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11. 发明申请

US20100170701A1 POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, MATERIAL FOR FLEXIBLE SUBSTRATE, FLEXIBLE LAMINATE, AND FLEXIBLE PRINT WIRING BOARD 有权
标题翻译：聚酰胺树脂，胶粘剂，柔性基材材料，柔性层压板和柔性印刷接线板
公开(公告)号：US20100170701A1
公开(公告)日：2010-07-08
申请号：US12444234
申请日：2007-08-20
申请人： Masaki Takeuchi , Katsuyuki Masuda , Kenichi Tomioka , Takako Ejiri
发明人： Masaki Takeuchi , Katsuyuki Masuda , Kenichi Tomioka , Takako Ejiri
IPC分类号： H05K1/00 , C08G73/14 , B32B15/08
CPC分类号： B32B7/12 , B32B3/085 , B32B15/08 , B32B15/088 , B32B27/08 , B32B27/34 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/726 , B32B2457/08 , C08G18/5036 , C08G18/5057 , C08G18/615 , C08G73/14 , C09J179/08 , H05K1/0346 , H05K1/0393 , H05K3/386 , H05K2201/0154 , Y10S428/901 , Y10T428/31515 , Y10T428/31522 , Y10T428/31681 , Y10T428/31721
摘要： A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).
摘要翻译：通过包括使芳族二异氰酸酯与含有40mol％以上由以下通式（1）表示的化合物和20mol％以上的化合物表示的二酰亚胺二羧酸反应的方法获得的聚酰胺酰亚胺树脂通过以下通式（2）。

12. 发明授权

US07648770B2 Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet 有权
标题翻译：底漆，带树脂的导体箔，层叠片及其制造方法
公开(公告)号：US07648770B2
公开(公告)日：2010-01-19
申请号：US10557728
申请日：2004-05-21
申请人： Kenji Tanaka , Kazumasa Takeuchi , Nobuyuki Ogawa , Katsuyuki Masuda
发明人： Kenji Tanaka , Kazumasa Takeuchi , Nobuyuki Ogawa , Katsuyuki Masuda
IPC分类号： B32B15/08
CPC分类号： B32B27/36 , B32B7/04 , B32B15/08 , B32B25/08 , B32B25/14 , B32B27/08 , B32B27/281 , B32B27/322 , B32B2307/202 , B32B2307/206 , B32B2307/748 , B32B2457/00 , C08G73/14 , H05K3/386 , H05K2201/0358 , Y10T156/10 , Y10T428/24355 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.
摘要翻译：本发明的目的是提供一种树脂底漆，其可以将绝缘体层粘附到具有足够的粘合力的表面不被粗糙化的导体箔上，具有树脂的导体箔，层压片及其制造方法。本发明的树脂底漆包括具有成膜能力和断裂能为0.15J以上的树脂。本发明的具有树脂的导体箔包括由导体箔和上述树脂底漆构成的树脂层。此外，本发明的层压片包括导体箔，与导体箔相对设置的绝缘层，以及包含设置在导体箔与绝缘层之间的上述树脂底漆的树脂层，使其与其接触。该层叠片材可以通过用树脂对包含上述导体箔的层压体进行加热加压，并将该层压在该树脂层上的预浸料坯来制造。

13. 发明申请

US20050181609A1 Polishing fluid and polishing method 有权
标题翻译：抛光液和抛光方法
公开(公告)号：US20050181609A1
公开(公告)日：2005-08-18
申请号：US10513002
申请日：2003-04-28
申请人： Yasushi Kurata , Katsuyuki Masuda , Hiroshi Ono , Yasuo Kamigata , Kazuhiro Enomoto
发明人： Yasushi Kurata , Katsuyuki Masuda , Hiroshi Ono , Yasuo Kamigata , Kazuhiro Enomoto
IPC分类号： B24B37/00 , C09G1/02 , C09G1/04 , H01L21/321 , H01L21/302 , H01L21/461
CPC分类号： B24B37/0056 , B24B37/044 , C09G1/02 , C09G1/04 , C09K3/1463 , H01L21/3212
摘要： A polishing slurry including an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5. The metal oxide dissolver contains one or more types selected from one or more acids (A-group) selected from acids of which the dissociation constant (pKa) of a first dissociable acid group is less than 3.7 and from which five acids of lactic acid, phthalic acid, fumaric acid, maleic acid and aminoacetic acid are excluded, ammonium salts of the A-group and esters of the A-group, and one or more types selected from one or more acids (B-group) selected from acids of which the dissociation constant (pKa) of a first dissociable acid group is 3.7 or more and the five acids, ammonium salts of the B-group and esters of the B-group. The metal inhibitor contains one or more types selected from the group consisting of aromatic compounds having a triazole skeleton and one or more types selected from the group consisting of aliphatic compounds having a triazole skeleton and compounds having any one of pyrimidine skeleton, imidazole skeleton, guanidine skeleton, thiazole skeleton and pyrazole skeleton. The polishing slurry having a high metal-polishing rate, reducing etching rate and polishing friction, results in the production, with high productivity, of semiconductor devices reduced in dishing and erosion in metal wiring.
摘要翻译：包括氧化剂，金属氧化物溶解器，金属抑制剂和水并且pH为2至5的抛光浆料。金属氧化物溶解器含有一种或多种选自一种或多种选自以下的酸的一种（A-group）酸：其中第一离解酸基团的解离常数（pKa）小于3.7，排除了乳酸，邻苯二甲酸，富马酸，马来酸和氨基乙酸的五种酸，A组的铵盐和 A组和选自一种或多种选自第一可解离酸基团的解离常数（pKa）为3.7以上的酸的酸（B组）和5种酸的一种或多种，以及五种酸的铵盐 B族的B族和酯类。金属抑制剂含有选自具有三唑骨架的芳香族化合物和选自具有三唑骨架的脂肪族化合物和具有嘧啶骨架，咪唑骨架，胍等任意一种的化合物的一种或多种的一种或多种骨架，噻唑骨架和吡唑骨架。具有高金属抛光速率，降低蚀刻速率和抛光摩擦的抛光浆料导致半导体器件的高生产率的生产减少了金属布线中的凹陷和侵蚀。

14. 发明授权

US5886211A Process for producing 2-(halomethyl)phenylacetic acid esters 失效
标题翻译： 2-（卤代甲基）苯乙酸酯的制备方法
公开(公告)号：US5886211A
公开(公告)日：1999-03-23
申请号：US981449
申请日：1998-03-18
申请人： Kenji Hirai , Katsuyuki Masuda , Yoshihiro Takao , Masahide Sugiyama , Yukio Ono , Masahumi Matsuzawa
发明人： Kenji Hirai , Katsuyuki Masuda , Yoshihiro Takao , Masahide Sugiyama , Yukio Ono , Masahumi Matsuzawa
IPC分类号： C07C67/24 , C07C69/65 , C07D311/76 , C07C69/76
CPC分类号： C07D311/76 , C07C67/24 , C07C69/65
摘要： 2-(Halomethyl)phenylacetic acid esters (3) which are useful as intermediates for producing agricultural fungicides are produced efficiently and conveniently by reacting a 3-isochromanone derivative (1) with a hydrogen halide and an alcohol or reacting (1) with a halomethyl alkyl ether and then reacting the product with an alcohol in the presence of a base. The starting compound, 3-isochromanone (1), is produced in good yield by reacting an .alpha.,.alpha.'-o-xylene dihalide (4) with carbon monoxide and water in an organic solvent in the presence of a palladium catalyst and an inorganic base and then treating the product with an acid. ##STR1##
摘要翻译： PCT No.PCT / JP96 / 01677 Sec。 371日期1998年3月18日 102（e）1998年3月18日PCT PCT 1996年6月19日PCT公布。公开号WO97 / 00850 PCT 日本1 9 9 2年1月9日 - 用于制备农药杀菌剂的中间体的（卤代甲基）苯乙酸酯（3）通过使3-异色满酮衍生物（1）与卤化氢和醇反应（或 1）与卤代甲基烷基醚反应，然后在碱的存在下使产物与醇反应。通过使α，α'-二甲苯二卤化物（4）与一氧化碳和水在有机溶剂中在钯催化剂和无机物存在下反应，以良好的产率制备起始化合物3-异色满酮（1）然后用酸处理产物。 + TR

15. 发明授权

US5612289A 4-imino-oxazolidine-2-one derivatives, a process for producing such derivatives and a herbicide containing them as an active ingredient 失效
标题翻译： 4-亚氨基 - 恶唑烷-2-酮衍生物，制备这种衍生物的方法和含有它们作为活性成分的除草剂
公开(公告)号：US5612289A
公开(公告)日：1997-03-18
申请号：US624557
申请日：1996-07-08
申请人： Kenji Hirai , Tomoko Matsukawa , Tomoyuki Yano , Katsuyuki Masuda , Tomoko Yoshii , Takehito Mouri , Sadayuki Ugai , Osamu Yamada
发明人： Kenji Hirai , Tomoko Matsukawa , Tomoyuki Yano , Katsuyuki Masuda , Tomoko Yoshii , Takehito Mouri , Sadayuki Ugai , Osamu Yamada
IPC分类号： A01N43/76 , C07D263/48 , C07D263/44
CPC分类号： C07D263/48 , A01N43/76
摘要： The invention relates to 4-imino-oxazolidine-2-one derivatives represented by the general formula (1): ##STR1## and a process for producing said compounds by reacting aryl isocyanates of the general formula (2): ##STR2## with methacrolein cyanohydrin in the presence of a base, as well as a herbicide containing said compounds as an active ingredient; it also relates to a process for producing oxazolidinedione derivatives useful as herbicides by hydrolyzing said compounds.
摘要翻译： PCT No.PCT / JP94 / 01683 Sec。 371日期：1996年7月8日 102（e）日期1996年7月8日PCT 1994年10月7日PCT PCT。公开号WO95 / 10509 日期：1995年04月20日本发明涉及由通式（1）表示的4-亚氨基 - 恶唑烷-2-酮衍生物：＆lt; IMAGE＆gt;（1）和通式 2）：在碱存在下与甲基丙烯醛羟腈的反应，以及含有所述化合物作为活性成分的除草剂; 它还涉及通过水解所述化合物生产可用作除草剂的恶唑烷二酮衍生物的方法。

16. 发明授权

US10328683B2 Adhesive agent, adhesive material using the same, and method of use thereof 有权
公开(公告)号：US10328683B2
公开(公告)日：2019-06-25
申请号：US13445398
申请日：2012-04-12
申请人： Katsuyuki Masuda , Masatoshi Yamaguchi , Eiichi Shinada , Takehiro Fukuyama , Yoshihiro Sakairi
发明人： Katsuyuki Masuda , Masatoshi Yamaguchi , Eiichi Shinada , Takehiro Fukuyama , Yoshihiro Sakairi
IPC分类号： C09J177/06 , C09J179/08 , B32B43/00 , C08G69/26 , C08G69/40 , C08G73/14
摘要： An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the condensation resin has a cyclohexane ring.

17. 发明授权

US09446576B2 Adhesive agent, adhesive material using the same, and method of use thereof 有权
标题翻译：粘合剂，使用其的粘合剂材料及其使用方法
公开(公告)号：US09446576B2
公开(公告)日：2016-09-20
申请号：US13445344
申请日：2012-04-12
申请人： Katsuyuki Masuda , Masatoshi Yamaguchi , Eiichi Shinada , Takehiro Fukuyama , Yoshihiro Sakairi
发明人： Katsuyuki Masuda , Masatoshi Yamaguchi , Eiichi Shinada , Takehiro Fukuyama , Yoshihiro Sakairi
IPC分类号： B32B37/00 , B32B43/00 , C08G69/26 , C09J177/06 , C09J179/08 , C08G69/40 , C08G73/14
CPC分类号： B32B43/006 , C08G69/265 , C08G69/40 , C08G73/14 , C09J177/06 , C09J179/08 , Y10T428/2896
摘要： An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A). and the monomer (B) is liquid at 25° C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the monomer (A) contains an isophthalic acid.

18. 发明授权

US08486837B2 Polishing slurry for metal, and polishing method 失效
公开(公告)号：US08486837B2
公开(公告)日：2013-07-16
申请号：US12318376
申请日：2008-12-29
申请人： Hiroshi Ono , Katsuyuki Masuda , Masanobu Habiro
发明人： Hiroshi Ono , Katsuyuki Masuda , Masanobu Habiro
IPC分类号： H01L21/00 , H01L21/02019 , H01L21/02247 , H01L21/30 , C11D11/0047 , C11D3/3945
CPC分类号： B24B37/00 , B24B37/04 , B24B37/044 , C09G1/02 , C23F1/42 , C23F3/00 , C23F3/06 , H01L21/3212
摘要： A polishing slurry for metal comprises an oxidizer, a metal oxide dissolving agent, a metal inhibitor, and water, wherein the metal inhibitor is at least one of a compound having an amino-triazole skeleton and a compound having an imidazole skeleton. The use of the polishing slurry for metal makes it possible to raise the polishing speed sufficiently while keeping the etching speed low, restrain the generation of corrosion of the surface of a metal and dishing, and form a metal-film-buried pattern having a high reliability in the process of formation of wiring of semiconductor devices.

19. 发明申请

US20130158225A1 NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID RESIN, AND MANUFACTURING METHOD FOR SAME 有权
标题翻译：新型含硅聚合物聚酰胺树脂，聚酰胺树脂及其制造方法
公开(公告)号：US20130158225A1
公开(公告)日：2013-06-20
申请号：US13583727
申请日：2011-04-13
申请人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
发明人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
IPC分类号： C08G73/10 , C08G69/42
CPC分类号： C08G73/106 , C08G69/42 , C08G73/105 , C08G73/1075 , C08G73/1078 , C08G77/455
摘要： A polyimide resin including repeating units represented by formula (1): wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings, and a polyamic acid resin including repeating units represented by formula (2): wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings. The polyimide resin is soluble in general-purpose solvents, has a good transparency and a high molecular weight, and is excellent in mechanical properties, such as tensile strength and elongation.
摘要翻译：包含由式（1）表示的重复单元的聚酰亚胺树脂：其中R是二胺残基或二异氰酸酯残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的任何酰亚胺环相对于降冰片烷环为外部构型，和包含由式（2）表示的重复单元的聚酰胺酸树脂：其中R是二胺残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的酰胺基和羧基中的任一个相对于降冰片烷环具有外部构型。聚酰亚胺树脂可溶于通用溶剂，透明度高，分子量高，机械性能优异，拉伸强度和伸长率优异。

20. 发明授权

US07871694B2 Prepreg, metal-clad laminate and printed circuit board using same 有权
标题翻译：预浸料，覆金属层压板和使用其的印刷电路板
公开(公告)号：US07871694B2
公开(公告)日：2011-01-18
申请号：US12180384
申请日：2008-07-25
申请人： Kazumasa Takeuchi , Makoto Yanagida , Masaki Yamaguchi , Katsuyuki Masuda
发明人： Kazumasa Takeuchi , Makoto Yanagida , Masaki Yamaguchi , Katsuyuki Masuda
IPC分类号： B32B27/04 , B32B27/12 , D04H1/00
CPC分类号： C08J5/24 , C08G59/504 , C08G73/1042 , C08G73/106 , C08G73/14 , C08K5/3445 , C08L63/00 , C08L79/08 , H05K1/0346 , H05K1/0353 , H05K2201/0154 , Y10T428/12549 , Y10T428/249921 , Y10T428/249924 , Y10T428/249941 , Y10T428/249951 , C08L2666/20 , C08L2666/22
摘要： This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.
摘要翻译：本发明提供了一种预浸料坯，其通过用与金属箔具有优异粘合性的树脂浸渍薄纤维基材，能够得到具有优异的尺寸稳定性和耐热性的印刷电路板，并且能够以高密度弯曲并容纳在电子器件封装中或纤维基材，优异的耐热性和高柔韧性，以及使用它的金属箔覆层压板和印刷电路板。本发明的预浸料通过将含有酰亚胺结构的树脂和热固性树脂的树脂组合物浸渍到厚度为5-50μm的纤维基材中而获得。

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