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    • 11. 发明授权
    • Non-aqueous electrolyte secondary battery and non-aqueous electrolyte
    • 非水电解质二次电池和非水电解质
    • US08206853B2
    • 2012-06-26
    • US11917374
    • 2006-06-23
    • Keiji SaishoHidekazu YamamotoMasahiro Takehara
    • Keiji SaishoHidekazu YamamotoMasahiro Takehara
    • H01M6/18
    • H01M10/0525H01M4/13H01M10/0566H01M10/0567
    • The objective of the present invention is to prevent deterioration and expanding of anode active material and to improve charge-discharge cycle characteristics in a non-aqueous electrolyte secondary battery comprising an anode of which current collector has thereon a thin layer of an anode active material containing a metal. To solve this problem, in a non-aqueous electrolyte secondary battery wherein a thin layer of anode active material containing a metal which absorbs and discharges lithium is formed on a current collector and the thin layer of the anode active material is divided into columns by a gap formed along the thickness thereof, a compound represented by the following formula is contained in the non-aqueous electrolyte. A-N═C═O In the above formula, A represents an element or a group other than hydrogen.
    • 本发明的目的是为了防止负极活性物质的劣化和膨胀,并且提高非水电解质二次电池的充放电循环特性,该非水电解质二次电池包括集电体上具有负极活性物质的薄层的阳极, 金属。 为了解决这个问题,在非水电解质二次电池中,在集电体上形成含有吸收和放出​​锂的金属的负极活性物质的薄层,阳极活性物质的薄层被分成列 沿其厚度形成的间隙由下式表示的化合物包含在非水电解质中。 A-N = C = O在上式中,A表示氢以外的元素或基团。
    • 12. 发明申请
    • NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY
    • 非水电解质二次电池
    • US20110151338A1
    • 2011-06-23
    • US13059770
    • 2009-08-04
    • Hidekazu YamamotoAtsushi FukuiTaizou SunanoMaruo Kamino
    • Hidekazu YamamotoAtsushi FukuiTaizou SunanoMaruo Kamino
    • H01M10/056
    • H01M10/052H01M4/134H01M4/38H01M4/386H01M4/622H01M6/164H01M10/0567H01M10/0569H01M2300/0034Y02E60/122
    • The present invention is made to improve charge-discharge cycle performances under high temperature environment in a non-aqueous electrolyte secondary battery using a negative electrode containing a negative electrode active material of particulate silicon and/or silicon alloy and a binding agent.A non-aqueous electrolyte secondary battery according to the present invention includes a positive electrode 11, a negative electrode 12, a separator 13, and a non-aqueous electrolyte, wherein the negative electrode includes a negative electrode active material containing particulate silicon and/or silicon alloy and a binding agent, and the non-aqueous electrolyte contains fluorinated cyclic carbonate and a prescribed diisocyanate compound, and when Li storage volume per unit area of the negative electrode of the non-aqueous electrolyte secondary battery under charging condition is determined as A and the theoretical maximum Li storage volume per unit area of the negative electrode is determined as B, a utilizing rate (%) of negative electrode which is expressed by (A/B)×100 is 45% or less.
    • 本发明的目的在于提高使用含有硅和/或硅合金的负极活性物质的负极和粘合剂的非水电解质二次电池在高温环境下的充放电循环性能。 根据本发明的非水电解质二次电池包括正极11,负极12,隔膜13和非水电解质,其中所述负极包括含有颗粒状硅的负极活性物质和/或 硅合金和粘合剂,非水电解质含有氟化环状碳酸酯和规定的二异氰酸酯化合物,并且当非水电解质二次电池的负极在充电条件下的每单位面积的Li储存容积确定为A 将负极单位面积的理论最大Li储存容量确定为B,由(A / B)×100表示​​的负极的利用率(%)为45%以下。
    • 14. 发明授权
    • Semiconductor device
    • 半导体器件
    • US06399460B1
    • 2002-06-04
    • US09679884
    • 2000-10-05
    • Yasuo YamaguchiHidekazu Yamamoto
    • Yasuo YamaguchiHidekazu Yamamoto
    • H01L2176
    • H01L21/76264H01L21/76283H01L29/78609H01L29/78615H01L29/78618Y10S257/913
    • A method of manufacturing a semiconductor device including the steps of (a) forming an element isolation insulating film in an element isolation region of a SOI substrate of a stacked structure in which a semiconductor substrate, insulating layer, and semiconductor layer are stacked in this order, and (b) forming, in an element formation region of the SOI substrate, a transistor having a channel formation region selectively disposed in a main surface of the semiconductor layer, a gate structure on the channel formation region, and source/drain regions disposed is the main surface of the semiconductor layer and the adjacent channel formation region. The method also includes the step of (c) selectively growing, after said steps (a) and (b), a polycrystal semiconductor layer on the source/drain regions in a self-aligned manner, which is prescribed by the element isolation insulating film and the gate structure.
    • 一种制造半导体器件的方法,包括以下步骤:(a)在层叠结构的SOI衬底的元件隔离区域中形成元件隔离绝缘膜,其中半导体衬底,绝缘层和半导体层以该顺序堆叠 ,以及(b)在所述SOI衬底的元件形成区域中形成具有选择性地设置在所述半导体层的主表面中的沟道形成区域的晶体管,所述沟道形成区域上的栅极结构和设置在所述沟道形成区域的源极/漏极区域 是半导体层和相邻沟道形成区域的主表面。 该方法还包括以下步骤:(c)在所述步骤(a)和(b)之后,以元件隔离绝缘膜规定的自对准方式在源极/漏极区上选择性地生长多晶半导体层 和门结构。