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11. 发明申请

US20090314474A1 HEAT SINK FOR POWER MODULE 失效
标题翻译：电源模块散热器
公开(公告)号：US20090314474A1
公开(公告)日：2009-12-24
申请号：US11919368
申请日：2006-04-19
申请人： Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人： Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号： H05K7/20 , F28D15/00 , F28F3/12
CPC分类号： H01L23/473 , F28F3/086 , F28F3/12 , H01L23/3731 , H01L23/3736 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided.The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50. The flow-in path 30a flows a cooling medium into each parallel flow path 50. The flow-out path 40a flows the cooling medium out of each parallel flow path 50. A refrigerant flow path is constructed by the flow-in path 30a, each parallel flow path 50 and the flow-out path 40a.
摘要翻译：提供了能够实现进一步提高散热性能的功率模块的散热器，并且进一步提高了安装特性。用于功率模块的散热器1具有层叠体20，第一侧板30和第二侧板40.层叠体20具有多个形成为板状的流路板21，多个相互平行的槽23 凹陷地布置在平坦的接合面22上。每个槽23通过每个接合面22层压每个流路板21而设置成平行于前表面的平行流动路径50.每个连接的每个槽23之外的部分面22对层叠方向的各平行流路50形成传热路径70a。在第一和第二侧板30,40中形成有流入路径30a和流出路径40a。流入路径30a和流出路径40a与层叠的侧面26a，26b接合主体20并与每个平行流动路径50连通。流入路径30a将冷却介质流入每个平行流动路径50.流出路径40a将冷却介质从每个平行流动路径50流出。制冷剂流路由流入路径30a，每个平行流路50和流出路径40a构成。

12. 发明申请

US20090302458A1 Heat Sink For Power Module 失效
标题翻译：功率模块散热片
公开(公告)号：US20090302458A1
公开(公告)日：2009-12-10
申请号：US11922945
申请日：2006-06-27
申请人： Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人： Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号： H01L23/367 , H05K7/20
CPC分类号： H05K7/20263 , F28F3/027 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.
摘要翻译：用于功率模块的散热器（1）能够将功率器件（101）安装在散热器的至少一个表面上。散热器包括散发由动力装置（101）产生的热量的冷却介质流动的制冷剂通路（1d）和布置在制冷剂通路（1d）中的波纹状散热片体（1a）。波纹状散热片体（1a）具有在冷却介质的流动方向上延伸的波峰（21b）和槽（21c），以及各个顶部（21b）的相应一个与相邻的顶部一个槽（21c）。布置在相邻侧壁（21a）之间的每个相邻的一对侧壁（21a）和相应的一个峰（21b）或相应的一个槽（21c）形成翅片（21）。每个侧壁（21a）具有操作以使至少旋转在相关联的翅片（21）中流动的冷却介质的百叶窗（31）。因此，散热器（1）具有进一步改善的散热性能。

13. 发明申请

US20090200065A1 HEAT DISSIPATION DEVICE AND POWER MODULE 失效
标题翻译：散热装置和电源模块
公开(公告)号：US20090200065A1
公开(公告)日：2009-08-13
申请号：US11994896
申请日：2006-07-05
申请人： Kota Otoshi , Eiji Kono , Keiji Toh , Katsufumi Tanaka , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
发明人： Kota Otoshi , Eiji Kono , Keiji Toh , Katsufumi Tanaka , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
IPC分类号： H05K7/20
CPC分类号： H05K3/0061 , H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/341 , H05K2201/0373 , H05K2201/1028 , H05K2203/0405 , Y02P70/613 , H01L2924/00
摘要： A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.
摘要翻译：散热器1包括第一侧用作发热元件安装侧的绝缘基板3和固定到绝缘基板3的第二侧的散热片5.金属层7形成在第二侧绝缘基板3与发热元件安装侧相反。由高导热材料形成的应力松弛部件4介于绝缘基板3的金属层7和散热片5之间，并且包括板状体10和在一侧形成为间隔的多个突起11 板状体10的突起11的端面钎焊到金属层7，而没有形成突起11的板状体10的侧面钎焊到该散热器1的材料成本低，散热性能优异。

14. 发明申请

US20070045801A1 Circuit board 审中-公开
标题翻译：电路板
公开(公告)号：US20070045801A1
公开(公告)日：2007-03-01
申请号：US11514736
申请日：2006-08-31
申请人： Tomohei Sugiyama , Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
发明人： Tomohei Sugiyama , Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
IPC分类号： H01L23/06
CPC分类号： H05K1/0271 , H01L2224/32225 , H05K1/0272 , H05K1/056 , H05K1/09 , H05K2201/0209 , H05K2201/0338 , H05K2201/068
摘要： A circuit board includes a substrate having a heat exhausting function. A wiring layer of a metal composite material is provided on the substrate with an insulating layer in between. The metal composite material has a coefficient of thermal expansion that is greater than a coefficient of thermal expansion of a silicon semiconductor chip and less than a coefficient of thermal expansion of copper. Accordingly, a circuit board that is suitable for mounting power devices, requires no heat sink or heat spreader is provides. Further, the number of components for assembling a module is reduced.
摘要翻译：电路板包括具有排热功能的基板。在基板上设置金属复合材料的布线层，其间具有绝缘层。金属复合材料的热膨胀系数大于硅半导体芯片的热膨胀系数，小于铜的热膨胀系数。因此，适用于安装功率器件的电路板不需要散热器或散热器。此外，用于组装模块的部件的数量减少。

15. 发明申请

US20060046035A1 Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate 失效
标题翻译：基板电路板的制造方法，电路基板，基板的电路基板的制造方法
公开(公告)号：US20060046035A1
公开(公告)日：2006-03-02
申请号：US11185633
申请日：2005-07-19
申请人： Katsufumi Tanaka , Kyoichi Kinoshita , Tomohei Sugiyama , Eiji Kono
发明人： Katsufumi Tanaka , Kyoichi Kinoshita , Tomohei Sugiyama , Eiji Kono
IPC分类号： B32B3/00 , B32B9/00
CPC分类号： H05K1/05 , H01L21/4871 , H01L23/3735 , H01L2224/32225 , H05K2201/0209 , H05K2201/0355 , H05K2203/128 , Y10T428/12493 , Y10T428/12576 , Y10T428/24917 , Y10T428/31678
摘要： First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member through hot pressing. As a result, part of the Al foil member enters casting blowholes on the surface of the plate member to fill the casting blowholes. In addition, an Al—Mg-based alloy layer is formed on the surface of the plate member. Thus, a base plate having a nearly flat surface is produced.
摘要翻译：首先，将含有Si的Al合金的熔体或含有Si的Al合金的熔体注入填充有SiC粉末的模具中并铸造以形成由Al / SiC复合材料制成的板构件。接着，将由Al-Mg系合金构成的铝箔构件通过热压与板构件的表面接合。结果，Al箔构件的一部分在板构件的表面上进入浇注气孔以填充铸造气孔。此外，在板构件的表面上形成Al-Mg基合金层。因此，制造具有接近平坦表面的基板。

16. 发明授权

US06521992B2 Semiconductor apparatus 失效
公开(公告)号：US06521992B2
公开(公告)日：2003-02-18
申请号：US09835713
申请日：2001-04-16
申请人： Eiji Kono
发明人： Eiji Kono
IPC分类号： H01L31111
CPC分类号： H01L24/49 , H01L24/48 , H01L25/072 , H01L2224/48227 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/10253 , H01L2924/12041 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2224/45099
摘要： An electrode wiring structure is disclosed which realizes a semiconductor apparatus as a power semiconductor module with the current path set as shortest as possible and uniformly. The semiconductor apparatus includes: a plurality of semiconductor devices mounted in one array or more on a substrate; a main current electrode mounted along the array(s) of the semiconductor devices, and commonly connected to each of the plurality of semiconductor devices through the substrate. The substrate is connected to the main current electrode through a plurality of wires arranged along the array(s) at equal or substantially equal distances.

17. 发明授权

US08625029B2 HDMI source detection 失效
标题翻译： HDMI源检测
公开(公告)号：US08625029B2
公开(公告)日：2014-01-07
申请号：US12002378
申请日：2007-12-17
申请人： Paul Doyle , Eiji Kono , Tetsuya Nomura , Peter Rae Shintani
发明人： Paul Doyle , Eiji Kono , Tetsuya Nomura , Peter Rae Shintani
IPC分类号： H04N7/00 , H04N11/00 , H04N5/44 , H04N3/27 , H04N5/46
CPC分类号： H04N5/44 , G09G5/006 , G09G2320/08 , G09G2370/047 , G09G2370/12 , H01R13/641 , H04N21/43635 , H04N21/44231
摘要： A circuit for detection of an HDMI source device to an HDMI sink device through an HDMI sink connector without regard for the activity state of the HDMI source device has a pull-up resistor having first and second terminals with the first terminal coupled to a DC power source. A switching device is coupled between the pull-up resistor's second terminal and ground at a circuit node. The switching device is switched on to couple the circuit node to ground when power is applied to a control terminal thereof from the HDMI sink connector power pin, and being switched off otherwise. The circuit node is coupled to a DDC/CEC GROUND pin of the HDMI sink connector. The circuit node is readable as a binary signal to indicate the presence of a source device to the HDMI sink connector, wherein the node exhibits a logic low signal when either the node is grounded by the DDC/CEC GROUND pin connection to a source device or when the switching device is switched on. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.
摘要翻译：用于通过HDMI接收器连接器将HDMI源设备检测到HDMI信宿设备的电路不考虑HDMI源设备的活动状态，具有上拉电阻器，其具有第一和第二端子，其中第一端子耦合到DC电源资源。开关器件在电路节点处耦合在上拉电阻器的第二端子和地之间。当从HDMI接收器连接器电源引脚向其控制端施加电力时，切换装置被接通以将电路节点耦合到地，否则被切断。电路节点耦合到HDMI接收器连接器的DDC / CEC GROUND引脚。电路节点可读取为二进制信号，以指示源设备到HDMI接收器连接器的存在，其中当节点通过DDC / CEC GROUND引脚连接到源设备接地时，节点呈现逻辑低信号，或当开关器件接通时。该摘要不被认为是限制性的，因为其他实施例可能偏离本摘要中描述的特征。

18. 发明申请

US20090139704A1 HEAT SINK DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20090139704A1
公开(公告)日：2009-06-04
申请号：US11910460
申请日：2006-04-06
申请人： Kota Otoshi , Eiji Kono , Hidehito Kubo , Masahiko Kimbara , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
发明人： Kota Otoshi , Eiji Kono , Hidehito Kubo , Masahiko Kimbara , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
IPC分类号： F28F7/00
CPC分类号： H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/341 , H05K3/4015 , H05K2201/0373 , H05K2201/09681 , H05K2201/0969 , Y02P70/613 , H01L2924/00
摘要： A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on a side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5. The stress relaxation member 4 is formed of an aluminum plate 10 having a plurality of through holes 9 formed therein, and the through holes 9 serve as stress-absorbing spaces. The stress relaxation member 4 is brazed to the metal layer 7 of the insulating substrate 3 and to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.
摘要翻译：散热器1包括第一侧用作发热元件安装侧的绝缘基板3和固定到绝缘基板3的第二侧的散热片5.金属层7形成在绝缘基板3与发热元件安装侧相反。应力松弛部件4介于绝缘基板3的金属层7和散热片5之间。应力松弛部件4由形成有多个通孔9的铝板10形成，通孔9 作为应力吸收空间。应力松弛部件4钎焊到绝缘基板3的金属层7和散热片5.该散热器1的材料成本低，散热性能优异。

19. 发明授权

US07364632B2 Radiator member for electronic appliances and processes for producing the same 失效
标题翻译：用于电子设备的散热器构件及其制造方法
公开(公告)号：US07364632B2
公开(公告)日：2008-04-29
申请号：US10472802
申请日：2002-03-14
申请人： Katsufumi Tanaka , Tomohei Sugiyama , Kyoichi Kinoshita , Eiji Kono , Naohisa Nishino
发明人： Katsufumi Tanaka , Tomohei Sugiyama , Kyoichi Kinoshita , Eiji Kono , Naohisa Nishino
IPC分类号： C22C21/00 , C22C29/02
CPC分类号： C22C29/065 , B22F2999/00 , C22C1/1036 , C22C32/0063 , C22C2001/1073 , H01L23/3733 , H01L2924/0002 , Y10T428/12736 , B22F1/0014 , H01L2924/00
摘要： The present invention is a process for producing a radiator member for electronic appliances, and is characterized in that, in a process for producing a radiator member for electronic appliances, the radiator member comprising a composite material in which SiC particles are dispersed in a matrix metal whose major component is Al, it comprises a filling step of filling an SiC powder into a mold, a pre-heating step of pre-heating the mold after the filling step to a pre-heating temperature which falls in a range of from a melting point or more of said matrix metal to less than a reaction initiation temperature at which a molten metal of the matrix metal and SiC particles in the SiC powder start to react, and a pouring step of pouring the molten matrix metal whose molten-metal temperature falls in a range of from the melting point or more of the matrix metal to less than the reaction initiation temperature, into the mold after the pre-heating step, and impregnating the SiC powder with the molten metal by pressurizing.When the molten-metal temperature and the pre-heating temperature are from the melting point or more of the matrix metal to less than the reaction initiator temperature, it is possible to inhibit the generation of low thermal conductive materials while securing the impregnation of the molten metal into the SiC powder.
摘要翻译：本发明是一种电子电器用散热构件的制造方法，其特征在于，在电子电器用散热构件的制造方法中，散热构件包括SiC颗粒分散在基体金属中的复合材料其主要成分是Al，其包括将SiC粉末填充到模具中的填充步骤，在填充步骤之后将模具预加热到预热温度的预热步骤，该预热温度落在熔化范围内所述基体金属的一个或多个点小于SiC粉末中的基体金属和SiC颗粒的熔融金属开始反应的反应引发温度，以及将熔融金属温度下降的熔融基质金属倒出的倾倒步骤在从基体金属的熔点以上到小于反应开始温度的范围内，在预热工序后进入模具，并将SiC粉末浸渍在通过加压熔融金属。当熔融金属温度和预热温度从基体金属的熔点或更高温度到小于反应引发剂温度时，可以在确保浸渍熔融金属的温度的同时，抑制低导热材料的产生金属进入SiC粉末。

20. 发明授权

US06882096B2 Active landing control system for raster based devices 失效
标题翻译：基于光栅的设备的主动着陆控制系统
公开(公告)号：US06882096B2
公开(公告)日：2005-04-19
申请号：US10616669
申请日：2003-07-10
申请人： Peter Rae Shintani , Ban Kawamura , Eiji Kono
发明人： Peter Rae Shintani , Ban Kawamura , Eiji Kono
IPC分类号： H01J29/38 , H01J29/70 , H01J29/76 , H04N3/233
CPC分类号： H01J29/705 , H01J2229/5688 , H04N3/2335
摘要： Correction of electron beam landing misalignment in a raster-type display is undertaken without using the usual set of coils, but rather by superimposing a landing misalignment correction signal on the already-existing velocity modulation (VM) coil or on another coil located at the junction of the electron beams in the neck of the display. The correction signal may be varied based on pressure, temperature, and ambient magnetic field as indicated by respective sensors to appropriately correct electron beam landing on phosphors the positions of which may be affected by variations in magnetic fields, temperature, and pressure.
摘要翻译：在光栅型显示器中进行电子束着陆未对准的校正是在不使用通常的一组线圈的情况下进行的，而是通过在已经存在的速度调制（VM）线圈或位于结的另一个线圈上叠加着陆不对准校正信号的电子束在显示器的颈部。校正信号可以基于由各个传感器指示的压力，温度和环境磁场而变化，以适当地校正荧光体上的电子束着落，其位置可能受到磁场，温度和压力的变化的影响。

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