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11. 发明授权

US5963023A Power surge management for high performance integrated circuit 失效
标题翻译：电源浪涌管理用于高性能集成电路
公开(公告)号：US5963023A
公开(公告)日：1999-10-05
申请号：US99691
申请日：1998-06-18
申请人： Dennis James Herrell , Thomas P. Dolbear
发明人： Dennis James Herrell , Thomas P. Dolbear
IPC分类号： G05F3/24 , G06F1/30 , H01L23/498 , H01L23/50 , H02J1/02 , H05K1/11 , G05F1/40 , H03K17/12
CPC分类号： H01L23/49827 , G06F1/305 , H01L23/49838 , H01L23/50 , H02J1/02 , G05F3/24 , H01L2924/0002 , H01L2924/3011 , H05K1/112 , H05K2201/10545 , H05K2201/10734
摘要： An integrated circuit chip configuration, e.g., a microprocessor, includes feedback control circuitry defined thereon to control mid-frequency components of current demand of the integrated circuit chip and thereby regulate power supply voltage to within design tolerances of the integrated circuit chip. Such mid-frequency components can be generated by directed changes in operating frequency of the integrated circuit chip or by cyclic or episodic variations in circuit activity, e.g., instruction sequence dependent variations. When generated, such mid-frequency components can excite mid-frequency resonances in a power distribution system and generate power supply voltage disturbances. In some configurations, the integrated circuit chip includes current dump circuitry defining a controlled impedance path between first and second power supply voltage terminals of the integrated circuit chip. The controlled impedance path allows the feedback control circuitry to actuate a variable current draw so as to reduce mid-frequency components of overall current demand of the integrated circuit chip and thereby regulate power supply voltage disturbances. In other configurations, the feedback control circuitry is coupled to on-chip clock circuits, e.g., a phase-locked loop (PLL), to actuate variations in a clock signal supplied to the integrated circuit chip and thereby regulate power supply voltage disturbances.
摘要翻译：诸如微处理器的集成电路芯片配置包括在其上限定的反馈控制电路，以控制集成电路芯片的电流需求的中频分量，从而将电源电压调整到集成电路芯片的设计容限内。这样的中频分量可以通过集成电路芯片的工作频率的定向改变或电路活动中的循环或偶然变化（例如指令序列相关变化）来产生。当产生时，这种中频分量可以激发配电系统中的中频谐振并产生电源电压干扰。在一些配置中，集成电路芯片包括限定在集成电路芯片的第一和第二电源电压端子之间的受控阻抗路径的电流转储电路。受控阻抗路径允许反馈控制电路致动可变电流汲取，以减少集成电路芯片的总电流需求的中频分量，从而调节电源电压干扰。在其他配置中，反馈控制电路耦合到片上时钟电路，例如锁相环（PLL），以激励提供给集成电路芯片的时钟信号的变化，从而调节电源电压干扰。

12. 发明授权

US5907474A Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package 失效
标题翻译：用于采用球栅阵列（BGA）器件封装的表面安装半导体器件的低轮廓传热装置
公开(公告)号：US5907474A
公开(公告)日：1999-05-25
申请号：US845591
申请日：1997-04-25
申请人： Thomas P. Dolbear
发明人： Thomas P. Dolbear
IPC分类号： H01L23/04 , H01L23/40 , H01L23/433 , H05K1/02 , H05K3/32 , H05K3/34 , H05K7/10 , H05K7/20
CPC分类号： H01L24/32 , H01L23/04 , H01L23/4006 , H01L23/433 , H05K3/325 , H05K7/1061 , H01L2224/16 , H01L2224/27013 , H01L2224/73253 , H01L2224/83051 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01046 , H01L2924/01055 , H01L2924/01073 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H05K1/0201 , H05K3/3436
摘要： A low-profile heat transfer apparatus is presented for a surface-mounted semiconductor device employing a ball grid array (BGA) device package having a chip mounted upon a substantially flat upper surface of a substrate. The semiconductor device is mounted upon a component side of a printed circuit board (PCB), and the heat transfer apparatus is used to transfer heat energy from the semiconductor device to an ambient. A thermally conductive cap structure is positioned between the semiconductor device and the ambient. The cap structure includes a bottom surface having a first cavity sized to receive the substrate and possibly any decoupling capacitors. During use, the substrate resides within the first cavity. In a first embodiment, the chip resides within a second cavity in an upper wall of the first cavity during use. The chip and substrate are thermally coupled to the cap structure by a first and second thermal interface layer, respectively. The use of two thermal interface layers achieves a relatively low value of .theta..sub.JS, allowing the cap structure to remain relatively small. In a second embodiment, the chip resides within a hole in the cap structure during use such that the upper surface of the chip is exposed to the ambient. The substrate is thermally coupled to the cap structure by a thermal interface layer. The achieved value of .theta..sub.JS is acceptably low for some applications, and the height of the cap structure relative to the component side of the PCB is substantially reduced.
摘要翻译：本发明提供了一种用于使用具有安装在基板的基本上平坦的上表面上的芯片的球栅阵列（BGA）器件封装的表面安装半导体器件的低调传热装置。半导体器件安装在印刷电路板（PCB）的组件侧，并且传热装置用于将热能从半导体器件传递到环境。导热盖结构位于半导体器件和环境之间。盖结构包括底表面，该底表面具有尺寸适于接纳衬底和可能的任何去耦电容器的第一腔。在使用期间，衬底位于第一腔内。在第一实施例中，在使用期间，芯片位于第一腔的上壁中的第二腔内。芯片和衬底分别通过第一和第二热界面层热耦合到盖结构。两个热界面层的使用实现了较低的θJS值，允许盖结构保持相对较小。在第二实施例中，在使用期间，芯片位于帽结构的孔内，使得芯片的上表面暴露于环境中。衬底通过热界面层热耦合到帽结构。对于一些应用，θJS的实现值是可接受的低，并且帽结构相对于PCB的部件侧的高度显着降低。

13. 发明授权

US5445308A Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal 失效
标题翻译：与基质材料和含有液态金属的随机分散填料的导热连接
公开(公告)号：US5445308A
公开(公告)日：1995-08-29
申请号：US263623
申请日：1994-06-22
申请人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
发明人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
IPC分类号： C09J9/02 , H01B1/22 , H01R4/04 , H05K3/32 , B23K35/26
CPC分类号： C09J9/02 , H01B1/22 , H01L24/29 , H01L24/32 , H01R4/04 , H05K3/323 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29311 , H01L2224/83101 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H05K2201/0209 , H05K2201/023 , H05K2201/10719 , H05K2203/0425
摘要： A method of providing a thermally conductive connection between spaced surfaces includes (a) mixing a thermally conductive filler containing a liquid metal into an unhardened matrix material, and (b) contacting the unhardened matrix material and randomly dispersed, separate spaced non-solidified regions of filler within the unhardened matrix material to the surfaces. A solid mechanical bond may be provided by hardening the matrix material or by providing a separate adhesive between the surfaces. Preferably, the regions of filler form separate spaced continuous thermally and electrically conductive paths between the surfaces.
摘要翻译：在间隔表面之间提供导热连接的方法包括（a）将含有液态金属的导热填料混合到未硬化的基体材料中，和（b）使未硬化的基体材料和随机分散的分开的非固化区域未固化的基体材料中的填料到表面。可以通过硬化基质材料或通过在表面之间提供单独的粘合剂来提供固体机械结合。优选地，填料区域在表面之间形成分开的连续的热和导电路径。

14. 发明授权

US5056706A Liquid metal paste for thermal and electrical connections 失效
标题翻译：用于热和电连接的液态金属膏
公开(公告)号：US5056706A
公开(公告)日：1991-10-15
申请号：US438563
申请日：1989-11-20
申请人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
发明人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
IPC分类号： B23K31/02 , B23K35/26 , H05K3/34
CPC分类号： B23K35/26 , B23K31/02 , H05K3/3463 , H05K3/3484
摘要： A thermally and electrically conductive paste and its method of use for making a detachable and compliant thermal conductive connection between two surfaces or making an electrical connection between first and second electrical components. The paste is comprised of a liquid metal and particulate solid constituents which is non-solidifying, conformable, compliant, is removable, provides containment to impulsive loading, and is simple to apply.
摘要翻译：一种导热和导电的糊剂及其用于在两个表面之间制造可拆卸和柔性导热连接或在第一和第二电气部件之间形成电连接的方法。该糊状物由液体金属和非固化，顺应性，顺应性，可移除的颗粒状固体组分组成，提供了脉冲加载的容纳物，并且易于使用。

15. 发明授权

US4993482A Coiled spring heat transfer element 失效
标题翻译：螺旋弹簧传热元件
公开(公告)号：US4993482A
公开(公告)日：1991-02-19
申请号：US462688
申请日：1990-01-09
申请人： Thomas P. Dolbear , Richard D. Nelson , David A. Gibson , Omkarnath R. Gupta
发明人： Thomas P. Dolbear , Richard D. Nelson , David A. Gibson , Omkarnath R. Gupta
IPC分类号： F28F1/12 , F28F13/00 , H01L23/367
CPC分类号： F28F1/122 , F28F13/00 , H01L23/3677 , H01L2224/16225
摘要： A thermally conductive coiled spring laid on its side provides a compliant, high conductive, low force thermal path between a heat source and a heat sink. Each spring contact provides two parallel heat conduction paths via each coil in the spring. The spring can be canted to permit slidable contact with a surface. In one embodiment a plurality of copper springs arranged in parallel can provide a thermal path between an electronic component and a heat sink in close proximity. The springs may be permanently attached to at least one surface at the points of contact.
摘要翻译：布置在其侧面上的导热螺旋弹簧在热源和散热器之间提供顺从的，高导电的低力热路径。每个弹簧触点通过弹簧中的每个线圈提供两个平行的热传导路径。弹簧可以倾斜以允许与表面滑动接触。在一个实施例中，平行布置的多个铜弹簧可以在电子部件和靠近的散热器之间提供热路径。弹簧可以在接触点处永久地附接到至少一个表面。

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