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11. 发明申请

US20120062260A1 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 有权
公开(公告)号：US20120062260A1
公开(公告)日：2012-03-15
申请号：US13251789
申请日：2011-10-03
申请人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： G01R1/073 , G01R1/067
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

12. 发明申请

US20110198281A1 Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers 审中-公开
标题翻译：具有小于单个层的形成的最小特征尺寸的特征的多层三维结构
公开(公告)号：US20110198281A1
公开(公告)日：2011-08-18
申请号：US13040500
申请日：2011-03-04
申请人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： B01D39/00 , C25D1/08 , B32B5/18
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.
摘要翻译：多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙）用于形成结构。在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于最小特征尺寸。

13. 发明申请

US20110092988A1 Microdevices for Tissue Approximation and Retention, Methods for Using, and Methods for Making 审中-公开
标题翻译：用于组织近似和保留的微型装置，使用方法和制造方法
公开(公告)号：US20110092988A1
公开(公告)日：2011-04-21
申请号：US12909743
申请日：2010-10-21
申请人： Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： A61B17/10 , A61B17/08
CPC分类号： A61B17/0057 , A61B17/0401 , A61B17/0469 , A61B17/0482 , A61B17/0487 , A61B17/0643 , A61B17/083 , A61B2017/00345 , A61B2017/00526 , A61B2017/00575 , A61B2017/00592 , A61B2017/00606 , A61B2017/00623 , A61B2017/00628 , A61B2017/00663 , A61B2017/00668 , A61B2017/0409 , A61B2017/0435 , A61B2017/0462 , A61B2017/0464 , A61B2017/0488 , A61B2017/0495 , A61B2017/0496 , A61B2017/06052 , A61B2017/06176 , A61B2017/081 , A61B2017/22054
摘要： Embodiments of invention are directed to micro-scale of mesoscale tissue approximation instruments that may be delivered to the body of a patient during minimally invasive or other surgical procedures. In one group of embodiments, the instrument has an elongated (longitudinal) configuration while with two sets of expandable wings that each have a toggle configuration that can be made to expand when located on opposite sides of a distal tissue region and a proximal tissue region and can then be made to move toward one another to bring the two tissue regions into more a proximal position. In some embodiments, multiple tissue approximation instruments are located within a delivery system for sequential delivery to a patient's body.
摘要翻译：本发明的实施例涉及可在微创或其它外科手术过程中递送至患者体内的中尺度组织近似仪器的微尺度。在一组实施例中，仪器具有细长（纵向）构造，同时具有两组可扩张翼，每组具有肘节配置，当位于远端组织区域和近端组织区域的相对侧时，可以使其膨胀，然后可以使得彼此移动以使两个组织区域进入更靠近的位置。在一些实施例中，多个组织近似仪器位于递送系统内，用于顺序递送给患者的身体。

14. 发明申请

US20110022207A1 Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids 审中-公开
标题翻译：电泳化学结构通过交错层或通过选择性蚀刻和填充空隙的方法和装置
公开(公告)号：US20110022207A1
公开(公告)日：2011-01-27
申请号：US12851811
申请日：2010-08-06
申请人： Dennis R. Smalley
发明人： Dennis R. Smalley
IPC分类号： G06F17/50 , B32B37/02 , C25D5/48 , C25D5/34 , B32B38/10
CPC分类号： C25D5/02 , B33Y10/00 , B33Y50/00 , B33Y50/02 , B81B2201/042 , B81C1/00126 , B81C1/0038 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01P15/0802 , G01P15/125 , G06F17/5072 , H01L21/2885 , H01L21/76885 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.
摘要翻译：通过沉积第一材料，选择性地蚀刻第一材料（例如经由掩模），沉积第二材料以填充由蚀刻产生的空隙，然后平坦化沉积物以便结合层，电化学地制造多层结构被创建并且之后向之前形成的层添加附加层。第一和第二沉积可以是毯子或选择类型。用于形成连续层的形成过程的重复可以在有或没有变化（例如：在图案上的变化;与沉积，蚀刻和/或平面化操作相关联的数量或存在或参数的变化）中重复，操作顺序或沉积的材料）。其他实施例使用使用与其它层相关联地沉积的材料与一些层相关联地沉积材料的操作形成多层结构。

15. 发明申请

US20100314257A1 Methods of Reducing Interlayer Discontinuities in Electrochemically Fabricated Three-Dimensional Structures 审中-公开
标题翻译：减少电化学三维结构中层间不连续性的方法
公开(公告)号：US20100314257A1
公开(公告)日：2010-12-16
申请号：US12828283
申请日：2010-06-30
申请人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02
CPC分类号： C25D5/02 , B33Y10/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , H01P11/006
摘要： Disclosed methods reduce the discontinuities that between individual layers of a structure that is formed at least in part using electrochemical fabrication techniques. Discontinuities may exist between layers of a structure as a result of up-facing or down-facing regions defined in data descriptive of the structure or they may exist as a result of building limitations, e.g., those that result in non-parallel orientation between a building axis and sidewall surfaces of layers. Methods for reducing discontinuities may be applied to all regions or only to selected regions of the structure. Methods may be tailored to improve the accuracy between an original design of the structure and the structure as fabricated or they may simply be used to smooth the discontinuities between layers. Methods may include deposition operations that selectively favor filling of the discontinuities and/or etching operations that selectively favor removal of material from protrusions that define discontinuities.
摘要翻译：公开的方法减少了使用电化学制造技术至少部分形成的结构的各个层之间的不连续性。结构的层之间可能存在不连续性，这是由于在描述结构的数据中定义的面向上或向下的区域的结果，或者它们可能由于构建限制而存在，例如导致在建筑轴线和层的侧壁表面。用于减少不连续性的方法可以应用于所有区域或仅应用于结构的选定区域。可以调整方法以提高结构的原始设计和所制造的结构之间的精度，或者可以简单地用于平滑层之间的不连续性。方法可以包括选择性地有利于填充不连续性和/或蚀刻操作的沉积操作，其选择性地有利于从限定不连续性的突起中去除材料。

16. 发明申请

US20100176834A1 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 审中-公开
标题翻译：用于接触电子元件的悬臂式微孔和制造这种探针的方法
公开(公告)号：US20100176834A1
公开(公告)日：2010-07-15
申请号：US12724287
申请日：2010-03-15
申请人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： G01R1/067 , G01R31/02
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
摘要翻译：本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。具体地，实施例涉及悬臂式探针结构的各种设计。一些实施例涉及制造这种悬臂结构的方法。在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗能力和/或类似物。

17. 发明申请

US20100133109A1 Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures 审中-公开
标题翻译：电化学制造的密封微结构，以及用于生产这种结构的方法和装置
公开(公告)号：US20100133109A1
公开(公告)日：2010-06-03
申请号：US12624240
申请日：2009-11-23
申请人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Vacit Arat , Christopher A. Bang , John C. Dixon
发明人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Vacit Arat , Christopher A. Bang , John C. Dixon
IPC分类号： C25D5/02 , C25D5/48 , C25D7/00
CPC分类号： B81C1/00293 , B81B2201/042 , B81C1/00333 , B81C2201/0197 , B81C2203/0145 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
摘要翻译：在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。密封材料位于开口附近。在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。此后，使密封材料流动，密封开口并重新固化。在其他实施例中，添加了后层形成盖或其它外壳完成结构。

18. 发明申请

US20100051466A1 Method of Forming Electrically Isolated Structures Using Thin Dielectric Coatings 审中-公开
标题翻译：使用薄介电涂层形成电隔离结构的方法
公开(公告)号：US20100051466A1
公开(公告)日：2010-03-04
申请号：US12506547
申请日：2009-07-21
申请人： Dennis R. Smalley , Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard
发明人： Dennis R. Smalley , Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard
IPC分类号： C25D1/20 , C25D5/10
CPC分类号： A61N1/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D1/20 , C25D5/022 , G01R1/0483 , G01R1/06716 , G01R1/07357 , G01R31/2886 , H05K3/467 , H05K3/4682
摘要： Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.
摘要翻译：用于生产多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层，包括用于提供将第一导电材料的至少一部分与（1）第一导电材料的其它部分，（2）第二导电材料或（3）另一种电介质材料，并且其中电介质涂层的厚度与用于形成结构的层的厚度相比较薄。在一些优选实施例中，每个单独层的部分被电介质材料包封，而在其它实施例中，材料的不同区域之间的边界通过电介质屏障彼此隔离。

19. 发明申请

US20090301893A1 Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks 审中-公开
标题翻译：使用粘附掩模形成多层结构的方法和装置
公开(公告)号：US20090301893A1
公开(公告)日：2009-12-10
申请号：US12479638
申请日：2009-06-05
申请人： Adam L. Cohen , Jill R. Thomassian , Michael S. Lockard , Marvin M. Kilgo, III , Uri Frodis , Dennis R. Smalley
发明人： Adam L. Cohen , Jill R. Thomassian , Michael S. Lockard , Marvin M. Kilgo, III , Uri Frodis , Dennis R. Smalley
IPC分类号： C25D5/02 , C25F5/00
CPC分类号： C25D1/003 , C25D1/00 , C25D1/20 , C25D5/02 , C25D5/022 , C25D5/10 , C25D5/14 , C25D5/48 , C25D5/50
摘要： Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.
摘要翻译：提供了多种电化学制造方法和装置，用于使用粘附的掩模（例如由液体光致抗蚀剂或干膜形成）从多层沉积材料制备多层结构（例如具有中尺度或微尺度特征），其中两个或者可以在每层中提供更多的材料，其中至少一种材料是结构材料，并且任何其它材料中的一种或多种可以是在形成结构之后被去除的牺牲材料。材料可以包括以无电解方式电沉积或沉积的导电材料。在一些实施例中，特别注意确保在连续层上形成的图案之间的对准。

20. 发明授权

US07527721B2 Electrochemical fabrication method for producing multi-layer three-dimensional structures on a porous dielectric 有权
标题翻译：在多孔电介质上制造多层三维结构的电化学制造方法
公开(公告)号：US07527721B2
公开(公告)日：2009-05-05
申请号：US10841378
申请日：2004-05-07
申请人： Pavel B. Lembrikov , Dennis R. Smalley , Adam L. Cohen
发明人： Pavel B. Lembrikov , Dennis R. Smalley , Adam L. Cohen
IPC分类号： C25D5/10
CPC分类号： C25D5/022 , B33Y10/00 , C25D5/10 , C25D5/48
摘要： Multi-layer structures are electrochemically formed on porous dielectric substrates. In some embodiments, the substrates have at least one surface which is infiltrated with a sacrificial conductive material, all pores (e.g. openings in between dielectric regions of the substrate) or selected pores near the surface of the substrate are opened, and a structural material is deposited to fill at least a portion of the opened pores. If more pores are opened than have been filled or will be filled by the structural material a sacrificial material may be deposited to fill the additional pores. After completing formation of an initial patterned surface on the substrate, a plurality of layers are formed on the substrate (e.g. via electrodeposition operations) and after layer formation is complete, the conductive sacrificial material filling the pores is removed.
摘要翻译：多层结构在多孔电介质基片上电化学形成。在一些实施例中，衬底具有至少一个被牺牲导电材料渗透的表面，所有孔（例如衬底的电介质区域之间的开口）或衬底表面附近的选定孔被打开，结构材料是沉积以填充至少一部分打开的孔。如果比已经填充的孔更多的孔被打开，或者将被结构材料填充，则可以沉积牺牲材料以填充附加的孔。在衬底上形成初始图案化表面之后，在衬底上形成多个层（例如通过电沉积操作），并且在层形成完成之后，去除填充孔的导电牺牲材料。

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