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11. 发明授权

US09269965B2 Pd-Y alloy catalyst, method for preparing the same, and fuel cell comprising the catalyst 有权
标题翻译： Pd-Y合金催化剂，其制备方法和包含该催化剂的燃料电池
公开(公告)号：US09269965B2
公开(公告)日：2016-02-23
申请号：US12884853
申请日：2010-09-17
申请人： Sung Jong Yoo , Soo-Kil Kim , Seung Jun Hwang , Suk-Woo Nam , Tae Hoon Lim , Seong Ahn Hong
发明人： Sung Jong Yoo , Soo-Kil Kim , Seung Jun Hwang , Suk-Woo Nam , Tae Hoon Lim , Seong Ahn Hong
IPC分类号： H01M4/92 , H01M8/10
CPC分类号： H01M4/921 , H01M2008/1095 , Y02E60/50
摘要： Disclosed are a platinum (Pt)-free, palladium (Pd)-yttrium (Y) alloy catalyst having superior oxygen reduction reaction activity and stability, a method for preparing the same, and a fuel cell including the catalyst. Since the Pt-free Pd—Y catalyst is inexpensive, it may be usefully applicable for fuel cells, particularly polymer electrolyte membrane fuel cells.
摘要翻译：公开了具有优异的氧还原反应活性和稳定性的无铂（Pt） - 钯（Pd） - 钇（Y）合金催化剂，其制备方法和包含该催化剂的燃料电池。由于不含Pt的Pd-Y催化剂便宜，因此可用于燃料电池，特别是聚合物电解质膜燃料电池。

12. 发明申请

US20090188805A1 SUPERCONFORMAL ELECTRODEPOSITION OF NICKEL IRON AND COBALT MAGNETIC ALLOYS 审中-公开
标题翻译：镍铁和钴磁合金的超强电沉积
公开(公告)号：US20090188805A1
公开(公告)日：2009-07-30
申请号：US12358628
申请日：2009-01-23
申请人： Thomas P. Moffat , Chang Hwa Lee , Daniel Jossel , Soo-Kil Kim
发明人： Thomas P. Moffat , Chang Hwa Lee , Daniel Jossel , Soo-Kil Kim
IPC分类号： C25D5/02
CPC分类号： C25D3/12 , C25D3/20 , C25D7/123 , G11C11/14 , H01L21/2885 , H01L21/76877 , H01L23/5227 , H01L2924/0002 , H01L2924/00
摘要： A process for electrodepositing at least one ferromagnetic material into a three dimensional pattern within a substrate is provided. The process comprises providing a substrate material, dielectric or conductor, having a three dimensional recessed pattern in at least one outer surface thereof, dielectric substrate materials also having an electrical conductive seed layer at least within the three dimensional pattern. An electrolytic bath is prepared comprising at least one ferromagnetic material and at least one accelerating, inhibiting, or depolarizing additive. The at least one ferromagnetic material comprises at least one metal cation selected from the group consisting of Ni2+, Co2+, Fe2+, Fe3+, and combinations thereof. The substrate is placed into the electrolytic bath and the electrolytic bath contacts the conducting three dimensional pattern in the substrate or the conducting seed layer within the pattern on a dielectric substrate. A counter electrode is placed into the electrolytic bath. An electric current is passed through the electrolytic bath between the electrical conductive substrate or seed layer on the three dimensional substrate and the counter electrode. At least a portion of the ferromagnetic material is deposited into at least a portion of the three dimensional pattern wherein the at least one deposited ferromagnetic material is substantially void-free.
摘要翻译：提供了将至少一种铁磁材料电沉积到衬底内的三维图案的方法。该方法包括在其至少一个外表面中提供具有三维凹陷图案的基底材料，电介质或导体，还具有至少在三维图案内的导电种子层的电介质基底材料。制备包含至少一种铁磁材料和至少一种加速，抑制或去极化添加剂的电解浴。至少一种铁磁材料包含至少一种选自Ni2 +，Co2 +，Fe2 +，Fe3 +的金属阳离子及其组合。将基板放置在电解槽中，并且电解槽与电介质基板上的图案内的基板或导电种子层中的导电三维图案接触。将反电极放入电解槽中。电流通过三维基板和对电极之间的导电基板或种子层之间的电解槽。铁磁材料的至少一部分沉积到三维图案的至少一部分中，其中至少一个沉积的铁磁材料基本上无空隙。

13. 发明授权

US06858479B2 Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same 有权
标题翻译：低电阻铜导线，液晶显示装置及其制造方法
公开(公告)号：US06858479B2
公开(公告)日：2005-02-22
申请号：US10323946
申请日：2002-12-20
申请人： Jae-Jeong Kim , Soo-Kil Kim , Yong-Shik Kim
发明人： Jae-Jeong Kim , Soo-Kil Kim , Yong-Shik Kim
IPC分类号： G02F1/136 , C25D7/12 , G02F1/1362 , H01L21/28 , H01L21/288 , H01L21/336 , H01L21/768 , H01L21/77 , H01L21/84 , H01L27/12 , H01L29/45 , H01L29/49 , H01L21/445
CPC分类号： H01L21/28008 , C25D7/123 , G02F2001/136295 , H01L21/2885 , H01L21/76864 , H01L21/76873 , H01L27/12 , H01L27/124 , H01L27/1292 , H01L29/458 , H01L29/4908 , H01L29/66765 , H01L2221/1078
摘要： A method for forming a low resistively copper conductor line includes forming a silver material layer on silicon material, and forming a copper material layer on the silver material layer using an electroplating process.
摘要翻译：形成低电阻铜导体线的方法包括在硅材料上形成银材料层，并使用电镀工艺在银材料层上形成铜材料层。

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