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11. 发明授权

US08591614B2 Method of manufacturing exhaust gas purifying apparatus and exhaust gas purifying apparatus 有权
标题翻译：废气净化装置及排气净化装置的制造方法
公开(公告)号：US08591614B2
公开(公告)日：2013-11-26
申请号：US13352661
申请日：2012-01-18
申请人： Hisashi Ando , Takahiko Okabe
发明人： Hisashi Ando , Takahiko Okabe
IPC分类号： B01D50/00 , B01D39/06 , B01D24/00 , B01D39/14
CPC分类号： F01N13/008 , F01N3/2853 , F01N2350/02 , F01N2350/04 , F01N2450/02 , F01N2560/00
摘要： A method of manufacturing an exhaust gas purifying apparatus includes providing an exhaust gas-treating body. A holding sealing material is provided. The holding sealing material includes inorganic fibers. The holding sealing material has a first end face and a second end face each provided approximately in parallel with a width direction. The holding sealing material is wound around a periphery of the exhaust gas-treating body to form a gap between the first end face and the second end face. The exhaust gas-treating body with the holding sealing material is housed in a casing. At least one of a first electrode member and a first sensor is disposed at the gap of the holding sealing material so that at least one of the first electrode member and the first sensor is connected to the exhaust gas-treating body, passes through the holding sealing material, and penetrates the casing.
摘要翻译：废气净化装置的制造方法包括提供废气处理体。提供保持密封材料。保持密封材料包括无机纤维。保持密封材料具有大致平行于宽度方向的第一端面和第二端面。保持密封材料缠绕在废气处理体的周围，以在第一端面和第二端面之间形成间隙。具有保持密封材料的废气处理体容纳在壳体中。第一电极构件和第一传感器中的至少一个设置在保持密封材料的间隙处，使得第一电极构件和第一传感器中的至少一个与排气处理体连接，穿过保持密封材料，并穿透套管。

12. 发明授权

US08574335B2 Holding sealing material, exhaust gas purifying apparatus, and method of manufacturing exhaust gas purifying apparatus 有权
标题翻译：保持密封材料，废气净化装置和废气净化装置的制造方法
公开(公告)号：US08574335B2
公开(公告)日：2013-11-05
申请号：US13351225
申请日：2012-01-17
申请人： Hisashi Ando , Takahiko Okabe
发明人： Hisashi Ando , Takahiko Okabe
IPC分类号： B01D39/06 , B01D39/14 , B01D24/00 , B01D50/00
CPC分类号： F01N3/0211 , F01N3/2853 , F01N13/008 , Y02T10/20
摘要： A holding sealing material includes inorganic fibers, a mat shape, a first end face and a second end face and a penetration portion. The mat shape has a width direction, a length direction and a thickness direction. The first end face and the second end face are each provided approximately in parallel with the width direction. The penetration portion penetrates the holding sealing material in the thickness direction.
摘要翻译：保持密封材料包括无机纤维，垫子形状，第一端面和第二端面以及穿透部分。垫子形状具有宽度方向，长度方向和厚度方向。第一端面和第二端面分别设置成与宽度方向大致平行。穿透部在厚度方向上贯通保持密封材料。

13. 发明授权

US07842117B2 Holding sealer, exhaust gas processing device and manufacturing method of the same 有权
标题翻译：封口机，废气处理装置及其制造方法
公开(公告)号：US07842117B2
公开(公告)日：2010-11-30
申请号：US11760160
申请日：2007-06-08
申请人： Hisashi Ando , Tatsunari Yanagisawa
发明人： Hisashi Ando , Tatsunari Yanagisawa
IPC分类号： B01D39/00 , B01D39/06 , B01D39/14
CPC分类号： B01D46/2422 , B01D53/88 , B01D2271/02 , F01N3/2853 , F01N2350/06
摘要： The holding sealer comprises inorganic fibers, and the holding sealer has a first surface and a second surface, wherein the first surface has ditch-shaped structures.
摘要翻译：保持封口机包括无机纤维，并且保持封口器具有第一表面和第二表面，其中第一表面具有沟槽形结构。

14. 发明申请

US20060113356A1 Method and device for mounting electric component 有权
标题翻译：安装电气元件的方法和装置
公开(公告)号：US20060113356A1
公开(公告)日：2006-06-01
申请号：US11327784
申请日：2006-01-06
申请人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
发明人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
IPC分类号： A47J36/02
CPC分类号： B30B5/02 , B30B15/065 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/7598 , H01L2224/83101 , H01L2224/83855 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H05K3/323 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.
摘要翻译：提供了一种安装方法和安装装置，其可以通过使用粘合剂来安装具有高可靠性的电气部件。安装方法包括通过使用各向异性导电粘合剂膜将IC芯片热压接合到布线板上。在热压接期间，IC芯片的顶部区域以预定的压力压在布线板上，并且IC芯片的侧面区域以比被施加到IC芯片的顶部区域的压力更小的压力被按压。橡胶硬度为40以上且80以下的弹性体用于热压接头的压接部。各向异性导电粘合剂膜含有熔融粘度为1.0×10 -2 mPa·s以上且1.0×10 5 mPa·s以下的粘合树脂。

15. 发明授权

US4735847A Electrically conductive adhesive sheet, circuit board and electrical connection structure using the same 失效
标题翻译：导电胶片，电路板和电气连接结构使用相同
公开(公告)号：US4735847A
公开(公告)日：1988-04-05
申请号：US61608
申请日：1987-06-22
申请人： Yoshio Fujiwara , Naotake Kobayashi , Yuichi Matsubara , Hisashi Ando , Hidehiro Numao , Kazuaki Suzuki
发明人： Yoshio Fujiwara , Naotake Kobayashi , Yuichi Matsubara , Hisashi Ando , Hidehiro Numao , Kazuaki Suzuki
IPC分类号： H01R4/04 , H05K1/18 , H05K3/32 , H05K3/36 , B32B15/00 , B32B3/00
CPC分类号： H05K3/323 , H01R4/04 , H01L2224/16 , H01L2224/293 , H01L2224/45144 , H01L2224/83192 , H01L2924/01014 , H01L2924/01021 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01R12/51 , H01R12/52 , H01R12/59 , H01R12/62 , H05K1/181 , H05K2201/0129 , H05K2201/10689 , H05K2201/10719 , H05K2201/10977 , H05K2203/0425 , H05K2203/1311 , H05K3/361 , Y10S428/901 , Y10T428/24917 , Y10T428/256 , Y10T428/2857
摘要： An electrically conductive adhesive sheet is disclosed which has an electrically conducting property across a thickness thereof and an electrically insulating property along a sheet surface direction. The electrically conductive adhesive sheet comprises an electrically insulating adhesive material and electrically conductive metal powder uniformly dispersed therein. The metal powder has a melting point lower than a certain working temperature, and is flattened by application of pressure between a pair of conductors between which the adhesive sheet is provided. The adhesive material is molten at the certain working temperature and is flown by application of pressure. The adhesive sheet is useful to electrically connect a pair of circuit boards each having a plurality of conductor patterns thereon by bonding corresponding ones through the metal powder as molten, while keeping the neighboring patterns insulated. The circuit board is mechanically integrated simultaneously by the adhesive sheet. The circuit board and the connection structure using such an adhesive sheet as above are also disclosed.
摘要翻译：公开了一种导电粘合片，其具有贯穿其厚度的导电性和沿着片材表面方向的电绝缘性。导电粘合片包括电绝缘粘合剂材料和均匀分散在其中的导电金属粉末。金属粉末的熔点低于一定的工作温度，并且在设置有粘合片的一对导体之间施加压力而变平。粘合剂材料在一定的工作温度下熔融并通过施加压力而流动。粘合片用于通过将相应的电路板通过熔融的金属粉末粘合在一起而将其上具有多个导体图案的一对电路板电连接，同时保持相邻图案绝缘。电路板通过粘合片同时机械地集成。还公开了使用这种粘合片的电路板和连接结构。

16. 发明授权

US4651172A Information recording medium 失效
标题翻译：信息记录介质
公开(公告)号：US4651172A
公开(公告)日：1987-03-17
申请号：US801950
申请日：1985-11-26
申请人： Ryuji Watanabe , Tetsuro Minemura , Tetsuo Ito , Hisashi Ando , Yoshihito Maeda , Masaichi Nagai , Seiki Shimizu , Kiyoshi Konno , Toshiki Kaneko
发明人： Ryuji Watanabe , Tetsuro Minemura , Tetsuo Ito , Hisashi Ando , Yoshihito Maeda , Masaichi Nagai , Seiki Shimizu , Kiyoshi Konno , Toshiki Kaneko
IPC分类号： G11B7/24 , G11B7/2403 , G11B7/243 , G11B7/253 , G11B7/2531 , G11B7/2533 , G11B7/257 , G01D15/34 , B05D1/36 , G03C1/00
CPC分类号： G11B7/252 , G11B7/2403 , G11B7/243 , G11B7/257 , G11B2007/24304 , G11B2007/24308 , G11B2007/25706 , G11B2007/25715 , G11B7/00454 , G11B7/2531 , G11B7/2533 , Y10S428/913 , Y10S430/146
摘要： In an information recording medium having a recording layer for recording information by heating through incoming energy, at least one of an interference layer and an absorption layer for the incoming energy is provided on the energy-incoming side of the recording layer to reduce the reflected energy from the information recording medium and increase the quantity of heat input into the recording layer. The temperature of the recording layer is rapidly enhanced, and rapid writing is made possible thereby. Writing or erasing can be made with less incoming energy, and thus the writing sensitivity or erasing sensitivity of the information recording medium can be increased.
摘要翻译：在具有用于通过进入能量加热来记录信息的记录层的信息记录介质中，在记录层的能量入射侧提供用于输入能量的干涉层和吸收层中的至少一个，以减少反射能量并且增加输入到记录层中的热量。记录层的温度迅速提高，从而可以进行快速写入。可以以更少的入射能量进行写入或擦除，从而可以增加信息记录介质的写入灵敏度或擦除灵敏度。

17. 发明授权

US08632620B2 Holding sealing material, exhaust gas purifying apparatus, and method for manufacturing exhaust gas purifying apparatus 有权
标题翻译：保持密封材料，废气净化装置以及废气净化装置的制造方法
公开(公告)号：US08632620B2
公开(公告)日：2014-01-21
申请号：US13354340
申请日：2012-01-20
申请人： Hisashi Ando , Takahiko Okabe
发明人： Hisashi Ando , Takahiko Okabe
IPC分类号： B01D39/14 , B01D39/06 , B01D24/00 , B01D50/00
CPC分类号： F01N13/008 , F01N3/2853 , Y10T29/49002
摘要： A holding sealing material includes inorganic fibers, a mat shape, a first and a second end faces, a contact section and a void-forming section. The first end face and the second end face are approximately parallel in a width direction. The contact section includes a first distance between the first and the second end faces. The first distance is longest in a length direction. The void-forming section includes a second distance between the first and the second end faces. The second distance is shorter than the first distance. The holding sealing material has a structure to provide a void in a vicinity of the first and the second end faces of the void-forming section in a state where the holding sealing material is rolled up so that the first end face is made in contact with the second end face of the contact section.
摘要翻译：保持密封材料包括无机纤维，垫子形状，第一和第二端面，接触部分和空隙形成部分。第一端面和第二端面在宽度方向上大致平行。接触部分包括第一和第二端面之间的第一距离。第一个距离在长度方向上最长。空隙形成部分包括第一和第二端面之间的第二距离。第二距离比第一距离短。保持密封材料具有在保持密封材料被卷起的状态下在空隙形成部分的第一和第二端面附近提供空隙的结构，使得第一端面与接触部分的第二端面。

18. 发明授权

US07703657B2 Device for mounting electric component 有权
标题翻译：电气元件安装装置
公开(公告)号：US07703657B2
公开(公告)日：2010-04-27
申请号：US12466977
申请日：2009-05-15
申请人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
发明人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
IPC分类号： B23K37/00
CPC分类号： B30B5/02 , B30B15/065 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/7598 , H01L2224/83101 , H01L2224/83855 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H05K3/323 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anistropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.
摘要翻译：提供了一种安装方法和安装装置，其可以通过使用粘合剂来安装具有高可靠性的电气部件。安装方法包括通过使用各向异性导电粘合剂膜将IC芯片热压接合到布线板上。在热压接期间，IC芯片的顶部区域以预定的压力压在布线板上，并且IC芯片的侧面区域以比被施加到IC芯片的顶部区域的压力更小的压力被按压。橡胶硬度为40以上且80以下的弹性体用于热压接头的压接部。无纺布导电性粘合膜含有熔融粘度为1.0×10 2 mPa·s以上且1.0×10 5 mPa·s以下的粘结树脂。

19. 发明授权

US07446159B1 Curable resin composition 有权
标题翻译：可固化树脂组合物
公开(公告)号：US07446159B1
公开(公告)日：2008-11-04
申请号：US11902286
申请日：2007-09-20
申请人： Hiroshi Samukawa , Kouki Hatsuda , Yoshito Ikeda , Hisashi Ando , Norikazu Yamamoto
发明人： Hiroshi Samukawa , Kouki Hatsuda , Yoshito Ikeda , Hisashi Ando , Norikazu Yamamoto
IPC分类号： C08F222/14 , C08F2/46
CPC分类号： C08F222/1006 , C08F220/30
摘要： A resin composition having a viscosity suitable for encapsulating optical devices such as light-emitting devices is provided. Specifically, the cured product of the resin composition has a refractive index greater than or equal to that of epoxy resins, exhibits excellent heat resistance and light resistance, and has thermal stress relaxation properties. The curable resin composition contains a fluorene group-containing acrylate or methacrylate represented by the following formula and a specific monofunctional acrylate or methacrylate: wherein X is —(CH2CH2O)n— or —(CH2CH2O)—CH2CH(OH)CH2O— with n being 1 to 5 and R is an acrylic or methacrylic group.
摘要翻译：提供了一种具有适合于封装诸如发光装置的光学装置的粘度的树脂组合物。具体而言，树脂组合物的固化物的折射率大于或等于环氧树脂的折射率，耐热性和耐光性优异，具有热应力松弛性。可固化树脂组合物含有由下式表示的含芴基的丙烯酸酯或甲基丙烯酸酯和特定的单官能丙烯酸酯或甲基丙烯酸酯：其中X是 - （CH 2 CH 2 CH 2 O ） - 或 - （CH 2 CH 2 CH 2）-CH 2 CH（OH）CH

20. 发明授权

US07018466B2 Process for producing a concrete and a mortar 失效
标题翻译：生产混凝土和砂浆的方法
公开(公告)号：US07018466B2
公开(公告)日：2006-03-28
申请号：US11032966
申请日：2005-01-10
申请人： Motoyuki Suzuki , Kazuhiro Kasai , Masato Terazawa , Kazuyuki Nishiura , Hisashi Ando , Toshihiko Kawamura
发明人： Motoyuki Suzuki , Kazuhiro Kasai , Masato Terazawa , Kazuyuki Nishiura , Hisashi Ando , Toshihiko Kawamura
IPC分类号： C04B28/00
CPC分类号： C04B40/0042 , C04B12/04 , C04B20/023 , C04B24/04 , C04B28/02
摘要： A concrete admixture or a mortar admixture which is obtained by mixing a silicate with an acid in the presence of water and then solidifying the mixture. It is preferable that the silicate is sodium silicate and the acid is a carboxylic acid. This admixture can improve a tensile strength of a concrete or a mortar. Since a concrete or a mortar containing the admixture, cement, an aggregate and water is high in tensile strength, it can advantageously be used in various concrete structures, concrete products or mortar products.
摘要翻译：混凝土外加剂或砂浆混合物，其通过在水存在下将硅酸盐与酸混合，然后使混合物固化而获得。硅酸盐优选为硅酸钠，酸为羧酸。这种混合物可以提高混凝土或砂浆的拉伸强度。由于含有混合物，水泥，骨料和水的混凝土或砂浆的拉伸强度高，因此可有利地用于各种混凝土结构，混凝土产品或砂浆产品。

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