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    • 14. 发明申请
    • Flip chip type nitride semiconductor light-emitting diode
    • 倒装芯片型氮化物半导体发光二极管
    • US20050269588A1
    • 2005-12-08
    • US10925934
    • 2004-08-26
    • Dong KimHyun Kim
    • Dong KimHyun Kim
    • H01L21/00H01L33/06H01L33/10H01L33/32H01L33/36H01L33/62H01L33/00
    • H01L33/405H01L33/32H01L33/387H01L33/44
    • The present invention provides a flip chip type nitride semiconductor light-emitting diode comprising a light-transmissive substrate for growing nitride single crystals; an n-type nitride semiconductor layer formed on the light-transmissive substrate; an active layer formed on the n-type nitride semiconductor layer; a p-type nitride semiconductor layer formed on the active layer; a mesh-type dielectric layer formed on the p-type nitride semiconductor layer and having a mesh structure with a plurality of open regions in which the p-type nitride semiconductor layer is exposed; a highly reflective ohmic contact layer formed on the mesh-type dielectric layer and the open regions in which the p-type nitride semiconductor layer is exposed; and a p-bonding electrode and an n-electrode formed on the highly reflective ohmic contact layer and the n-type nitride semiconductor layer, respectively.
    • 本发明提供一种倒装芯片型氮化物半导体发光二极管,其包括用于生长氮化物单晶的透光基板; 形成在所述透光性基板上的n型氮化物半导体层; 形成在所述n型氮化物半导体层上的有源层; 形成在有源层上的p型氮化物半导体层; 形成在所述p型氮化物半导体层上并且具有其中露出所述p型氮化物半导体层的多个开放区域的网状结构的网状电介质层; 形成在网状介电层上的高反射欧姆接触层和露出p型氮化物半导体层的开放区域; 以及分别形成在高反射欧姆接触层和n型氮化物半导体层上的p型接合电极和n电极。
    • 16. 发明申请
    • User interface design and evaluation system and hand interaction based user interface design and evaluation system
    • 用户界面设计和评估系统以及基于手动交互的用户界面设计和评估系统
    • US20060199167A1
    • 2006-09-07
    • US11293965
    • 2005-12-05
    • Ung YangYong KimWook SonHyun Kim
    • Ung YangYong KimWook SonHyun Kim
    • G09B25/00
    • G06F17/5009
    • A user interface design and evaluation system and a hand-interaction-based user interface design and evaluation system are provided. The user interface design and evaluation system includes: a user interface design unit, a human model interaction design unit, a user interface prototype simulation unit, a human model simulation unit, and a user interface evaluation unit. In order to develop a user interface in consideration of usability of a user, the system provides a usability evaluation feedback system performing optimization of an interface design based on a motion simulation of a body model and user interface model. Through this, an optimum interface design is derived and by reducing the initial usage difficulty of the new interface for a user, the user can easily use the new interface and work performance of the user can be enhanced. In addition, by supporting fast prototyping and evaluation in a new product development stage, efficient production of a product having a short life cycle can be actively implemented.
    • 提供了用户界面设计和评估系统以及基于手工交互的用户界面设计和评估系统。 用户界面设计和评估系统包括:用户界面设计单元,人体模型交互设计单元,用户界面原型模拟单元,人机模拟单元和用户界面评估单元。 为了开发用户界面,考虑到用户的可用性,系统提供了基于体模型和用户界面模型的运动模拟来执行接口设计优化的可用性评估反馈系统。 通过这种方式,推出了最佳的界面设计,通过减少用户新界面的初始使用难度,用户可以轻松使用新界面,可以提高用户的工作性能。 此外,通过在新产品开发阶段支持快速原型设计和评估,可以积极实施生命周期短的产品的高效生产。
    • 18. 发明申请
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US20050221521A1
    • 2005-10-06
    • US10983637
    • 2004-11-09
    • Jae LeeJeong LeeHyun KimYong Kim
    • Jae LeeJeong LeeHyun KimYong Kim
    • H01L21/00H01L29/22H01L33/22H01L33/32H01L33/38H01L33/62H01L33/00
    • H01L33/32H01L33/007H01L33/22Y10S257/918
    • Disclosed herein is a nitride semiconductor light emitting device having patterns formed on the upper and lower surfaces of a substrate from which light is emitted in a flip chip bonding structure wherein the patterns are capable of changing light inclination at the upper and lower surfaces of the substrate to decrease total reflection at the interfaces, thereby improving light emitting efficiency. The nitride semiconductor light emitting device comprises a substrate having upper and lower surfaces on which predetermined patterns are formed such that light can be incident within a critical angle, the substrate allowing a gallium nitride-based semiconductor material to be grown thereon, an n-type nitride semiconductor layer formed on the upper surface of the substrate, an active layer formed on the upper surface of the n-type nitride semiconductor layer such that the n-type nitride semiconductor layer is partially exposed, a p-type nitride semiconductor layer formed on the upper surface of the active layer, a p-electrode formed on the upper surface of the p-type nitride semiconductor layer, and an n-side electrode formed on the partially exposed n-type nitride semiconductor layer.
    • 本文公开了一种氮化物半导体发光器件,其具有形成在衬底的上表面和下表面上的图案,其中以倒装芯片接合结构发射光,其中图案能够改变衬底的上表面和下表面处的光倾斜度 以减少界面处的全反射,从而提高发光效率。 氮化物半导体发光器件包括具有上表面和下表面的衬底,在衬底上形成预定图案,使得光可以临界角入射,所述衬底允许在其上生长氮化镓基半导体材料,n型 形成在所述衬底的上表面上的氮化物半导体层,形成在所述n型氮化物半导体层的上表面上以使得所述n型氮化物半导体层部分暴露的有源层,形成在所述n型氮化物半导体层上的p型氮化物半导体层 有源层的上表面,形成在p型氮化物半导体层的上表面上的p电极和形成在部分暴露的n型氮化物半导体层上的n侧电极。
    • 20. 发明申请
    • Flip chip type nitride semiconductor light emitting device and manufacturing method thereof
    • 倒装芯片型氮化物半导体发光器件及其制造方法
    • US20050145875A1
    • 2005-07-07
    • US10861511
    • 2004-06-07
    • Hyun KimYong KimHyoun Shin
    • Hyun KimYong KimHyoun Shin
    • H01L21/28H01L33/10H01L33/32H01L33/38H01L33/40H01L33/62H01L33/00
    • H01L33/405H01L33/32
    • Disclosed herein are a flip chip type nitride semiconductor light emitting device, which comprises a substrate for growing a nitride semiconductor material, an n-type nitride semiconductor layer formed on the substrate, an active layer formed on at least a part of the n-type nitride semiconductor layer, a p-type nitride semiconductor layer formed on the active layer, a bonding force providing layer formed on the p-type nitride semiconductor layer and adapted to provide a bonding force relative to the p-type nitride semiconductor layer, a reflective electrode layer formed on the bonding force providing layer, and adapted to reflect light produced in the active layer toward the substrate and to diffuse electric current, and a cap layer formed on the reflective electrode layer, and adapted to provide a bonding force between the reflective electrode layer and a bonding metal and to reduce contact resistance.
    • 本文公开了一种倒装芯片型氮化物半导体发光器件,其包括用于生长氮化物半导体材料的衬底,形成在衬底上的n型氮化物半导体层,形成在n型氮化物半导体的至少一部分上的有源层 氮化物半导体层,形成在有源层上的p型氮化物半导体层,形成在p型氮化物半导体层上并适于提供相对于p型氮化物半导体层的结合力的接合力提供层,反射 电极层,形成在所述接合力提供层上,并且适于将在所述有源层中产生的光朝向所述衬底反射并扩散电流;以及覆盖层,形成在所述反射电极层上,并且适于在所述反射层之间提供接合力 电极层和接合金属,并降低接触电阻。