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11. 发明授权

US5056706A Liquid metal paste for thermal and electrical connections 失效
标题翻译：用于热和电连接的液态金属膏
公开(公告)号：US5056706A
公开(公告)日：1991-10-15
申请号：US438563
申请日：1989-11-20
申请人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
发明人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
IPC分类号： B23K31/02 , B23K35/26 , H05K3/34
CPC分类号： B23K35/26 , B23K31/02 , H05K3/3463 , H05K3/3484
摘要： A thermally and electrically conductive paste and its method of use for making a detachable and compliant thermal conductive connection between two surfaces or making an electrical connection between first and second electrical components. The paste is comprised of a liquid metal and particulate solid constituents which is non-solidifying, conformable, compliant, is removable, provides containment to impulsive loading, and is simple to apply.
摘要翻译：一种导热和导电的糊剂及其用于在两个表面之间制造可拆卸和柔性导热连接或在第一和第二电气部件之间形成电连接的方法。该糊状物由液体金属和非固化，顺应性，顺应性，可移除的颗粒状固体组分组成，提供了脉冲加载的容纳物，并且易于使用。

12. 发明授权

US4993482A Coiled spring heat transfer element 失效
标题翻译：螺旋弹簧传热元件
公开(公告)号：US4993482A
公开(公告)日：1991-02-19
申请号：US462688
申请日：1990-01-09
申请人： Thomas P. Dolbear , Richard D. Nelson , David A. Gibson , Omkarnath R. Gupta
发明人： Thomas P. Dolbear , Richard D. Nelson , David A. Gibson , Omkarnath R. Gupta
IPC分类号： F28F1/12 , F28F13/00 , H01L23/367
CPC分类号： F28F1/122 , F28F13/00 , H01L23/3677 , H01L2224/16225
摘要： A thermally conductive coiled spring laid on its side provides a compliant, high conductive, low force thermal path between a heat source and a heat sink. Each spring contact provides two parallel heat conduction paths via each coil in the spring. The spring can be canted to permit slidable contact with a surface. In one embodiment a plurality of copper springs arranged in parallel can provide a thermal path between an electronic component and a heat sink in close proximity. The springs may be permanently attached to at least one surface at the points of contact.
摘要翻译：布置在其侧面上的导热螺旋弹簧在热源和散热器之间提供顺从的，高导电的低力热路径。每个弹簧触点通过弹簧中的每个线圈提供两个平行的热传导路径。弹簧可以倾斜以允许与表面滑动接触。在一个实施例中，平行布置的多个铜弹簧可以在电子部件和靠近的散热器之间提供热路径。弹簧可以在接触点处永久地附接到至少一个表面。

13. 发明授权

US5926371A Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device 失效
标题翻译：传热装置，其适应横过表面安装半导体器件的上表面的高差
公开(公告)号：US5926371A
公开(公告)日：1999-07-20
申请号：US846001
申请日：1997-04-25
申请人： Thomas P. Dolbear
发明人： Thomas P. Dolbear
IPC分类号： H01L23/40 , H01L23/433 , H05K1/02 , H05K7/20
CPC分类号： H05K1/0204 , H01L23/4006 , H01L23/433 , H01L2023/4043 , H01L2023/4062 , H01L2023/4068 , H01L2023/4087 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01012 , H01L2924/0102 , H01L2924/01046 , H01L2924/01055 , H01L2924/15311 , H01L2924/16152 , H01L2924/16251 , H05K1/0271 , H05K2201/10409 , H05K2201/10734 , H05K2201/2009 , H05K2203/1572
摘要： A heat transfer apparatus is presented accommodating elevational disparity of an upper surface of a semiconductor device with respect to the component side of a PCB without adversely affecting system reliability. The heat transfer apparatus includes a thermally conductive cap structure positioned between the semiconductor device and an ambient and thermally coupled to the semiconductor device. One embodiment includes one or more spacers which maintain a space between the cap structure and the semiconductor device. A chip mounted to the substrate of a ceramic BGA package is mechanically isolated from the cap structure by the spacers, preventing chip damage due to shock and vibration. A backing plate on a side of the PCB opposite the semiconductor device provides PCB structural support and additional heat transfer. Several fasteners attach the backing plate to the cap structure. A portion of the fasteners exert a force which urges the cap structure toward the semiconductor device, while the remainder of the fasteners fix the relative positions of the backing plate and the cap structure. Fixing the relative positions of the backing plate and the cap structure reduces creep problems and promotes stress relief in viscoplastic elements. A first thermal interface layer between the cap structure and the semiconductor device achieves an acceptably low thermal resistance value under a relatively small amount of pressure. The spacers are omitted in an alternate embodiment wherein the first thermal interface layer has a uniform thickness and a consistency which permits the thickness to be maintained during installation.
摘要翻译：本发明提供一种传热装置，其相对于PCB的组件侧适应半导体器件的上表面的高度差异，而不会不利地影响系统的可靠性。传热装置包括位于半导体器件和环境之间并热耦合到半导体器件的导热帽结构。一个实施例包括保持盖结构和半导体器件之间的空间的一个或多个间隔件。安装到陶瓷BGA封装的基板的芯片通过间隔物与盖结构机械隔离，防止由于冲击和振动引起的芯片损坏。在PCB的与半导体器件相对的一侧上的背板提供PCB结构支撑和额外的热传递。几个紧固件将背板连接到盖结构。紧固件的一部分施加一个推动帽结构朝向半导体器件的力，而其余的紧固件固定了背板和盖结构的相对位置。固定背板和盖结构的相对位置减少了蠕变问题，并促进了粘塑性元件的应力消除。帽结构和半导体器件之间的第一热界面层在相对较小的压力下实现可接受的低热阻值。在替代实施例中省略了间隔物，其中第一热界面层具有均匀的厚度和允许在安装期间保持厚度的稠度。

14. 发明授权

US5328087A Thermally and electrically conductive adhesive material and method of bonding with same 失效
标题翻译：导电粘合材料及其粘接方法
公开(公告)号：US5328087A
公开(公告)日：1994-07-12
申请号：US38420
申请日：1993-03-29
申请人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
发明人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
IPC分类号： C09J9/02 , H01B1/22 , H01R4/04 , H05K3/32 , H01L21/58
CPC分类号： H01L24/29 , C09J9/02 , H01B1/22 , H01L24/32 , H01R4/04 , H05K3/323 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29311 , H01L2224/29499 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H05K2201/0209 , H05K2201/023 , H05K2201/10719 , H05K2203/0425 , Y10T29/49126
摘要： The present invention discloses a thermally and electrically conductive adhesive material comprising a hardened adhesive, and a non-solidified filler containing a liquid metal dispersed in separate spaced regions of the adhesive. The hardened adhesive provides a mechanical bond whereas the filler provides continuous thermal and electrical metal bridges, each bridge extending through the adhesive and contacting the bonded surfaces. The method includes (a) dispersing a filler containing a liquid metal into an unhardened adhesive, (b) contacting the unhardened adhesive and the filler in non-solidified state to the surfaces resulting in separate spaced regions of the non-solidified filler contacting both surfaces, and (c) hardening the adhesive.
摘要翻译：本发明公开了一种导热粘合剂材料，其包括硬化粘合剂，以及含有液体金属的非固化填料，其分散在粘合剂的分开间隔的区域中。硬化的粘合剂提供机械结合，而填料提供连续的热和电金属桥，每个桥延伸通过粘合剂并接触粘结表面。该方法包括（a）将含有液态金属的填料分散在未硬化的粘合剂中，（b）将未硬化的粘合剂和非固化状态的填料接触到表面，从而形成与两个表面接触的非固化填料的分开的间隔区域，和（c）硬化粘合剂。

15. 发明授权

US5170930A Liquid metal paste for thermal and electrical connections 失效
标题翻译：用于热和电连接的液态金属膏
公开(公告)号：US5170930A
公开(公告)日：1992-12-15
申请号：US791706
申请日：1991-11-14
申请人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
发明人： Thomas P. Dolbear , Colin A. Mackay , Richard D. Nelson
IPC分类号： H01B1/02 , H01B1/16 , H01L23/48 , H01L23/482 , H01R4/58 , H01R13/03 , H05K3/34
CPC分类号： H05K3/3463 , H01B1/02 , H01B1/16 , H01L23/48 , H01L23/4828 , H01L24/29 , H01R13/03 , H01R4/58 , H01L2224/16 , H01L2224/16225 , H01L2224/29339 , H01L2224/32225 , H01L2224/73204 , H01L2224/73265 , H01L2224/83805 , H01L2224/8592 , H01L2924/01012 , H01L2924/01014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01025 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/14 , H01L2924/3011 , H01L2924/351 , H05K3/3484
摘要： A thermally and electrically conductive paste for making a detachable and compliant connection between two surfaces. The paste comprises an equilibrium mixture of an electrically conductive liquid metal and particulate solid constituents, wherein at the temperature of the paste during connection the proportions of liquid metal and particulate solid constituents remain between the ultimate liquidus and the ultimate solidus of the phase diagram of the mixture and the paste remains non-solidified. in cryogenic and low temperature environments the paste forms a hardened bond with a TCE matched to a contacted surface.
摘要翻译：一种用于在两个表面之间进行可拆卸和顺应连接的导热和导电的膏体。糊状物包括导电液体金属和颗粒状固体成分的平衡混合物，其中在连接期间浆料的温度下，液态金属和颗粒状固体成分的比例保留在最终液相线和最终液相线的最终固相线之间混合物，糊状物不固化。在低温和低温环境中，糊状物与与接触表面匹配的TCE形成硬化粘结。

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