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    • 12. 发明授权
    • Method for manufacturing a multi-layer capacitor
    • 多层电容器的制造方法
    • US5347696A
    • 1994-09-20
    • US164719
    • 1993-12-10
    • Josef WillerHermann WendtHans Reisinger
    • Josef WillerHermann WendtHans Reisinger
    • C23F4/00H01G4/30H01L21/822H01L27/04H01G4/10
    • H01G4/306Y10T29/435
    • For manufacturing a multi-layer capacitor, a layer structure (2, 3, 4) is applied onto a substrate (1), said layer structure comprising conductive layers (2, 4) and dielectric layers (3) in alternation and successive conductive layers (2, 4) therein being respectively formed of one of two different materials which are selectively etchable relative to one another. Two openings (6, 8) are produced in the layer structure (2, 3, 4), whereby under-etchings (21, 41 ) are formed in the first opening (6) by selective etching of the one material and are formed in the second opening (8) by selective etching of the other material, so that only the conductive layers (2, 4) of the non-etched material respectively adjoin contacts (91, 92) introduced into the openings (6, 8).
    • 为了制造多层电容器,将层结构(2,3,4)施加到衬底(1)上,所述层结构交替包括导电层(2,4)和电介质层(3),并且连续导电层 (2,4)分别由可相对于彼此选择性地蚀刻的两种不同材料之一形成。 在层结构(2,3,4)中产生两个开口(6,8),由此通过选择性蚀刻该一种材料形成在第一开口(6)中的下蚀刻(21,41),并形成在 所述第二开口(8)通过选择性蚀刻所述另一材料,使得仅所述非蚀刻材料的所述导电层(2,4)分别与引入所述开口(6,8)的触点(91,92)相邻。
    • 14. 发明授权
    • Memory cell arrangement
    • 存储单元布置
    • US06627940B1
    • 2003-09-30
    • US09937838
    • 2002-02-05
    • Dirk SchumannBernhard SellHans ReisingerJosef Willer
    • Dirk SchumannBernhard SellHans ReisingerJosef Willer
    • H01L27108
    • H01L27/10876H01L27/10808H01L27/10823
    • A memory-cell array includes a substrate forming parallel first and second trenches. A transistor's upper source/drain region adjoins two of the first and two of the second trenches, and lies above its lower source/drain region. A conductive structure in a first trench associated with the transistor adjoins the upper source/drain region at its first edge. An insulating structure in the associated first trench insulates the conductive structure from a second edge and from a bottom of the associated first trench. A word line, on which is a further insulating layer, is over the upper/source drain region and parallel to the associated first trench bulges into the second trenches. Insulating spaces adjoin the word line laterally. A contact on the conductive structure and in electrical communication with the upper source/drain region connects with a capacitor.
    • 存储单元阵列包括形成平行的第一和第二沟槽的衬底。 晶体管的上部源极/漏极区域邻接第一和第二个第二沟槽中的两个,并且位于其下部源极/漏极区域的上方。 与晶体管相关联的第一沟槽中的导电结构在其第一边缘邻接上部源极/漏极区。 相关联的第一沟槽中的绝缘结构将导电结构与相关联的第一沟槽的第二边缘和底部绝缘。 在其上是另一个绝缘层的字线在上部/源极漏极区域上方并且平行于相关联的第一沟槽凸起进入第二沟槽。 绝缘空间横向与字线连接。 导电结构上的与上部源极/漏极区域电连通的触点与电容器连接。