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    • 14. 发明授权
    • Semiconductor device forming method
    • 半导体器件形成方法
    • US06413805B1
    • 2002-07-02
    • US08670122
    • 1996-06-25
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • Hongyong ZhangToru TakayamaYasuhiko TakemuraAkiharu MiyanagaHisashi Ohtani
    • H01L2184
    • H01L29/045G09G2300/0408H01L21/02532H01L21/02672H01L27/1277H01L27/1296H01L29/66757
    • In thin film transistors (TFTS) having an active layer of crystalline silicon adapted for mass production, a catalytic element is introduced into doped regions of an amorphous silicon film by ion implantation or other means. This film is crystallized at a temperature below the strain point of the glass substrate. Further, a gate insulating film and a gate electrode are formed. Impurities are introduced by a self-aligning process. Then, the laminate is annealed below the strain point of the substrate to activate the dopant impurities. On the other hand, Neckel or other element is also used as a catalytic element for promoting crystallization of an amorphous silicon film. First, this catalytic element is applied in contact with the surface of the amorphous silicon film. The film is heated at 450 to 650° C. to create crystal nuclei. The film is further heated at a higher temperature to grow the crystal grains. In this way, a crystalline silicon film having improved crystallinity is formed.
    • 在具有适于批量生产的结晶硅活性层的薄膜晶体管(TFTS)中,通过离子注入或其它方法将催化元素引入到非晶硅膜的掺杂区域中。 该膜在低于玻璃基板的应变点的温度下结晶。 此外,形成栅极绝缘膜和栅电极。 杂质通过自对准过程引入。 然后,层压体在基板的应变点以下退火以活化掺杂剂杂质。 另一方面,Neckel或其它元素也用作促进非晶硅膜结晶的催化元素。 首先,将该催化元件与非晶硅膜的表面接触。 将膜在450至650℃加热以产生晶核。 将膜进一步在较高温度下加热以生长晶粒。 以这种方式,形成具有改善的结晶度的晶体硅膜。
    • 17. 发明授权
    • Method for manufacturing a semiconductor device
    • 半导体器件的制造方法
    • US06348367B1
    • 2002-02-19
    • US08861001
    • 1997-05-21
    • Hisashi OhtaniHiroki AdachiAkiharu MiyanagaToru Takayama
    • Hisashi OhtaniHiroki AdachiAkiharu MiyanagaToru Takayama
    • H01L2128
    • H01L21/02672H01L21/02532H01L21/2022H01L27/1214H01L27/1277H01L27/1292H01L29/66757
    • In a method for crystallizing an amorphous silicon film by a heat treatment that is effected for a duration of about 4 hours at about 550° C. using a catalyst element for accelerating the crystallization, the quantity of the catalyst element to be introduced into the amorphous silicon is precisely controlled. A resist mask 21 is formed on the surface of an amorphous silicon film 12 provided on a glass substrate 11, and an aqueous solution 14, e.g., an acetate solution, containing a catalyst element such as nickel at a concentration controlled in a range of from 10 to 200 ppm (need to be adjusted) is supplied dropwise thereto. After maintaining the state for a predetermined duration of time, the entire substrate is subjected to spin drying using a spinner 15. A thin film of crystalline silicon is finally obtained by applying heat treatment at 550° C. for a duration of 4 hours.
    • 在通过使用催化剂元素在约550℃下进行约4小时的热处理使非晶硅膜结晶的方法中,用于加速结晶的催化剂元素的量将被引入非晶态 硅精确控制。 在设置在玻璃基板11上的非晶硅膜12的表面上形成抗蚀剂掩模21和含有催化剂元素如镍的水溶液14,例如乙酸盐溶液,其浓度控制在 向其中滴加10〜200ppm(需要调节)。 在将状态保持预定的持续时间之后,使用旋转器15对整个基板进行旋转干燥。最后通过在550℃下进行热处理4小时来获得晶体硅薄膜。