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11. 发明授权

US06532130B1 Head for reading magnetically stored data 失效
标题翻译：读磁头用于读取磁存储数据
公开(公告)号：US06532130B1
公开(公告)日：2003-03-11
申请号：US09116406
申请日：1998-07-16
申请人： Bruno Murari , Benedetto Vigna , Paolo Ferrari
发明人： Bruno Murari , Benedetto Vigna , Paolo Ferrari
IPC分类号： G11B5596
CPC分类号： G11B5/3922 , G11B5/2654 , G11B5/3103 , G11B5/3183 , G11B5/3948 , G11B5/3958 , G11B5/4886 , G11B5/5526 , G11B5/553
摘要： A head (130) for a disk storage device having a plurality of tracks (117) divided into memory cells (234), including a magnetic circuit (205, 230a, 230b, 250a, 250b) for reading the memory cells (234) in succession, the magnetic circuit (205, 230a, 230b, 250a, 250b) for reading the memory cells (234) including at least two partial reading components (206a, 230a, 250a; 206b, 230b, 250b) each for reading a portion (234a; 234b) of each memory cell (234), the portions (234a; 234b) being arranged transversely relative to the longitudinal axis (233) of the corresponding track (117).
摘要翻译：一种用于盘存储装置的磁头（130），其具有分成存储单元（234）的多个磁道（117），包括用于读取存储单元（234）的磁路（205,230a，230b，250a，250b）用于读取包括至少两个部分读取组件（206a，230a，250a; 206b，230b，250b）的存储单元（234）的磁路（205,230a，230b，250a，250b） 234a，234b），所述部分（234a; 234b）相对于对应轨道（117）的纵向轴线（233）横向设置。

12. 发明授权

US06472257B2 High quality factor, integrated inductor and production method thereof 有权
公开(公告)号：US06472257B2
公开(公告)日：2002-10-29
申请号：US09952625
申请日：2001-09-13
申请人： Paolo Ferrari , Armando Manfredi , Benedetto Vigna
发明人： Paolo Ferrari , Armando Manfredi , Benedetto Vigna
IPC分类号： H01L2120
CPC分类号： H01L28/10 , H01L23/5227 , H01L23/645 , H01L27/0688 , H01L2924/0002 , H01L2924/00
摘要： The integrated inductor comprises a coil of metal which is formed in the second metal level. The coil is supported by a bracket extending above spaced from a semiconductor material body by an air gap obtained by removing a sacrificial region formed in the first metal level. The bracket is carried by the semiconductor material body through support regions which are arranged peripherally on the bracket and are separated from one another by through apertures which are connected to the air gap. A thick oxide region extends above the semiconductor material body, below the air gap, to reduce the capacitive coupling between the inductor and the semiconductor material body. The inductor thus has a high quality factor, and is produced by a process compatible with present microelectronics processes.

13. 发明授权

US06404599B1 High-performance integrated microactuator, particularly for a hard disk read/write transducer 有权
标题翻译：高性能集成微型致动器，特别适用于硬盘读写传感器
公开(公告)号：US06404599B1
公开(公告)日：2002-06-11
申请号：US09409584
申请日：1999-09-30
申请人： Benedetto Vigna
发明人： Benedetto Vigna
IPC分类号： G11B2124
CPC分类号： H02N1/006 , G11B5/5569
摘要： A microactuator comprises a stator element and a rotor element which are capacitively coupled. The rotor element comprises a suspended mass and a plurality of movable drive arms extending radially from the suspended mass and biased at a reference potential. The stator element comprises a plurality of first and second fixed drive arms associated with respective movable drive arms and biased at a first drive potential. A mechanical damping structure is formed by at least one movable damping arm extending radially from the suspended mass and by at least one first and one second fixed damping arm associated with the movable damping arm and biased at said reference potential, to dampen settling oscillations of the rotor element.
摘要翻译：微型致动器包括电容耦合的定子元件和转子元件。转子元件包括悬挂质量和从悬挂质量块径向延伸并以参考电位偏置的多个可移动驱动臂。定子元件包括与相应的可移动驱动臂相关联并且以第一驱动电位偏置的多个第一和第二固定驱动臂。机械阻尼结构由至少一个从悬挂质量块径向延伸的可移动阻尼臂以及与可移动阻尼臂相关联的至少一个第一固定阻尼臂和一个第二固定阻尼臂形成，并被偏置在所述参考电位处，以阻尼转子元件。

14. 发明授权

US06326229B1 Process for manufacturing integrated semiconductor devices comprising a chemoresistive gas microsensor 有权
标题翻译：用于制造包括化学耐药性微量传感器的集成半导体器件的方法
公开(公告)号：US06326229B1
公开(公告)日：2001-12-04
申请号：US09405893
申请日：1999-09-24
申请人： Ubaldo Mastromatteo , Benedetto Vigna
发明人： Ubaldo Mastromatteo , Benedetto Vigna
IPC分类号： H01L2100
CPC分类号： G01N27/12
摘要： To manufacture integrated semiconductor devices comprising chemoresistive gas microsensors, a semiconductor material body is first formed, on the semiconductor material body are successively formed, reciprocally superimposed, a sacrificial region of metallic material, formed at the same time and on the same level as metallic connection regions for the sensor, a heater element, electrically and physically separated from the sacrificial region and a gas sensitive element, electrically and physically separated from the heater element; openings are formed laterally with respect to the heater element and to the gas sensitive element, which extend as far as the sacrificial region and through which the sacrificial region is removed at the end of the manufacturing process.
摘要翻译：为了制造包括化学耐化学气体微传感器的集成半导体器件，首先形成半导体材料体，在半导体材料体上依次形成与金属连接同时形成的金属材料的牺牲区域，用于传感器的区域，与牺牲区电气和物理分离的加热器元件和气体敏感元件，与加热器元件电和物理分离; 开口相对于加热器元件和气体敏感元件横向形成，气体敏感元件延伸到牺牲区域并且在制造过程结束时除去牺牲区域。

15. 发明授权

US08289021B2 Magnetoresistive sensor and manufacturing method thereof 有权
标题翻译：磁阻传感器及其制造方法
公开(公告)号：US08289021B2
公开(公告)日：2012-10-16
申请号：US12826330
申请日：2010-06-29
申请人： Benedetto Vigna , Simone Sassolini , Lorenzo Baldo , Francesco Procopio
发明人： Benedetto Vigna , Simone Sassolini , Lorenzo Baldo , Francesco Procopio
IPC分类号： G01R33/02
CPC分类号： G01C17/28 , B82Y25/00 , G01R33/093 , G01R33/096
摘要： A magnetoresistive element formed by a strip of magnetoresistive material which extends on a substrate of semiconductor material having an upper surface. The strip comprises at least one planar portion which extends parallel to the upper surface, and at least one transverse portion which extends in a direction transverse to the upper surface. The transverse portion is formed on a transverse wall of a dig. By providing a number of magnetoresistive elements perpendicular to one another it is possible to obtain an electronic compass that is insensitive to oscillations with respect to the horizontal plane parallel to the surface of the Earth.
摘要翻译：一种由具有上表面的半导体材料的衬底上延伸的磁阻材料条形成的磁阻元件。该条带包括平行于上表面延伸的至少一个平面部分和至少一个横向于上表面的方向延伸的横向部分。横向部分形成在挖掘的横向壁上。通过提供垂直于彼此的多个磁阻元件，可以获得对于平行于地球表面的水平面的振荡不敏感的电子罗盘。

16. 发明申请

US20120223402A1 CAPACITIVE SEMICONDUCTOR PRESSURE SENSOR 有权
标题翻译：电容式半导体压力传感器
公开(公告)号：US20120223402A1
公开(公告)日：2012-09-06
申请号：US13446976
申请日：2012-04-13
申请人： Flavio Francesco Villa , Gabriele Barlocchi , Pietro Corona , Benedetto Vigna , Lorenzo Baldo
发明人： Flavio Francesco Villa , Gabriele Barlocchi , Pietro Corona , Benedetto Vigna , Lorenzo Baldo
IPC分类号： H01L29/84
CPC分类号： G01L9/0073 , G01L9/0045
摘要： A capacitive semiconductor pressure sensor, comprising: a bulk region of semiconductor material; a buried cavity overlying a first part of the bulk region; and a membrane suspended above said buried cavity, wherein, said bulk region and said membrane are formed in a monolithic substrate, and in that said monolithic substrate carries structures for transducing the deflection of said membrane into electrical signals, wherein said bulk region and said membrane form electrodes of a capacitive sensing element, and said transducer structures comprise contact structures in electrical contact with said membrane and with said bulk region.
摘要翻译：一种电容半导体压力传感器，包括：半导体材料的主体区域; 覆盖大块区域的第一部分的掩埋腔; 以及悬浮在所述掩埋腔上方的膜，其中所述体积区域和所述膜形成在整体式衬底中，并且所述整体式衬底承载用于将所述膜的偏转转换成电信号的结构，其中所述体积区域和所述膜形成电容感测元件的电极，并且所述换能器结构包括与所述膜电连接并与所述体积区域接触的接触结构。

17. 发明申请

US20100284553A1 ASSEMBLY OF A CAPACITIVE ACOUSTIC TRANSDUCER OF THE MICROELECTROMECHANICAL TYPE AND PACKAGE THEREOF 有权
标题翻译：微电子式电容式电容式传感器的组装及其封装
公开(公告)号：US20100284553A1
公开(公告)日：2010-11-11
申请号：US12777058
申请日：2010-05-10
申请人： Sebastiano Conti , Benedetto Vigna , Mario Francesco Cortese
发明人： Sebastiano Conti , Benedetto Vigna , Mario Francesco Cortese
IPC分类号： H04R19/04
CPC分类号： B81C1/00158 , B81B3/0018 , B81B7/0061 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48479 , H01L2924/00014 , H01L2924/16151 , H01L2924/16152 , H04R1/04 , H04R1/06 , H04R1/086 , H04R1/2838 , H04R19/005 , H04R19/04 , H04R2201/003 , H01L2224/48471 , H01L2224/4554 , H01L2924/00012
摘要： A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.
摘要翻译：微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，与第一表面流体连通，微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。

18. 再颁专利

USRE41856E1 Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced 有权
公开(公告)号：USRE41856E1
公开(公告)日：2010-10-26
申请号：US10229396
申请日：2002-08-26
申请人： Paolo Ferrari , Benedetto Vigna , Pietro Montanini , Marco Ferrera
发明人： Paolo Ferrari , Benedetto Vigna , Pietro Montanini , Marco Ferrera
IPC分类号： G01P15/125 , G01P9/04
CPC分类号： H01L21/764 , B81B2201/0235 , B81B2201/0242 , B81C1/00246 , B81C2201/0109 , B81C2201/0177 , B81C2203/0735 , B81C2203/0778 , G01P15/0802 , G01P15/125 , G01P2015/0814 , H01L21/76202
摘要： A movable mass forming a seismic mass is formed starting from an epitaxial layer and is covered by a weighting region of tungsten which has high density. To manufacture the mass, buried conductive regions are formed in the substrate. Then, at the same time, a sacrificial region is formed in the zone where the movable mass is to be formed and oxide insulating regions are formed on the buried conductive regions so as to partially cover them. An epitaxial layer is then grown, using a nucleus region. A tungsten layer is deposited and defined and, using a silicon carbide layer as mask, the suspended structure is defined. Finally, the sacrificial region is removed, forming an air gap.

19. 发明申请

US20090294186A1 Touch position determining device and method, and electronic touch-sensitive device 审中-公开
标题翻译：触摸位置确定装置和方法以及电子触敏装置
公开(公告)号：US20090294186A1
公开(公告)日：2009-12-03
申请号：US11990384
申请日：2006-08-08
申请人： Luca Fontanella , Fabio Pasolini , Benedetto Vigna , Enrico Chiesa
发明人： Luca Fontanella , Fabio Pasolini , Benedetto Vigna , Enrico Chiesa
IPC分类号： G08C21/00 , G06F15/00 , G06F3/043
CPC分类号： G06F3/0433
摘要： In a device for determining the position of a touch on a contact surface, a plurality of vibration sensors are configured to detect mechanical vibrations generated by the touch on the contact surface and to generate corresponding vibration signals, and a processing circuit is connected to the vibration sensors and is configured to determine the touch position via a time-of-flight algorithm, based on differences between times of detection of the mechanical vibrations by the vibration sensors.
摘要翻译：在用于确定接触表面上的触摸位置的装置中，多个振动传感器被配置为检测由接触表面上的触摸产生的机械振动并产生相应的振动信号，并且处理电路连接到振动传感器，并且被配置为基于通过振动传感器检测到机械振动的时间差异，经由飞行时间算法来确定触摸位置。

20. 发明申请

US20080315333A1 SUBSTRATE-LEVEL ASSEMBLY FOR AN INTEGRATED DEVICE, MANUFACTURING PROCESS THEREOF AND RELATED INTEGRATED DEVICE 有权
标题翻译：集成器件的基板级组件及其制造工艺及相关的集成器件
公开(公告)号：US20080315333A1
公开(公告)日：2008-12-25
申请号：US12102709
申请日：2008-04-14
申请人： Chantal Combi , Benedetto Vigna , Federico Giovanni Ziglioli , Lorenzo Baldo , Manuela Magugliani , Ernesto Lasalandra , Caterina Riva
发明人： Chantal Combi , Benedetto Vigna , Federico Giovanni Ziglioli , Lorenzo Baldo , Manuela Magugliani , Ernesto Lasalandra , Caterina Riva
IPC分类号： H01L23/10 , H01L21/50
CPC分类号： B81B7/0061 , B81B7/02 , B81B2201/0235 , B81B2201/0264 , B81C1/0023 , H01L2224/48091 , H01L2224/73265 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidically isolated from the first empty space, is provided over the respective membrane of the further integrated device.
摘要翻译：一种基板级组件，其具有具有顶面的半导体材料的器件基板并且容纳第一集成器件，所述第一集成器件包括形成在所述器件衬底内的掩埋腔，以及悬挂在所述顶面附近的所述掩埋腔上的膜。封盖衬底在顶面上方连接到器件衬底，以便以这样的方式覆盖第一集成器件，使得在膜上方设置第一空白空间。电接触元件将集成器件与衬底级组件的外部电连接。在一个实施例中，器件衬底集成了至少一个设置有相应膜的集成器件，并且在另一个集成器件的相应膜上提供了与第一空白空间流体隔离的另外的空白空间。

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