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    • 14. 发明申请
    • EXTERNAL VERIFICATION OF PACKAGE PROCESSED LINEWIDTHS AND SPACINGS IN SEMICONDUCTOR PACKAGES
    • 封装处理线路和半导体封装中的间隔的外部验证
    • US20050046410A1
    • 2005-03-03
    • US10604933
    • 2003-08-27
    • Thomas FleischmanDavid Long
    • Thomas FleischmanDavid Long
    • G01R31/02G01R1/00
    • G01R31/023
    • Disclose is a method that forms non-functional test structures in kerf regions outside functional wiring modules of the ceramic greensheets and across edges of the functional wiring modules, and an associated structure. In order to check or test the spacing and size of wires in functional wiring modules, the invention only needs to examine the non-functional test structures as exposed by cutting the multi-module greensheet along the laminate trim line or by dicing of the greensheet into individual modules. The non-functional wires have the same design spacing, size, and angles as wires in the functional wiring modules. Therefore, the non-functional test structures comprise representative wires of wires in the functional wiring modules.
    • Disclose是一种在陶瓷毛坯的功能接线模块和功能接线模块的边缘之间的切口区域中形成非功能测试结构的方法,以及相关联的结构。 为了检查或测试功能接线模块中导线的间距和尺寸,本发明仅需要检查通过沿着层叠装饰线切割多模块毛坯而暴露的非功能测试结构,或者通过将毛坯切割成 单个模块。 非功能导线与功能接线模块中的导线具有相同的设计间距,尺寸和角度。 因此,非功能测试结构包括功能布线模块中的代表性的导线。