29/4935 , Y10T29/49826
摘要： A method is provided for fabricating a cooling apparatus for cooling an electronics rack, which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures, and a tube. The heat exchanger is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of coolant-carrying tube sections, each tube section having a coolant inlet and outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.
摘要翻译：提供了一种用于制造用于冷却电子机架的冷却装置的方法，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。热交换器与电子机架相关联并且设置成冷却通过齿条的空气，包括多个冷却剂承载管部分，每个管段具有冷却剂入口和出口，其中一个与冷却剂流体连通循环以便于冷却剂流过管段。冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。

12. 发明授权

US09113581B2 Valve controlled, node-level vapor condensation for two-phase heat sink(s) 有权
标题翻译：气门控制，两相散热器的节点级蒸气冷凝
公开(公告)号：US09113581B2
公开(公告)日：2015-08-18
申请号：US14519401
申请日：2014-10-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20818 , G06F1/20 , G06F2200/201 , H05K7/2029 , H05K7/20309 , H05K7/20318 , H05K7/20809
摘要： Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The first coolant provides two-phase cooling to the electronic component(s), and is discharged from the heat sink as coolant exhaust, which includes coolant vapor. The apparatus further includes a node-level condensation module coupled to the heat sink to receive the coolant exhaust. The condensation module is cooled via a second coolant, and facilitates condensing the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. A control valve adjusts a flow rate of the second coolant of the node-level condensation module, with the valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust.
摘要翻译：提供了用于冷却电子部件的装置，电子部件包括耦合到电子部件的散热器，并且具有用于第一冷却剂的冷却剂传送通道。第一冷却剂向电子部件提供两相冷却，并且作为包括冷却剂蒸气的冷却剂排出物从散热器排出。该装置还包括联接到散热器以接收冷却剂排气的节点级冷凝模块。冷凝模块通过第二冷却剂冷却，并且有助于冷凝冷却剂排出物中的冷却剂蒸气。控制器自动控制散热器的液体冷却和/或节点级冷凝模块的液冷。控制阀调节节点级冷凝模块的第二冷却剂的流量，基于冷却剂排气中的冷却剂蒸气的表征，阀被控制器自动控制。

13. 发明授权

US09102021B2 Heat sink structure with a vapor-permeable membrane for two-phase cooling 有权
标题翻译：散热结构带有透气膜用于两相冷却
公开(公告)号：US09102021B2
公开(公告)日：2015-08-11
申请号：US14064322
申请日：2013-10-28
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F28F3/00 , B23P15/26 , H05K7/20 , G06F1/20 , F28F3/12 , F28F13/00 , F28D15/02
CPC分类号： B23P15/26 , F28D15/0266 , F28F3/00 , F28F3/12 , F28F13/00 , G06F1/20 , H05K7/20254 , H05K7/20272 , H05K7/2029 , H05K7/20772 , Y10T29/4935
摘要： A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
摘要翻译：提供散热器，冷却电子结构和利用散热器的冷却电子设备。散热器由导热结构制成，该导热结构包括一个或多个冷却剂承载通道，其联接以便于冷却剂流过冷却剂输送通道。散热器还包括与冷却剂输送通道相关联的膜。该膜包括至少一个透气区域，其覆盖着一部分冷却剂输送通道，并且有助于从冷却剂输送通道中除去蒸气，以及至少一个孔口，其连接以将冷却剂注入到在一个或多个通道的相对端之间的冷却剂承载通道的至少一个表面。

14. 发明授权

US09095889B2 Thermoelectric-enhanced air and liquid cooling of an electronic system 有权
标题翻译：电子系统的热电增强空气和液体冷却
公开(公告)号：US09095889B2
公开(公告)日：2015-08-04
申请号：US13788798
申请日：2013-03-07
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25B21/02 , B21D53/02 , H05K7/20
CPC分类号： B21D53/02 , F25B21/02 , F25B2321/0252 , H05K7/2079 , Y10T29/49359
摘要： Thermoelectric-enhanced air and liquid cooling of an electronic system is facilitated by providing a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.
摘要翻译：提供一种电子系统的热电增强空气和液体冷却是通过提供一种冷却装置来实现的，所述冷却装置包括与电子部件热连通的液冷结构，以及液体 - 液体和空气 - 液体热交换器通过冷却剂回路串联流体连通，其包括并联连接的第一和第二回路部分。液冷结构经由第一回路部分供应冷却剂，热电阵列设置有第一和第二回路部分与阵列的第一和第二侧热接触。热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。通过第一和第二回路部分的冷却剂通过串联耦合的热交换器，其中一个用作散热器。

15. 发明授权

US09075582B2 Valve controlled, node-level vapor condensation for two-phase heat sink(s) 有权
标题翻译：气门控制，两相散热器的节点级蒸气冷凝
公开(公告)号：US09075582B2
公开(公告)日：2015-07-07
申请号：US13676313
申请日：2012-11-14
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20818 , G06F1/20 , G06F2200/201 , H05K7/2029 , H05K7/20309 , H05K7/20318 , H05K7/20809
摘要： A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.
摘要翻译：提供冷却装置和方法来冷却电子机架的电子子系统的一个或多个电子部件。冷却装置包括散热器，其被配置为耦合到电子部件，并且其包括用于冷却剂流过其中的冷却剂输送通道。冷却剂为电子部件提供两相冷却，并且作为包括要冷凝的冷却剂蒸汽的冷却剂排出物从散热器排出。冷却装置还包括与电子子系统相关联的节点级冷凝模块，并且与散热器流体连通地耦合以接收来自散热器的冷却剂排出物。冷凝模块是液体冷却的，并且便于冷却剂排气中的冷却剂蒸气的冷凝。控制器自动控制散热器的液体冷却和/或节点级冷凝模块的液冷。

16. 发明授权

US09009971B2 Wicking and coupling element(s) facilitating evaporative cooling of component(s) 有权
标题翻译：促进部件蒸发冷却的芯吸和耦合元件
公开(公告)号：US09009971B2
公开(公告)日：2015-04-21
申请号：US13788871
申请日：2013-03-07
申请人： International Business Machines Corporation
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： B23P15/26 , H05K7/20
CPC分类号： B23P15/26 , H05K7/203 , H05K7/20336 , H05K7/20809 , Y10T29/4935 , Y10T29/49396
摘要： A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.
摘要翻译：提供了一种便于冷却电子系统的电子部件的方法。该方法包括：提供壳体，其至少部分地环绕和形成围绕部件的隔室，并且提供浸入冷却流体设置在隔室内，电子系统的至少一个部件至少部分地不浸入流体在隔间; 提供物理耦合到所述至少一个部件的主表面并且部分地设置在所述隔室内的流体内的芯吸膜元件; 以及通过耦合元件将所述芯吸膜元件物理耦合到所述至少一个部件的主表面，而不将所述耦合元件覆盖在所述部件的主表面上。作为增强，芯吸膜元件包裹在部件上以物理耦合到部件的两个相对的主侧。

17. 发明授权

US08964391B2 Sectioned manifolds facilitating pumped immersion-cooling of electronic components 有权
标题翻译：有助于泵送浸入式冷却电子部件的分段式歧管
公开(公告)号：US08964391B2
公开(公告)日：2015-02-24
申请号：US13788919
申请日：2013-03-07
申请人： International Business Machines Corporation
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28D15/00 , F28F27/00 , F28F9/00 , B23P15/26
CPC分类号： B23P15/26 , F28D15/02 , F28F3/048 , F28F3/12 , F28F2250/06 , H05K7/20809 , Y10T29/4935
摘要： Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.
摘要翻译：提供冷却方法以便于电子部件的抽吸浸没冷却。冷却方法包括：提供围绕一个或多个部件形成隔室的壳体，以及提供供应歧管，回流歧管以及联接冷却剂回路联接器以使供应和返回歧管与壳体流体连通。流过冷却剂回路的冷却剂流过壳体的隔室，并且至少部分地通过流动沸腾来冷却部件。泵有利于循环内的冷却剂循环，并且冷却剂旁通管线连接在供应和返回歧管之间。回流歧管包括混合相歧管部分，并且旁路管线将冷却剂从供应歧管直接提供给混合相歧管部分。冷却剂从冷却剂旁通管路流向与该歧管部分内任何冷却剂蒸气流的方向相反的方向流入混合相歧管部分。

18. 发明授权

US08947873B2 Immersion-cooled and conduction-cooled electronic system 有权
标题翻译：浸入式冷却和传导冷却的电子系统
公开(公告)号：US08947873B2
公开(公告)日：2015-02-03
申请号：US13684712
申请日：2012-11-26
申请人： International Business Machines Corporation
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K5/00 , H05K7/20 , G06F1/20
CPC分类号： H05K7/20236 , G06F1/20 , H05K7/203 , H05K7/20318 , H05K7/20336 , H05K7/2079 , H05K7/20809
摘要： A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.
摘要翻译：提供了一种冷却的电子系统和冷却方法，其中具有安装到板上的多个电子部件的电子板通过包括浸没冷却电子部件部分和传导冷却电子部件部分的设备来冷却。浸没冷却部分包括至少部分地围绕和形成围绕安装到电子板的电子部件的多个电子部件的隔室以及设置在隔间内的流体的外壳。多个电子部件至少部分地浸入流体中以便于这些部件的浸入冷却。传导冷却的电子部件部分包括安装到电子板的电子部件的至少一个电子部件，并且至少一个电子部件至少部分地经由从至少一个电子元件

19. 发明授权

US08929080B2 Immersion-cooling of selected electronic component(s) mounted to printed circuit board 有权
标题翻译：对安装在印刷电路板上的所选择的电子部件进行浸入式冷却
公开(公告)号：US08929080B2
公开(公告)日：2015-01-06
申请号：US13788987
申请日：2013-03-07
申请人： International Business Machines Corporation
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： H05K7/20 , H05K7/20236 , H05K7/20772 , Y10T29/49117
摘要： A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.
摘要翻译：提供了一种用于对诸如多节点机架的节点或书的电子系统的所选择的电子部件进行抽吸浸没冷却的方法。该方法包括提供围绕待冷却的部件限定隔室的壳体组件，该组件联接到印刷电路板的第一侧。组件包括具有开口尺寸以容纳部件的第一框架和第二框架。第一和第二框架分别经由第一粘合剂层和第二粘合剂层密封到板的相对侧。印刷电路板至少部分地多孔于冷却剂流过隔间，并且第一框架，第二框架和第一和第二粘合剂层相对于冷却剂是无孔的，并且提供冷却剂密封到印刷电路板的第一和第二面。

20. 发明申请

US20140146845A1 THERMALLY DETERMINING FLOW AND/OR HEAT LOAD DISTRIBUTION IN PARALLEL PATHS 有权
标题翻译：热平衡和热负荷分布的并行测定
公开(公告)号：US20140146845A1
公开(公告)日：2014-05-29
申请号：US13687779
申请日：2012-11-28
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Timothy J. Chainer , Madhusudan K. Iyengar , Pritish R. Parida
IPC分类号： G01K15/00
CPC分类号： G01K15/005 , G01J5/0003 , G01J5/522 , G01K7/427 , G01K15/00 , G01K2007/422 , G06F2200/201
摘要： A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.
摘要翻译：一种方法，包括获得热传递组件中的至少一个子部件的校准数据，其中所述校准数据包括对于所述子部件的给定表面温度增量的所述子部件的冷却剂流率的至少一个指示，以及给予所述子部件的热负荷，确定测量到所述子部件的热负荷，确定所述子部件的测量的表面温度增量，以及确定包括所述子部件的所述子部件的所述子部件的第一流路中的冷却剂流量分布校准数据根据测量的热负荷和测量的表面温度增量分量。

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