会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 11. 发明申请
    • MOLD AND MOLD BLANK SUBSTRATE
    • 模具和模具底座
    • US20140072668A1
    • 2014-03-13
    • US13731617
    • 2012-12-31
    • Ikuo YONEDATetsuro Nakasugi
    • Ikuo YONEDATetsuro Nakasugi
    • B29C59/02
    • B29C59/02B29C33/424G03F7/0002Y10T428/24488
    • According to one embodiment, a mold includes a base material, a pedestal portion and a pattern portion. The base material includes a first surface and a second surface. The pedestal portion protruded from the first surface of the base material and includes a side surface. The pattern portion is provided in the pedestal portion and includes an concave-convex pattern. The pedestal portion includes a first region and a second region. The first region is provided with the concave-convex pattern. The second region is provided between the first region and the side surface. The second region has maximum height equal to maximum height of the first region. The second region has a first height of the second region on the side surface side and a second height of the second region on the first region side. The first height is lower than the second height.
    • 根据一个实施例,模具包括基底材料,基座部分和图案部分。 基材包括第一表面和第二表面。 所述基座部从所述基材的第一表面突出并且包括侧面。 图案部分设置在基座部分中并且包括凹凸图案。 基座部分包括第一区域和第二区域。 第一区域设置有凹凸图案。 第二区域设置在第一区域和侧面之间。 第二区域具有等于第一区域的最大高度的最大高度。 所述第二区域具有在所述第一区域侧上的所述第二区域的侧表面侧的第一高度和所述第二区域的第二高度。 第一个高度低于第二个高度。
    • 14. 发明授权
    • Pattern forming method
    • 图案形成方法
    • US09046763B2
    • 2015-06-02
    • US12727025
    • 2010-03-18
    • Takeshi KoshibaIkuo YonedaTetsuro Nakasugi
    • Takeshi KoshibaIkuo YonedaTetsuro Nakasugi
    • B27N3/18G03F7/00B82Y10/00B82Y40/00
    • B05D1/322B82Y10/00B82Y40/00G03F7/0002
    • A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template.
    • 图案形成方法包括确定在基材上形成的固化性树脂的量,所述固化性树脂具有挥发性,所述固化性树脂的量是通过考虑了固化性树脂的挥发性损失的计算而计算的, 基板的多个区域,在基板上形成具有确定量的固化树脂,对基板的多个区域中的每一个进行固化树脂的形成,使形成在基板上的可固化树脂与模板接触, 模板包括通过接触填充固化树脂的图案,并且在可固化树脂与模板接触的条件下固化可固化树脂。
    • 15. 发明申请
    • PATTERN FORMING METHOD
    • 图案形成方法
    • US20100237045A1
    • 2010-09-23
    • US12727025
    • 2010-03-18
    • Takeshi KOSHIBAIkuo YonedaTetsuro Nakasugi
    • Takeshi KOSHIBAIkuo YonedaTetsuro Nakasugi
    • B44C1/22B05D5/00B05D3/06
    • B05D1/322B82Y10/00B82Y40/00G03F7/0002
    • A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template.
    • 图案形成方法包括确定在基材上形成的固化性树脂的量,所述固化性树脂具有挥发性,所述固化性树脂的量是通过考虑了固化性树脂的挥发性损失的计算而计算的, 基板的多个区域,在基板上形成具有确定量的固化树脂,对基板的多个区域中的每一个进行固化树脂的形成,使形成在基板上的可固化树脂与模板接触, 模板包括通过接触填充固化树脂的图案,并且在可固化树脂与模板接触的条件下固化可固化树脂。
    • 19. 发明授权
    • Imprint method
    • 印记法
    • US08202463B2
    • 2012-06-19
    • US12426527
    • 2009-04-20
    • Ikuo YonedaTetsuro NakasugiShinji Mikami
    • Ikuo YonedaTetsuro NakasugiShinji Mikami
    • B29C59/00
    • B29C37/006B29C35/0888B29C37/0053B29C2035/0827B29C2059/023B82Y10/00B82Y40/00G03F7/0002
    • An imprint method includes contacting a template on a first substrate. The template includes a pattern to be transferred on the first substrate. The first substrate includes a first semiconductor substrate, and a first light curable resin coated on the first semiconductor substrate. The method further includes separating the template from the first substrate, and removing particles adhered on the template. The particle removal includes: pressing the template on an adhesive member which is distinct from the first substrate. The adhesive member includes a dummy substrate, a particle removing film formed on the dummy substrate and configured to remove the particles, and a second light curable resin coated on the particle removing film. The second light curable resin is thicker than the first light curable resin.
    • 压印方法包括在第一衬底上接触模板。 模板包括要在第一基板上转印的图案。 第一基板包括第一半导体基板和涂覆在第一半导体基板上的第一光固化树脂。 该方法还包括从第一基底分离模板,以及除去附着在模板上的颗粒。 颗粒去除包括:将模板压在与第一基板不同的粘合剂构件上。 所述粘合部件包括虚拟基板,形成在所述虚设基板上并构成为除去所述粒子的除粒膜,以及涂覆在所述除粒膜上的第二光固化树脂。 第二光固化树脂比第一光固化树脂厚。