专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US08442603B2 Method of manufacturing case for mobile communications terminal, case for mobile communications terminal, and mobile communications terminal having the same 有权
标题翻译：移动通信终端的制造方法，移动通信终端的情况以及移动通信终端的移动通信终端的制造方法
公开(公告)号：US08442603B2
公开(公告)日：2013-05-14
申请号：US12608847
申请日：2009-10-29
申请人： Ha Ryong Hong , Jae Gyu Go , Jae Suk Sung , Dae Kyu Lee , Chang Mok Han , Dae Ki Lim , Chan Gwang An , Ki Won Chang , Sung Eun Cho
发明人： Ha Ryong Hong , Jae Gyu Go , Jae Suk Sung , Dae Kyu Lee , Chang Mok Han , Dae Ki Lim , Chan Gwang An , Ki Won Chang , Sung Eun Cho
IPC分类号： H04M1/00
CPC分类号： H01Q1/12 , B29C33/16 , B29C45/14065 , B29C45/14639 , B29L2031/3437 , B29L2031/3456 , H01Q1/243 , H04B1/3833
摘要： A method of manufacturing a case for a mobile communications terminal, includes disposing an antenna pattern inside a mold having a shape of a case for a mobile communications terminal, the mold including one or more magnets, and injecting a molding material into the mold and molding a case for a mobile communications terminal in which the antenna pattern is embedded. The antenna pattern is fixed by a magnetic force of the one or more magnets formed within the mold, and prevented from being deformed or moved while the molding material is injected.
摘要翻译：一种移动通信终端的壳体的制造方法，其特征在于，在具有移动通信终端的壳体的形状的模具内配置天线图案，所述模具包括一个或多个磁体，并将成型材料注入到所述模具中并成型用于嵌入天线图案的移动通信终端的情况。天线图案通过形成在模具内的一个或多个磁体的磁力固定，并且防止在注塑成型材料时变形或移动。

12. 发明授权

US09419326B2 Antenna pattern frame, method and mold for manufacturing the same, method for manufacturing an electronic device case, and electronic device 有权
标题翻译：天线图案框架，其制造方法和模具，电子设备壳体的制造方法和电子设备
公开(公告)号：US09419326B2
公开(公告)日：2016-08-16
申请号：US12879534
申请日：2010-09-10
申请人： Chang Mok Han , Jae Suk Sung , Sung Eun Cho , Ha Ryong Hong , Nam Il Seo , Dae Ki Lim , Ki Won Chang , Kyong Keun Lee , Chan Gwang An , Tae Sung Kim
发明人： Chang Mok Han , Jae Suk Sung , Sung Eun Cho , Ha Ryong Hong , Nam Il Seo , Dae Ki Lim , Ki Won Chang , Kyong Keun Lee , Chan Gwang An , Tae Sung Kim
IPC分类号： H01Q1/24 , B29C45/14 , B29C45/16 , H01Q1/38 , B29L31/34
CPC分类号： H01Q1/243 , B29C45/14065 , B29C45/1671 , B29C2045/14122 , B29L2031/3431 , B29L2031/3437 , B29L2031/3456 , H01Q1/38 , Y10T29/49016
摘要： An antenna pattern frame includes: a radiator having an antenna pattern part for receiving an external signal; a radiator frame having the radiator injection-molded to have the antenna pattern part formed thereon and including the antenna pattern part buried at an inner side of an electronic device; and an over-mold part injection-molded together with the radiator frame and over-molded to be formed on the antenna pattern part in order to prevent the antenna pattern part from becoming separated from the radiator frame.
摘要翻译：天线图案框架包括：具有用于接收外部信号的天线图案部分的散热器; 散热器框架，其具有注射成型的散热器，以在其上形成有天线图形部分，并且包括埋在电子设备的内侧的天线图案部分; 以及与散热器框架一起注射成型并在模制天线图案部分上成型以形成天线图案部分与散热器框架分离的过模制部件。

13. 发明授权

US08368597B2 Antenna pattern frame and method of manufacturing the same 有权
标题翻译：天线图案框架及其制造方法
公开(公告)号：US08368597B2
公开(公告)日：2013-02-05
申请号：US12645992
申请日：2009-12-23
申请人： Jae Suk Sung , Dae Seong Jeon , Hyun Kil Nam , Sung Eun Cho , Tae Sung Kim , Chan Gwang An , Hyun Do Park , Chang Mok Han , Byung Hwa Lee , Jung Eun Noh
发明人： Jae Suk Sung , Dae Seong Jeon , Hyun Kil Nam , Sung Eun Cho , Tae Sung Kim , Chan Gwang An , Hyun Do Park , Chang Mok Han , Byung Hwa Lee , Jung Eun Noh
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , B29C45/14639 , B29C45/1671 , B29L2031/3456 , H01Q9/0471 , Y10T29/49016 , Y10T29/49018
摘要： An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, while the antenna pattern portion is embedded in the electronic device case; and a contact surface extension provided on the radiator to prevent the radiator from being loosened from the radiator frame during injection molding of the radiator frame, and increasing a contact area with respect to the radiator frame.
摘要翻译：根据本发明的一个方面的天线图案框架可以包括：具有发射和接收信号的天线图案部分的散热器和允许信号传送到电子设备的电路板并从电子设备的电路板接收的连接端子部分; 连接部，其部分地形成所述散热器，并将所述天线图案部分和所述连接端子部分连接在不同的平面内; 通过在散热器上注射成型制造的散热器框架，使得天线图案部分可以设置在散热器框架的一侧，并且连接端子部分可以设置在其另一侧，而天线图案部分嵌入电子设备案例以及设置在散热器上的接触表面延伸部，以防止散热器框架在注射模制期间散热器从散热器框架松动，并且增加相对于散热器框架的接触面积。

14. 发明授权

US09165708B2 Thin film coil and electronic device having the same 有权
标题翻译：薄膜线圈和具有相同的电子器件
公开(公告)号：US09165708B2
公开(公告)日：2015-10-20
申请号：US13533560
申请日：2012-06-26
申请人： Dae Ki Lim , Tae Sung Kim , Hyeon Gil Nam , Chan Gwang An , Hyun Seok Lee , Ki Won Chang , Chang Mok Han , Sang Woo Bae , Sung Eun Cho , Jae Suk Sung
发明人： Dae Ki Lim , Tae Sung Kim , Hyeon Gil Nam , Chan Gwang An , Hyun Seok Lee , Ki Won Chang , Chang Mok Han , Sang Woo Bae , Sung Eun Cho , Jae Suk Sung
IPC分类号： H01F17/00 , H01F38/14 , H01F27/28 , H01F27/29 , H02J7/02
CPC分类号： H02J50/10 , H01F5/00 , H01F17/00 , H01F17/0006 , H01F27/2804 , H01F27/29 , H01F38/14 , H01F2017/004 , H01F2017/0053 , H01F2017/0073 , H01F2017/0086 , H01Q7/00 , H01Q7/06 , H02J5/005 , H02J7/025 , H02J50/70
摘要： A thin film coil and an electronic device having the same. The thin film coil includes a substrate; and a coil pattern including a first coil strand and a second coil strand formed respectively on opposite surfaces of the substrate, wherein the first coil strand formed on one surface of the substrate includes at least one path that passes through the other surface of the substrate.
摘要翻译：薄膜线圈和具有该薄膜线圈的电子设备。薄膜线圈包括基板; 以及包括分别形成在所述基板的相对表面上的第一线圈股和第二线圈股的线圈图案，其中形成在所述基板的一个表面上的所述第一线圈股包括穿过所述基板的另一表面的至少一个路径。

15. 发明申请

US20120274148A1 CONTACTLESS POWER TRANSMISSION DEVICE AND ELECTRONIC DEVICE HAVING THE SAME 审中-公开
标题翻译：无连接的电力传输装置和具有该电力传输装置的电子装置
公开(公告)号：US20120274148A1
公开(公告)日：2012-11-01
申请号：US13286784
申请日：2011-11-01
申请人： Jae Suk Sung , Chan Gwang An , Dae Ki Lim , Ki Won Chang , Hyeon Gil Nam , Sang Woo Bae , Sung Eun Cho , Tae Sung Kim , Dae Seong Jeon , Chang Mok Han
发明人： Jae Suk Sung , Chan Gwang An , Dae Ki Lim , Ki Won Chang , Hyeon Gil Nam , Sang Woo Bae , Sung Eun Cho , Tae Sung Kim , Dae Seong Jeon , Chang Mok Han
IPC分类号： H01F38/14 , H02J17/00
CPC分类号： H04B5/0037 , H02J5/005 , H02J7/025 , H02J50/12 , H02J50/70 , H04B5/0081
摘要： There are provided a contactless power transmission device and an electronic device having the same. The contactless power transmission device includes: a flexible substrate; a coil unit formed in the flexible substrate and including a coil part formed to have a wiring pattern form and having a plurality of coil strands connected in parallel with each other to thereby form a single coil pattern; and a circuit unit formed in the flexible substrate and electrically connected to the coil unit.
摘要翻译：提供了一种非接触式动力传递装置和具有该非接触式动力传递装置的电子装置。非接触式电力传输装置包括：柔性基板; 线圈单元，其形成在所述柔性基板中，并且包括形成为具有布线图案形状并且具有彼此并联连接的多个线圈的线圈部，从而形成单线圈图案; 以及电路单元，其形成在柔性基板中并电连接到线圈单元。

16. 发明授权

US08159400B2 Chip antenna and mobile-communication terminal having the same 失效
标题翻译：芯片天线和具有相同功能的移动通信终端
公开(公告)号：US08159400B2
公开(公告)日：2012-04-17
申请号：US12170999
申请日：2008-07-10
申请人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
发明人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
IPC分类号： H01Q1/24 , H01Q1/38
CPC分类号： H01Q1/38 , H01Q9/0407
摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.
摘要翻译：提供了具有芯片天线的芯片天线和移动电信终端。芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端连接到外部接地部分。

17. 发明申请

US20090015486A1 CHIP ANTENNA AND MOBILE-COMMUNICATION TERMINAL HAVING THE SAME 失效
标题翻译：芯片天线和移动通信终端
公开(公告)号：US20090015486A1
公开(公告)日：2009-01-15
申请号：US12170999
申请日：2008-07-10
申请人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
发明人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
IPC分类号： H01Q9/04
CPC分类号： H01Q1/38 , H01Q9/0407
摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.
摘要翻译：提供了具有芯片天线的芯片天线和移动电信终端。芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端连接到外部接地部分。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式