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11. 发明授权

US09596794B2 Methods for applying protective coatings to internal surfaces of fully assembled electronic devices 有权
标题翻译：将保护涂层施加到完全组装的电子设备的内表面的方法
公开(公告)号：US09596794B2
公开(公告)日：2017-03-14
申请号：US14178112
申请日：2014-02-11
申请人： HzO, Inc.
发明人： Blake Stevens , Max Sorenson , Paul S. Clayson , Scott B. Gordon
IPC分类号： B05D5/12 , H05K13/00 , H05K5/00 , H05K3/28 , C23C16/00 , H05K5/02
CPC分类号： H05K13/00 , C23C16/00 , H05K3/284 , H05K5/00 , H05K5/02 , H05K2201/0129 , H05K2203/1322 , H05K2203/1338 , H05K2203/1344 , H05K2203/1366 , Y10T29/49716 , Y10T29/5313
摘要： Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.
摘要翻译：公开了对已经组装并处于消费者准备或售后形式的电子设备施加保护涂层的方法。在这种方法中，电子设备可以至少部分地拆卸以暴露电子设备内部的至少一部分。对电子设备的一些或全部暴露的表面施加保护涂层，包括电子设备的一个或多个内表面，特征或部件。此后，可以重新组装电子设备。在重新组装期间和之后，保护涂层位于电子设备内部。还公开了将保护涂层施加到先前组装的电子器件的内部部件的系统。

12. 发明申请

US20140190000A1 SYSTEMS AND METHODS FOR PROVIDING REFURBISHED OR REMANUFACTURED ELECTRONIC DEVICES WITH MOISTURE-RESISTANT COATINGS 有权
标题翻译：用于提供具有防潮涂层的改性或重新配置的电子设备的系统和方法
公开(公告)号：US20140190000A1
公开(公告)日：2014-07-10
申请号：US14157780
申请日：2014-01-17
申请人： HzO, Inc.
发明人： Blake Stevens , Max Sorenson , Scott B. Gordon
IPC分类号： H05K13/00 , H05K3/30
CPC分类号： H05K3/30 , H05K3/225 , H05K3/284 , H05K3/288 , H05K13/0486 , H05K2203/176 , Y10T29/49002 , Y10T29/49004 , Y10T29/4913 , Y10T29/53174 , Y10T29/53274
摘要： An approach to refurbishing or remanufacturing an electronic device may involve exposing electrical components that are situated within an interior of the electronic device. The approach may also involve replacing one or more defective electronic components of the electronic device with one or more replacement components and applying a protective coating to at least a portion of the interior of the electronic device. The protective coating may cover the circuit board and the electronic components it carries. The protective coating may also cover at least some of the electrical connections of the electronic device. The protective coating may also be applied to the replacement component prior to reassembly. The resulting refurbished or remanufactured electronic device may thus be provided with moisture resistance to help protect the electronic device from damage caused by exposure to moisture.
摘要翻译：对电子设备进行翻新或再制造的方法可能包括暴露位于电子设备内部的电气部件。该方法还可以包括用一个或多个替换部件替换电子设备的一个或多个有缺陷的电子部件，并且将电子设备内部的至少一部分施加保护涂层。保护涂层可能覆盖电路板及其所携带的电子元件。保护涂层还可以覆盖电子设备的至少一些电连接。在重新组装之前，还可以将保护涂层施加到替换部件上。因此，所得到的翻新或再制造的电子设备可以具有防潮性，以帮助保护电子设备免受由于暴露于水分而引起的损害。

13. 发明申请

US20140160650A1 SYSTEMS AND METHODS FOR APPLYING PROTECTIVE COATINGS TO INTERNAL SURFACES OF FULLY ASSEMBLED ELECTRONIC DEVICES 有权
标题翻译：将保护涂层应用于完全组装的电子设备的内部表面的系统和方法
公开(公告)号：US20140160650A1
公开(公告)日：2014-06-12
申请号：US14178112
申请日：2014-02-11
申请人： HzO, Inc.
发明人： Blake Stevens , Max Sorenson , Paul S. Clayson , Scott B. Gordon
IPC分类号： H05K13/00 , H05K5/02 , C23C16/00
CPC分类号： H05K13/00 , C23C16/00 , H05K3/284 , H05K5/00 , H05K5/02 , H05K2201/0129 , H05K2203/1322 , H05K2203/1338 , H05K2203/1344 , H05K2203/1366 , Y10T29/49716 , Y10T29/5313
摘要： Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.
摘要翻译：公开了对已经组装并处于消费者准备或售后形式的电子设备施加保护涂层的方法。在这种方法中，电子设备可以至少部分地拆卸以暴露电子设备内部的至少一部分。对电子设备的一些或全部暴露的表面施加保护涂层，包括电子设备的一个或多个内表面，特征或部件。此后，可以重新组装电子设备。在重新组装期间和之后，保护涂层位于电子设备内部。还公开了将保护涂层施加到先前组装的电子器件的内部部件的系统。

14. 发明申请

US20130335898A1 SYSTEMS AND METHODS FOR APPLYING PROTECTIVE COATINGS TO INTERNAL SURFACES OF FULLY ASSEMBLED ELECTRONIC DEVICES 审中-公开
标题翻译：将保护涂层应用于完全组装的电子设备的内部表面的系统和方法
公开(公告)号：US20130335898A1
公开(公告)日：2013-12-19
申请号：US13920836
申请日：2013-06-18
申请人： HzO, Inc.
发明人： Blake Stevens , Max Sorenson , Paul S. Clayson , Scott B. Gordon
IPC分类号： H05K13/00 , H05K5/00
CPC分类号： H05K13/00 , C23C16/00 , H05K3/284 , H05K5/00 , H05K5/02 , H05K2201/0129 , H05K2203/1322 , H05K2203/1338 , H05K2203/1344 , H05K2203/1366 , Y10T29/49716 , Y10T29/5313
摘要： Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.
摘要翻译：公开了对已经组装并处于消费者准备或售后形式的电子设备施加保护涂层的方法。在这种方法中，电子设备可以至少部分地拆卸以暴露电子设备内部的至少一部分。对电子设备的一些或全部暴露的表面施加保护涂层，包括电子设备的一个或多个内表面，特征或部件。此后，可以重新组装电子设备。在重新组装期间和之后，保护涂层位于电子设备内部。还公开了将保护涂层施加到先前组装的电子器件的内部部件的系统。

15. 发明申请

US20200208258A1 APPARATUSES, SYSTEMS AND METHODS FOR PROTECTING ELECTRONIC DEVICE ASSEMBLIES 审中-公开
公开(公告)号：US20200208258A1
公开(公告)日：2020-07-02
申请号：US16818783
申请日：2020-03-13
申请人： HZO, Inc.
发明人： Max Sorenson , Blake Stevens , Alan Rae , Marc Kenneth Chason , Dana Cox , James Kent Naylor
IPC分类号： C23C16/02 , B08B17/06 , C23C16/04
摘要： An apparatus for applying a protective coating to a high volume of separate electronic device assemblies includes a treatment element that is configured to prepare the high volume of electronic devices before protective coatings are applied to the electronic devices. The apparatus also includes a coating element configured to apply protective coatings to the high volume of separate electronic device assemblies.

16. 发明授权

US10541529B2 Methods, apparatuses and systems for sensing exposure of electronic devices to moisture 有权
公开(公告)号：US10541529B2
公开(公告)日：2020-01-21
申请号：US14868825
申请日：2015-09-29
申请人： HZO, Inc.
发明人： Marcellus Harper , Jason Maynard , Blake Stevens , Max Sorenson
IPC分类号： H02H5/08 , G01N27/22 , G01R27/26 , G06F1/16 , G01N27/02 , G01R35/00 , H05B1/02 , G06F1/28
摘要： Systems, devices and methods for sensing moisture within an electronic device are disclosed. A device may include a housing and a display defining and exterior of an electronic device and an interior of the electronic device. Further, the device may include an integrated circuit (IC) within the electronic device and comprising a control element. The device may also include a moisture sensor such as an inductive sensor, a capacitance sensor, or both. The moisture sensor, which may be part of the IC, together with the control element may sense moisture within the electronic device.

17. 发明授权

US09627194B2 Methods for masking and applying protective coatings to electronic assemblies 有权
公开(公告)号：US09627194B2
公开(公告)日：2017-04-18
申请号：US14542318
申请日：2014-11-14
申请人： HZO, Inc.
发明人： Blake Stevens , Max Sorenson , Sidney Edward Martin, III
IPC分类号： H05K3/28 , H05K3/00 , H01L21/02 , H05K1/02 , B05C21/00 , H01L21/027 , H01L23/00
CPC分类号： H01L21/02299 , B05C21/005 , H01L21/027 , H01L23/564 , H01L2924/0002 , H05K1/02 , H05K3/0073 , H05K3/28 , H05K3/284 , Y10T29/49002 , H01L2924/00
摘要： One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

18. 发明授权

US09559514B2 Methods, apparatuses and systems for monitoring for exposure of electronic devices to moisture and reacting to exposure of electronic devices to moisture 有权
标题翻译：用于监测电子装置暴露于水分并使电子装置暴露于水分的方法，装置和系统
公开(公告)号：US09559514B2
公开(公告)日：2017-01-31
申请号：US14788436
申请日：2015-06-30
申请人： HZO, Inc.
发明人： Blake Stevens , Max Sorenson
IPC分类号： G08B21/00 , H02H5/08 , H02H5/00 , G06F1/16 , G06F1/28
CPC分类号： H02H5/083 , G06F1/1656 , G06F1/28 , H02H5/00
摘要： Systems and methods for monitoring the moisture to which an electronic device is exposed may alter or vary operation of the electronic device. Operation of the electronic device may be altered or varied to provide a notification that the electronic device has been exposed to moisture. When an electronic device is exposed to moisture, an operational mode of the electronic device may be changed. A change in the operational mode of the electronic device may include termination of the supply of power to one or more components, which may protect those components. Programs or apps that provide a user of the electronic device with information regarding exposure of the electronic device to an amount of moisture that meets or exceeds a moisture response threshold are also disclosed.
摘要翻译：用于监测电子设备暴露于水分的系统和方法可以改变或改变电子设备的操作。可以改变或改变电子设备的操作以提供电子设备暴露于湿气的通知。当电子设备暴露于潮湿时，可以改变电子设备的操作模式。电子设备的操作模式的改变可以包括终止向一个或多个组件供电，这可以保护这些组件。还公开了向电子设备的用户提供关于电子设备暴露于达到或超过水分响应阈值的水分量的信息的程序或应用程序。

19. 发明申请

US20150303680A1 METHODS, APPARATUSES AND SYSTEMS FOR MONITORING FOR EXPOSURE OF ELECTRONIC DEVICES TO MOISTURE AND REACTING TO EXPOSURE OF ELECTRONIC DEVICES TO MOISTURE 有权
标题翻译：用于监测电子设备暴露于水分和反应电子设备暴露于水分的方法，装置和系统
公开(公告)号：US20150303680A1
公开(公告)日：2015-10-22
申请号：US14788436
申请日：2015-06-30
申请人： HZO, Inc.
发明人： Blake Stevens , Max Sorenson
IPC分类号： H02H5/08
CPC分类号： H02H5/083 , G06F1/1656 , G06F1/28 , H02H5/00
摘要： Systems and methods for monitoring the moisture to which an electronic device is exposed may alter or vary operation of the electronic device. Operation of the electronic device may be altered or varied to provide a notification that the electronic device has been exposed to moisture. When an electronic device is exposed to moisture, an operational mode of the electronic device may be changed. A change in the operational mode of the electronic device may include termination of the supply of power to one or more components, which may protect those components. Programs or apps that provide a user of the electronic device with information regarding exposure of the electronic device to an amount of moisture that meets or exceeds a moisture response threshold are also disclosed.
摘要翻译：用于监测电子设备暴露于水分的系统和方法可以改变或改变电子设备的操作。可以改变或改变电子设备的操作以提供电子设备暴露于湿气的通知。当电子设备暴露于潮湿时，可以改变电子设备的操作模式。电子设备的操作模式的改变可以包括终止向一个或多个组件供电，这可以保护这些组件。还公开了向电子设备的用户提供关于电子设备暴露于达到或超过水分响应阈值的水分量的信息的程序或应用程序。

20. 发明授权

US09156055B2 Precursor supplies, material processing systems with which precursor supplies are configured to be used and associated methods 有权
标题翻译：前体供应品，材料处理系统，其前体供应被配置为使用和相关方法
公开(公告)号：US09156055B2
公开(公告)日：2015-10-13
申请号：US13737737
申请日：2013-01-09
申请人： HZO, Inc.
发明人： Blake Stevens , Max Sorenson , Liulei Cao
IPC分类号： B05C11/00 , B65B1/04 , B05C11/10 , B05D1/00
CPC分类号： B05C11/10 , B05D1/60 , B65B1/04 , G05B19/4155 , G05B2219/40361 , Y10T428/1352
摘要： In various aspects and embodiments, the present disclosure relates to the manner in which precursor materials are provided to processing equipment and, more specifically, to the manner in which precursor materials of organic polymers are delivered to systems for forming and, in some embodiments, depositing the organic polymers. In one aspect, the disclosure relates to precursor supplies, which comprise vehicles, such as binders, supports and cartridges, for delivering a precursor material to a material processing system, such as a deposition system or other processing equipment. In another aspect, the disclosure relates to material processing systems with which the precursor supplies are configured to be used. Methods for preparing precursor supplies, using precursor supplies, providing process control, and recycling precursor supplies are also disclosed.
摘要翻译：在各方面和实施方案中，本公开涉及将前体材料提供给加工设备的方式，更具体地，涉及将有机聚合物的前体材料递送到用于成型的系统的方式，并且在一些实施方案中，沉积有机聚合物。在一个方面，本公开涉及前体供应，其包括用于将前体材料输送到诸如沉积系统或其它加工设备的材料处理系统的载体，例如粘合剂，支撑体和筒。在另一方面，本公开涉及前体供应被配置为使用的材料处理系统。还公开了用于制备前体供应品，使用前体供应品，提供过程控制和再循环前体供应品的方法。

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