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    • 14. 发明申请
    • Trench transistor and method for fabricating a trench transistor with high-energy-implanted drain
    • 沟槽晶体管和制造具有高能量注入漏极的沟槽晶体管的方法
    • US20050205962A1
    • 2005-09-22
    • US11023038
    • 2004-12-23
    • Franz HirlerFrank Pfirsch
    • Franz HirlerFrank Pfirsch
    • H01L21/265H01L21/336H01L29/08H01L29/15H01L31/0312H01L29/00
    • H01L21/26513H01L29/0847H01L29/0878
    • The invention relates to a method for fabricating a trench transistor, in which there are formed, within an epitaxial layer (11, 11′) deposited above a substrate (10) of a first conductivity type (n), a trench (14) and, within the trench (14), a gate dielectric (15) and a gate electrode (16) and, in a body region (20) of a second conductivity type (p) adjoining the trench (14) a source region (13) of the first conductivity type (n), a drift region (12) of the first conductivity type (n) forming a drain zone being formed at the end of the junction between the substrate (10) and the epitaxial layer (11, 11′) by means of one or more high-energy implantations, the lower end (U) of the trench (14) projecting into said drift region (12), and to a trench transistor of this type formed as a low-voltage transistor.
    • 本发明涉及一种制造沟槽晶体管的方法,其中形成在沉积在第一导电类型(n)的衬底(10)上方的外延层(11,11'),沟槽(14)和 ,在沟槽(14)内,栅极电介质(15)和栅电极(16),并且在与沟槽(14)相邻的第二导电类型(p)的体区(20)中,源区(13) 的第一导电类型(n)的第一导电类型(n)的漂移区域(12)形成在衬底(10)和外延层(11,11')之间的接合端的端部处, )通过一个或多个高能量注入,突出到所述漂移区(12)中的沟槽(14)的下端(U)以及形成为低电压晶体管的这种类型的沟槽晶体管。