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11. 发明授权

US5216807A Method of producing electrical connection members 失效
标题翻译：电连接件的制造方法
公开(公告)号：US5216807A
公开(公告)日：1993-06-08
申请号：US832653
申请日：1992-02-11
申请人： Tetsuo Yoshizawa , Yoshimi Terayama , Hiroshi Kondo , Takashi Sakaki , Shunichi Haga , Yasuteru Ichida , Masaki Konishi
发明人： Tetsuo Yoshizawa , Yoshimi Terayama , Hiroshi Kondo , Takashi Sakaki , Shunichi Haga , Yasuteru Ichida , Masaki Konishi
IPC分类号： H01L21/48 , H01L23/498
CPC分类号： H01L23/49827 , H01L21/486 , H01L2224/16 , H01L2924/01004 , H01L2924/01014 , H01L2924/0102 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/3025 , Y10T29/49208
摘要： A method of producing an electrical connection member includes the steps of applying a carrier containing a light-sensitive resin onto a substrate member, forming holes in portions of the carrier to form a pattern and expose the substrate member in the holes, filling each hole in the carrier with an electrically conductive member, and removing the substrate member from the carrier. With this method, it is possible to easily produce electrical connection members in which high density electrical connecting portions can be provided and in which the reliability and security of electrical connections can be improved.
摘要翻译：制造电连接部件的方法包括以下步骤：将含有感光树脂的载体施加到基板部件上，在载体的一部分上形成孔以形成图案，并将基板部件暴露在孔中，所述载体具有导电构件，并且从所述载体移除所述基底构件。利用这种方法，可以容易地制造可以提供高密度电连接部分并且可以提高电连接的可靠性和安全性的电连接构件。

12. 发明授权

US5283468A Electric circuit apparatus 失效
标题翻译：电路设备
公开(公告)号：US5283468A
公开(公告)日：1994-02-01
申请号：US43629
申请日：1993-04-08
申请人： Hiroshi Kondo , Yoshimi Terayama , Takashi Sakaki , Shunichi Haga , Tetsuo Yoshizawa , Yasuteru Ichida , Masaki Konishi
发明人： Hiroshi Kondo , Yoshimi Terayama , Takashi Sakaki , Shunichi Haga , Tetsuo Yoshizawa , Yasuteru Ichida , Masaki Konishi
IPC分类号： H01L21/68 , H01L23/10 , H01L23/498 , H01L25/065 , H01L23/16 , H01L39/02 , H01L23/48
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/10 , H01L23/49827 , H01L24/96 , H01L25/0655 , H01L2221/68359 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/15787 , H01L2924/16152 , H01L2924/1627 , H01L2924/16315 , H01L2924/3025 , H01L2924/351
摘要： An electric circuit apparatus comprises an electrically connecting member including a holding body made of an electrically insulating material and a plurality of electrically conductive members embedded in the holding body. First end portions of the electrically conductive member extend through a first side of the holding body and second end portions of the electrically conductive member extend through the other side of the holding body. A plurality of electric circuit components are connected to the second end portions of the electrically conductive members.
摘要翻译：电路装置包括电连接构件，其包括由电绝缘材料制成的保持体和嵌入保持体中的多个导电构件。导电构件的第一端部延伸穿过保持体的第一侧，并且导电构件的第二端部延伸穿过保持体的另一侧。多个电路部件连接到导电部件的第二端部。

13. 发明授权

US4926549A Method of producing electrical connection members 失效
标题翻译：电连接件的制造方法
公开(公告)号：US4926549A
公开(公告)日：1990-05-22
申请号：US358269
申请日：1989-05-30
申请人： Tetsuo Yoshizawa , Yoshimi Terayama , Hiroshi Kondo , Takashi Sakaki , Shunichi Haga , Yasuteru Ichida , Masaki Konishi
发明人： Tetsuo Yoshizawa , Yoshimi Terayama , Hiroshi Kondo , Takashi Sakaki , Shunichi Haga , Yasuteru Ichida , Masaki Konishi
IPC分类号： H01R43/00 , G01R1/073 , H01L21/48 , H01L21/60 , H01L23/498
CPC分类号： H01L23/49827 , H01L21/486 , H01L2224/16 , H01L2924/01004 , H01L2924/01014 , H01L2924/0102 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/3025 , Y10T29/49208
摘要： A method of producing electrical connection members includes the steps of forming a carrier on a first electrically conductive member, etching holes in portions of the carrier to expose first electrically conductive member in the holes, and etching the portions of the first electrically conductive member which are exposed in the respective holes to form recesses in the first electrically conductive member so that each of the recesses has a diameter larger than the diameter of a corresponding one of the holes. The respective holes formed in the carrier are filled with second electrically conductive members, and then the first electrically conductive member is removed from the carrier. With this method, it is possible to easily produce electrical connection members in which high density electrical connecting portions can be provided and in which the reliability and security of electrical connections can be improved.

14. 发明授权

US5606263A Probe method for measuring part to be measured by use thereof and electrical circuit member 失效
标题翻译：用于测量使用的部件和电路部件的探针方法
公开(公告)号：US5606263A
公开(公告)日：1997-02-25
申请号：US620393
申请日：1996-03-22
申请人： Tetsuo Yoshizawa , Masaaki Imaizumi , Hideyuki Nishida , Hiroshi Kondo , Takashi Sakaki , Yasuteru Ichida , Masaki Konishi
发明人： Tetsuo Yoshizawa , Masaaki Imaizumi , Hideyuki Nishida , Hiroshi Kondo , Takashi Sakaki , Yasuteru Ichida , Masaki Konishi
IPC分类号： G01R1/073
CPC分类号： G01R1/07307
摘要： An electrical circuit member comprises an electrical connecting member, said electrical connecting member having a holding member comprising an electrically insulating material and a plurality of electroconductive members embedded at predetermined intervals within said holding member, each of said plurality of electroconductive members being insulated with said electrically insulating material and also having the ends of said electroconductive member exposed on both surfaces of said holding member; and an electrical circuit part, said electrical circuit part having connecting portions to be connected to said electroconductive member or said wiring pattern exposed on both surfaces of said holding member, and being connected to at least one surface of said holding member.
摘要翻译：电路构件包括电连接构件，所述电连接构件具有保持构件，所述保持构件包括电绝缘材料和在所述保持构件内以预定间隔嵌入的多个导电构件，所述多个导电构件中的每一个与所述电气绝缘材料绝缘绝缘材料，并且还使所述导电构件的端部暴露在所述保持构件的两个表面上; 和电路部分，所述电路部分具有连接到所述导电部件或暴露在所述保持部件的两个表面上的所述布线图形的连接部分，并连接到所述保持部件的至少一个表面。

15. 发明授权

US5197892A Electric circuit device having an electric connecting member and electric circuit components 失效
标题翻译：具有电连接部件和电路部件的电路装置
公开(公告)号：US5197892A
公开(公告)日：1993-03-30
申请号：US677379
申请日：1991-03-27
申请人： Tetsuo Yoshizawa , Yoshimi Tarayama , Hiroshi Kondo , Takashi Sakaki , Shunichi Haga , Yasuteru Ichida , Masaki Konishi
发明人： Tetsuo Yoshizawa , Yoshimi Tarayama , Hiroshi Kondo , Takashi Sakaki , Shunichi Haga , Yasuteru Ichida , Masaki Konishi
IPC分类号： H01L23/29 , H01L23/498 , H01L23/552 , H05K3/32
CPC分类号： H01L23/552 , H01L23/295 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01004 , H01L2924/01014 , H01L2924/0102 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/15153 , H01L2924/15165 , H01L2924/3025 , H05K3/321
摘要： An electric circuit device comprises an electric connecting member comprising a support member made of an electrically insulating material and a plurality of electrically conductive members buried in the support member and being isolated from one another. The ends of one side of the electrically conductive members are exposed at one surface of the support member, and the ends on the other side of the electrically conductive members are exposed at another surface of the support member. A first electric circuit component has connecting regions connected to the one set of ends of the electrically conductive members, and a second electric circuit component has connecting regions connected to the other set of ends of the electrically conductive members. Some of the electrically conductive members can be arranged in a zigzag pattern, and the pattern of the exposed ends of at least one electrically conductive member is wave-like or S-like.
摘要翻译：电路装置包括电连接构件，电连接构件包括由电绝缘材料制成的支撑构件和埋在支撑构件中并彼此隔离的多个导电构件。导电构件的一侧的端部在支撑构件的一个表面处露出，并且导电构件的另一侧上的端部在支撑构件的另一个表面处露出。第一电路部件具有连接到导电构件的一组端部的连接区域，并且第二电路部件具有连接到导电构件的另一组端部的连接区域。一些导电构件可以以锯齿形图案布置，并且至少一个导电构件的露出端的图案是波浪形或类似S形。

16. 发明授权

US5058800A Method of making electric circuit device 失效
标题翻译：制造电路设备的方法
公开(公告)号：US5058800A
公开(公告)日：1991-10-22
申请号：US358639
申请日：1989-05-30
申请人： Tetsuo Yoshizawa , Hiroshi Kondo , Takashi Sakaki , Masaaki Imaizumi , Hideyuki Nishida , Yasuteru Ichida , Masaki Konishi
发明人： Tetsuo Yoshizawa , Hiroshi Kondo , Takashi Sakaki , Masaaki Imaizumi , Hideyuki Nishida , Yasuteru Ichida , Masaki Konishi
IPC分类号： H01L21/00 , H01R4/02 , H05K3/32 , H05K3/34
CPC分类号： H01L21/67138 , H01R4/02 , H01L2224/83222 , H01L2924/01079 , H01L2924/01327 , H01L2924/1815 , H05K3/321 , H05K3/3494
摘要： A method of making an electric circuit device by connecting first and second electrical circuit components through an electrical connecting member. The method comprises effecting internal heating such as supersonic heating, high-frequency induction heating, high-frequency dielectric heating or microwave heating at first connecting regions between the connecting portions of the first electrical circuit component and the first ends of the electrically conductive members of the electrical connecting member. The same internal heating may also be effected at second connecting regions between the connecting portions of the second electrical circuit component and the second ends of the electrically conductive members of the electrical connecting member. In consequence, alloying takes place in first and second connecting regions so as to connect the first and second electrical circuit components through the electrical connecting member.

17. 发明授权

US5967804A Circuit member and electric circuit device with the connecting member 失效
标题翻译：连接构件和电路装置与连接构件
公开(公告)号：US5967804A
公开(公告)日：1999-10-19
申请号：US597383
申请日：1996-02-08
申请人： Tetsuo Yoshizawa , Hideyuki Nishida , Masaaki Imaizumi , Yasuteru Ichida , Masaki Konishi , Hiroshi Kondo , Takashi Sakaki
发明人： Tetsuo Yoshizawa , Hideyuki Nishida , Masaaki Imaizumi , Yasuteru Ichida , Masaki Konishi , Hiroshi Kondo , Takashi Sakaki
IPC分类号： H01L21/60 , H01L23/14 , H01L23/15 , H01L23/31 , H01L23/495 , H01L23/498 , H01R9/09
CPC分类号： H01L24/83 , H01L23/145 , H01L23/15 , H01L23/315 , H01L23/49531 , H01L23/49827 , H01L23/49866 , H01L24/29 , H01L24/32 , H01L2224/16225 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29499 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73253 , H01L2224/73265 , H01L2224/8319 , H01L2224/83439 , H01L2224/838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/15174 , H01L2924/15312 , H01L2924/1532 , H01L2924/15738 , H01L2924/1576 , H01L2924/16152 , H01L2924/181 , H01L2924/20752 , H01L2924/3025 , H01L2924/351
摘要： An electrical connecting member for use in an electrical connection for connecting a first electrical circuit component on a side thereof and a second electrical circuit component on another side thereof, said electrical connecting member comprising: a plurality of layers each layer having a plurality of conductive members and an insulative holder for holding said plurality of conductive members, wherein said plurality of conductive members are arranged such that each conductive member has one end exposed on one surface of said layer and another end exposed on another surface of said layer, and makes electric contact with at least one of a conductive member immediately below and a conductive member immediately above, but does not contact conductive members laterally offset thereof, and wherein said conductive members have diameters that are substantially equal to each other, between said one surface of said layer and said another surface of said layer; and said plurality of layers are stacked such that said plurality of conductive members in one layer are connected with said plurality of conductive members in another layer, and are held by said insulative holder with a different pitch shifted slightly from said plurality of conductive members in another layer. It is a further object to provide an electrical member and an electrical circuit device which employ such an electrical connecting member.
摘要翻译：一种用于电连接的电连接构件，用于连接其一侧上的第一电路部件和在其另一侧上的第二电路部件，所述电连接构件包括：多个层，每层具有多个导电构件以及用于保持所述多个导电构件的绝缘保持器，其中所述多个导电构件布置成使得每个导电构件具有在所述层的一个表面上暴露的一端，而在所述层的另一表面上暴露的另一端，并且进行电接触其中紧邻在下方的导电部件中的至少一个和紧接在上方的导电部件，但不接触横向偏移的导电部件，并且其中所述导电部件具有在所述层的所述一个表面和所述层的另一表面; 并且所述多个层被堆叠，使得一层中的所述多个导电构件与另一层中的所述多个导电构件连接，并且由所述绝缘保持器以与另一层中的所述多个导电构件稍微偏移的不同节距保持层。另一个目的是提供一种使用这种电连接构件的电气构件和电路装置。

18. 发明申请

US20130281726A1 METHOD FOR RECOVERING PRECIOUS METAL FROM SOLUTION CONTAINING PRECIOUS METAL IONS, EXTRACTING AGENT OR ADSORBENT USED THEREFOR, AND BACK-EXTRACTING AGENT OR DESORBENT 有权
标题翻译：用于从含有优质金属离子的溶液，萃取剂或其使用的吸附剂以及后处理剂或吸附剂中回收重金属的方法
公开(公告)号：US20130281726A1
公开(公告)日：2013-10-24
申请号：US13976591
申请日：2011-12-28
申请人： Yukinori Suso , Takashi Sakaki
发明人： Yukinori Suso , Takashi Sakaki
IPC分类号： C22B3/00 , C25C1/00
CPC分类号： C22B11/04 , B01J20/3204 , B01J20/3251 , B01J23/96 , B01J38/48 , C07C323/60 , C07D285/00 , C22B3/0005 , C22B3/24 , C25C1/00 , C25C1/20 , Y02P10/234 , Y02P20/584
摘要： To provide a method for recovering a precious metal from a solution containing precious metal ions, an extracting agent or adsorbent used therefor, and a back-extracting agent or desorbent.An extracting agent or adsorbent in which precious metal ions are extracted or adsorbed, is brought into contact with a back-extracting agent or desorbent containing a sulfur-containing amino acid derivative represented by the following formula (I): wherein R1 is a methyl group, an ethyl group, a vinyl group, a C3-8 linear, branched or cyclic hydrocarbon group, or a C6-14 aromatic hydrocarbon group, R2's are each independently a hydrogen atom, a methyl group, an ethyl group, a vinyl group, a C3-8 linear, branched or cyclic hydrocarbon group or a C6-14 aromatic hydrocarbon group, and n is 0 or 1, to obtain a solution containing the precious metal ions, which is subjected to a reduction treatment to obtain a precious metal.
摘要翻译：提供从含有贵金属离子的溶液中回收贵金属的方法，用于其的提取剂或吸附剂，以及反萃取剂或解吸剂。使提取或吸附贵金属离子的萃取剂或吸附剂与含有下式（I）表示的含硫氨基酸衍生物的反萃取剂或解吸剂接触：其中R1为甲基乙基，乙烯基，C 3-8直链，支链或环状烃基或C 6-14芳族烃基，R 2各自独立地为氢原子，甲基，乙基，乙烯基， C 3-8直链，支链或环状烃基或C 6-14芳族烃基，并且n为0或1，以获得含有贵金属离子的溶液，进行还原处理以获得贵金属。

19. 发明授权

US08173542B2 Method of forming conductive layer and semiconductor device 有权
标题翻译：形成导电层和半导体器件的方法
公开(公告)号：US08173542B2
公开(公告)日：2012-05-08
申请号：US12634619
申请日：2009-12-09
申请人： Takashi Sakaki
发明人： Takashi Sakaki
IPC分类号： H01L23/52
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/12044 , H01L2924/00012 , H01L2924/00
摘要： Provided are a method of forming a conductive layer on an inner portion of a through-electrode in which uniform adhesion property of plating in the inner portion of a through-hole is enhanced and a tact time is short, and a semiconductor device. The method of forming a conductive layer includes: a first plating step of forming a first plating layer on the inner portion of the through-hole; a plating suppression layer forming step of forming a plating suppression layer including a material different from a material of the first plating layer in an opening portion of the through-hole after the first plating step; and a second plating step of forming a second plating layer by plating on the inner portion of the through-hole after the plating suppression layer forming step.
摘要翻译：提供一种在贯通电极的内部形成导电层的方法，其中贯通电极的内部部分中的镀层的均匀粘合性能增强并且节拍时间短，并且半导体器件。形成导电层的方法包括：在通孔的内部形成第一镀层的第一镀层步骤; 电镀抑制层形成步骤，在第一电镀步骤之后，在所述通孔的开口部分中形成包括与所述第一镀层的材料不同的材料的镀覆抑制层; 以及第二电镀步骤，在镀覆抑制层形成步骤之后通过电镀在通孔的内部上形成第二镀层。

20. 发明授权

US5827413A Low hydrogen over voltage cathode and process for production thereof 失效
标题翻译：低氢过电压阴极及其生产方法
公开(公告)号：US5827413A
公开(公告)日：1998-10-27
申请号：US736083
申请日：1996-10-24
申请人： Kazuhisa Yamaguchi , Kanji Yoshimitsu , Satoshi Yoshida , Kazumasa Suetsugu , Takashi Sakaki
发明人： Kazuhisa Yamaguchi , Kanji Yoshimitsu , Satoshi Yoshida , Kazumasa Suetsugu , Takashi Sakaki
IPC分类号： C25B11/04 , C25B11/06
CPC分类号： C25B11/0478
摘要： A low hydrogen overvoltage cathode is provided which comprises an electroconductive base material coated with an alloy layer containing cobalt and tin at least at a content of tin ranging from 0.01 to 95% by weight. A process is also provided for producing the low hydrogen voltage cathode, wherein cobalt and tin at least are electrolytically co-deposited onto a surface of an electroconductive base material from a plating bath containing cobalt ions, tin ions, and a complexing agent.
摘要翻译：提供了一种低氢过电压阴极，其包括涂覆有含有钴和锡的合金层的导电基材，所述合金层至少含有0.01至95重量％的锡含量。还提供了一种用于生产低氢电压阴极的方法，其中钴和锡至少从含有钴离子，锡离子和络合剂的镀浴电解共沉积到导电基材的表面上。

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