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    • 11. 发明授权
    • Method for reducing surface protrusions in the fabrication of lilac films
    • 淡紫膜制造中减少表面突起的方法
    • US06709910B1
    • 2004-03-23
    • US10273549
    • 2002-10-18
    • Mark A. CrowderApostolos T. VoutsasMasahiro Adachi
    • Mark A. CrowderApostolos T. VoutsasMasahiro Adachi
    • H01L21336
    • H01L21/02675H01L21/2022H01L21/2026
    • A system and method are provided for reducing film surface protrusions in the fabrication of LILAC films. The method comprises: forming an amorphous film with a first thickness; annealing the film using a LILAC process, with beamlets having a width in the range of 3 to 10 microns; in response to annealing, forming protrusions on the film surface; optionally oxidizing the film surface; thinning the film; and, in response to thinning the film, smoothing the film surface. Typically, the film surface is smoothed to a surface flatness of 300 Å, or less. In some aspects of the method, oxidizing the film surface includes oxidizing the film surface to a depth. Then, thinning the film includes thinning the film to a third thickness equal to the first thickness minus the depth.
    • 提供了一种用于在LILAC膜的制造中减少膜表面突起的系统和方法。 该方法包括:形成具有第一厚度的非晶膜; 使用LILAC工艺对膜进行退火,其中子束的宽度在3至10微米的范围内; 响应于退火,在膜表面上形成突起; 可选地氧化膜表面; 弄薄膜; 并且,为了使薄膜变薄,平滑膜表面。 通常,膜表面平滑至300或更小的表面平坦度。 在该方法的一些方面,氧化膜表面包括将膜表面氧化至深度。 然后,使薄膜变薄包括将薄膜变薄至等于第一厚度减去深度的第三厚度。
    • 12. 发明授权
    • Charge pumping circuit and PLL frequency synthesizer
    • 充电泵浦电路和PLL频率合成器
    • US6111469A
    • 2000-08-29
    • US137144
    • 1998-08-20
    • Masahiro Adachi
    • Masahiro Adachi
    • H03L7/093H03L7/089H03L7/18H03L7/085
    • H03L7/0895H03L7/18
    • A charge pumping circuit includes a constant current source, a switch element, a first MOS transistor, a second MOS transistor, and a switching-off circuit. The constant current source generates and outputs a current having a constant current value. The switch element is turned on and outputs a current determined by the constant current source when an input signal is active. The first MOS transistor flows the current output from the switch element. The second MOS transistor constitutes a current mirror circuit together with the first MOS transistor, and outputs a current having a current value based on the current flowing through the first MOS transistor, as one of charge and discharge currents. The switching-off circuit turns off the second MOS transistor by charging or discharging the gate when the input signal is inactive.
    • 电荷泵浦电路包括恒流源,开关元件,第一MOS晶体管,第二MOS晶体管和关断电路。 恒流源产生并输出具有恒定电流值的电流。 当输入信号有效时,开关元件导通,输出由恒流源确定的电流。 第一MOS晶体管流过开关元件的电流输出。 第二MOS晶体管与第一MOS晶体管一起构成电流镜电路,并且将基于流经第一MOS晶体管的电流的电流值的电流输出为充放电电流之一。 当输入信号无效时,关断电路通过对栅极充电或放电来关断第二MOS晶体管。
    • 18. 发明授权
    • Group-III nitride semiconductor laser device, and method of fabricating group-III nitride semiconductor laser device
    • III族氮化物半导体激光器件及III族氮化物半导体激光器件的制造方法
    • US08306082B2
    • 2012-11-06
    • US12846361
    • 2010-07-29
    • Yusuke YoshizumiYohei EnyaTakashi KyonoMasahiro AdachiKatsushi AkitaMasaki UenoTakamichi SumitomoShinji TokuyamaKoji KatayamaTakao NakamuraTakatoshi Ikegami
    • Yusuke YoshizumiYohei EnyaTakashi KyonoMasahiro AdachiKatsushi AkitaMasaki UenoTakamichi SumitomoShinji TokuyamaKoji KatayamaTakao NakamuraTakatoshi Ikegami
    • H01S5/00
    • H01S5/34333B82Y20/00H01L21/02389H01L21/02433H01S5/0014H01S5/0021H01S5/0202H01S5/2009H01S5/3202H01S5/3211
    • A group-III nitride semiconductor laser device comprises a laser structure including a support base and a semiconductor region, and an electrode provided on the semiconductor region of the laser structure. The support base comprises a hexagonal group-III nitride semiconductor and has a semipolar primary surface, and the semiconductor region is provided on the semipolar primary surface of the support base. The semiconductor region includes a first cladding layer of a first conductivity type gallium nitride-based semiconductor, a second cladding layer of a second conductivity type gallium nitride-based semiconductor, and an active layer. The first cladding layer, the second cladding layer, and the active layer are arranged along a normal axis to the semipolar primary surface. The active layer comprises a gallium nitride-based semiconductor layer. The c-axis of the hexagonal group-III nitride semiconductor of the support base tilts at a finite angle ALPHA with respect to a normal axis toward an a-axis of the hexagonal group-III nitride semiconductor. The laser structure includes first and second fractured faces intersecting with an a-n plane defined by the normal axis and the a-axis of the hexagonal group-III nitride semiconductor. The laser cavity of the group-III nitride semiconductor laser device includes the first and second fractured faces. The laser structure includes first and second surfaces and the first surface is opposite to the second surface, and each of the first and second fractured faces extends from an edge of the first surface to an edge of the second surface.
    • III族氮化物半导体激光器件包括具有支撑基极和半导体区域的激光器结构以及设置在激光器结构的半导体区域上的电极。 支撑基底包括六方晶III族氮化物半导体,并且具有半极性主表面,并且半导体区域设置在支撑基底的半极性主表面上。 半导体区域包括第一导电型氮化镓基半导体的第一包覆层,第二导电型氮化镓基半导体的第二包覆层和有源层。 第一包层,第二包覆层和有源层沿着正交轴线配置到半极性主表面。 有源层包括氮化镓基半导体层。 支撑基座的六角形III族氮化物半导体的c轴相对于六边形III族氮化物半导体的a轴的法线轴线以有限角度ALPHA倾斜。 激光结构包括与由六角形III族氮化物半导体的法线轴和a轴限定的a-n平面相交的第一和第二断裂面。 III族氮化物半导体激光器件的激光腔包括第一和第二断裂面。 激光结构包括第一表面和第二表面,并且第一表面与第二表面相对,并且第一和第二断裂面中的每一个从第一表面的边缘延伸到第二表面的边缘。