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11. 发明授权

US06429989B1 Method for self-servowriting timing propagation 失效
标题翻译：自伺服定时传播方法
公开(公告)号：US06429989B1
公开(公告)日：2002-08-06
申请号：US09592740
申请日：2000-06-13
申请人： Mark D. Schultz , Bucknell C. Webb
发明人： Mark D. Schultz , Bucknell C. Webb
IPC分类号： G11B509
CPC分类号： G11B27/30 , G11B5/59633 , G11B2220/20
摘要： A method for writing timing marks on a rotatable storage medium, such as on a disk in a disk drive, includes the steps of: 1) during a rotation of the disk, detecting the passage of at least a portion of a first timing mark located at a radial trajectory at a first radius of the disk, and 2) during the same rotation of the disk, writing a second timing mark at a second radius of the disk. The second timing mark is located at least one of a) where at least a portion of the second timing mark overlaps at least a portion of the radial trajectory of the first timing mark, and b) where the second timing mark is in close proximity to the radial trajectory of the first timing mark. The second timing mark is written based on different parameters such as a measured time interval, a calculated time interval, and a predetermined delay.
摘要翻译：在诸如盘驱动器中的盘上的可旋转存储介质上写入定时标记的方法包括以下步骤：1）在盘的旋转期间，检测位于第一定时标记的至少一部分的通过在盘的第一半径处的径向轨迹处，以及2）在盘的相同旋转期间，在盘的第二半径处写入第二定时标记。第二定时标记位于以下中的至少一个中：a）第二定时标记的至少一部分与第一定时标记的径向轨迹的至少一部分重叠，以及b）第二定时标记紧邻第一定时标记的径向轨迹。基于不同的参数（例如测量的时间间隔，计算的时间间隔和预定的延迟）写入第二定时标记。

12. 发明授权

US07362582B2 Cooling structure using rigid movable elements 有权
标题翻译：使用刚性可移动元件的冷却结构
公开(公告)号：US07362582B2
公开(公告)日：2008-04-22
申请号：US11151905
申请日：2005-06-14
申请人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
发明人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a compressible top layer disposed over the electronic device. The structure further includes a plurality of rigid elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of rigid elements provide mechanical compliance. In another alternative, the structure further includes a conformable heat-conducting layer disposed over the electronic device, wherein a bottom end of the plurality of rigid elements is coupled to the conformable heat-conducting layer.
摘要翻译：公开了一种用于冷却电子设备的结构。该结构包括设置在电子设备上的可压缩顶层。该结构还包括设置在顶层和电子设备之间的多个刚性元件，用于提供来自电子设备的热路径，并且其中多个刚性元件提供机械顺应性。在另一替代方案中，结构还包括设置在电子设备上的适形导热层，其中多个刚性元件的底端联接到适形导热层。

13. 发明授权

US07408780B2 Compliant thermal interface structure utilizing spring elements with fins 有权
标题翻译：符合热接口结构，利用带翅片的弹簧元件
公开(公告)号：US07408780B2
公开(公告)日：2008-08-05
申请号：US11151843
申请日：2005-06-14
申请人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
发明人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one of the spring elements comprises a spring portion and a fin portion. At least one of the spring elements provides a heat path from the electronic device and provides mechanical compliance. In another embodiment, the structure further includes a heat-conducting layer disposed over the electronic device, wherein the fin portion of each of at least one of the spring elements is coupled to the heat-conducting layer.
摘要翻译：公开了一种用于冷却电子设备的结构。该结构包括设置在电子设备上的顶层。该结构还包括设置在顶层和电子设备之间的多个弹簧元件，其中弹簧元件中的至少一个包括弹簧部分和翅片部分。至少一个弹簧元件提供来自电子设备的热路径并且提供机械顺应性。在另一个实施例中，该结构还包括设置在电子设备上的导热层，其中至少一个弹簧元件中的每一个的翅片部分耦合到导热层。

14. 发明授权

US07545647B2 Compliant thermal interface structure utilizing spring elements 失效
标题翻译：采用弹簧元件的热接口结构
公开(公告)号：US07545647B2
公开(公告)日：2009-06-09
申请号：US12037067
申请日：2008-02-25
申请人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
发明人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/433 , A01H5/02 , A01H6/42 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.
摘要翻译：公开了一种用于冷却电子设备的结构。该结构包括设置在电子设备上的固体导热层。固体导热层是与电子设备接触的平面。该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大，导电层。

15. 发明申请

US20080298016A1 COOLING AN ELECTRONIC DEVICE UTILIZING SPRING ELEMENTS WITH FINS 审中-公开
标题翻译：冷却使用弹簧弹簧元件的电子设备
公开(公告)号：US20080298016A1
公开(公告)日：2008-12-04
申请号：US12180711
申请日：2008-07-28
申请人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
发明人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A method for cooling an electronic device includes forming a spring structure by coupling a plurality of spring elements with a fin portion oriented at an angle, wherein a first end of the fin portion has a narrowed tip; coupling the spring structure with a planar heat-conducting material to form a first heat-conducting layer; positioning the first heat-conducting layer such that the planar heat-conducting material is on top; and placing the first heat-conducting layer over the electronic device such that the fin portion is oriented at an angle toward the electronic device, and such that the narrowed tip of the fin portion is in contact with the top surface of the electronic device.
摘要翻译：一种用于冷却电子设备的方法包括：通过将多个弹簧元件与一个以一定角度取向的翅片部分联接来形成弹簧结构，其中，翅片部分的第一端具有变窄的尖端; 将弹簧结构与平面导热材料联接以形成第一导热层; 将第一导热层定位成使得平面导热材料位于顶部; 并且将第一导热层放置在电子设备上，使得翅片部分朝向电子设备成一定角度，并且使得翅片部分的变窄的尖端与电子设备的顶表面接触。

16. 发明授权

US07355855B2 Compliant thermal interface structure utilizing spring elements 有权
标题翻译：采用弹簧元件的热接口结构
公开(公告)号：US07355855B2
公开(公告)日：2008-04-08
申请号：US11151830
申请日：2005-06-14
申请人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
发明人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , A01H5/02 , A01H6/42 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements provide mechanical compliance. In one alternative, the structure further includes a solid heat-conducting layer disposed over the electronic device, wherein the plurality of spring elements are coupled to the solid heat-conducting layer.
摘要翻译：公开了一种用于冷却电子设备的结构。该结构包括设置在电子设备上的顶层。该结构还包括设置在顶层和电子设备之间的多个弹簧元件，用于从电子设备提供热路径，并且其中多个弹簧元件提供机械顺应性。在一个替代方案中，该结构还包括设置在电子设备上的固体导热层，其中多个弹簧元件联接到固体导热层。

17. 发明申请

US20140020418A1 DATA CENTER COOLING SYSTEM 有权
标题翻译：数据中心冷却系统
公开(公告)号：US20140020418A1
公开(公告)日：2014-01-23
申请号：US13588260
申请日：2012-08-17
申请人： Timothy J. Chainer , Hien P. Dang , Pritish R. Parida , Mark D. Schultz , Arun Sharma
发明人： Timothy J. Chainer , Hien P. Dang , Pritish R. Parida , Mark D. Schultz , Arun Sharma
IPC分类号： F25B49/00 , F25D17/02 , F25D31/00
CPC分类号： H05K7/20836 , G06F1/206
摘要： A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.
摘要翻译：数据中心冷却系统可以包括用于冷却没有蒸气压缩制冷的液体冷却剂的传热设备，并且液体冷却剂被用在容纳在数据中心中的液冷信息技术设备机架上。该系统还可以包括控制器装置，其通过基于信息技术设备温度阈值的一系列液体冷却剂流量值来调节流向液体冷却的信息技术设备机架的液体冷却剂流。

18. 发明授权

US08493738B2 Cooled electronic system with thermal spreaders coupling electronics cards to cold rails 失效
标题翻译：冷却电子系统，散热器将电子卡耦合到冷轨
公开(公告)号：US08493738B2
公开(公告)日：2013-07-23
申请号：US13102211
申请日：2011-05-06
申请人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
发明人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781 , H05K7/2079
摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
摘要翻译：提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。闩锁有助于将卡固定在插座内或从插座中取出卡。液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

19. 发明授权

US09107327B2 Data center cooling method 有权
标题翻译：数据中心冷却方式
公开(公告)号：US09107327B2
公开(公告)日：2015-08-11
申请号：US13551929
申请日：2012-07-18
申请人： Timothy J. Chainer , Hien P. Dang , Pritish R. Parida , Mark D. Schultz , Arun Sharma
发明人： Timothy J. Chainer , Hien P. Dang , Pritish R. Parida , Mark D. Schultz , Arun Sharma
IPC分类号： G05D23/00 , H05K7/20 , G06F1/20
CPC分类号： H05K7/20836 , G06F1/206
摘要： A method aspect for removing heat from a data center may use liquid coolant cooled without vapor compression refrigeration on a liquid cooled information technology equipment rack. The method may also include regulating liquid coolant flow to the data center through a range of liquid coolant flow values with a controller-apparatus based upon information technology equipment temperature threshold of the data center.
摘要翻译：从数据中心去除热量的方法方面可以使用液体冷却剂冷却而不进行蒸气压缩制冷在液冷信息技术设备机架上。该方法还可以包括通过使用基于数据中心的信息技术设备温度阈值的控制器装置通过一定范围的液体冷却剂流量来调节流向数据中心的液体冷却剂流。

20. 发明授权

US09043035B2 Dynamically limiting energy consumed by cooling apparatus 有权
标题翻译：动力限制冷却装置消耗的能量
公开(公告)号：US09043035B2
公开(公告)日：2015-05-26
申请号：US13305967
申请日：2011-11-29
申请人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Roger R. Schmidt , Mark D. Schultz
发明人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Roger R. Schmidt , Mark D. Schultz
IPC分类号： G06F19/00 , G05D7/06 , G06F1/20 , G11B33/14 , H05K7/20 , G06F1/32
CPC分类号： G05D7/0635 , G06F1/20 , G06F1/206 , G06F1/3206 , G11B33/144 , H05K7/20281 , H05K7/20781 , H05K7/2079 , H05K7/20836 , Y02D10/16
摘要： Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.
摘要翻译：提供了冷却装置和方法，其包括与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通的冷却剂回路，一个或多个热交换单元以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。控制器耦合到N个可控组件，并且基于Z输入参数和一个或多个指定的约束来动态调整N个可控组件的操作，以向冷却剂冷却的结构提供特定的冷却，同时限制能量由N个可控部件消耗，其中Z≥1。

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