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11. 发明授权

US06449155B1 Land grid array subassembly for multichip modules 失效
标题翻译：用于多芯片模块的Land Grid阵列子组件
公开(公告)号：US06449155B1
公开(公告)日：2002-09-10
申请号：US09927056
申请日：2001-08-09
申请人： John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Danny E. Massey , Arvind Kumar Sinha
发明人： John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Danny E. Massey , Arvind Kumar Sinha
IPC分类号： H05K720
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A multichip module subassembly is disclosed which provides for a heatsink, a thermal interface, a module cap upon which a multichip module is mounted, a land grid array interposer, and an assembly cover. The module cap has shimmed load posts and adjustable brackets for precise alignment and loading of the interposer onto the module. The cover may have a springplate for precise preloading of the interposer onto the multichip module for transportation. The multichip module subassembly is easily used as a field replaceable unit.
摘要翻译：公开了一种多芯片模块子组件，其提供散热器，热接口，安装多芯片模块的模块盖，平台栅格阵列插入件和组件盖。模块盖已经垫上了负载柱和可调节支架，用于将插入件精确对准和加载到模块上。盖可以具有用于将插入件精确地预加载到多芯片模块上用于运输的弹簧板。多芯片模块子组件可轻松用作现场可更换单元。

12. 发明授权

US06385044B1 Heat pipe heat sink assembly for cooling semiconductor chips 失效
标题翻译：用于冷却半导体芯片的热管散热器组件
公开(公告)号：US06385044B1
公开(公告)日：2002-05-07
申请号：US09917446
申请日：2001-07-27
申请人： John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Danny E. Massey , Arvind Kumar Sinha
发明人： John Lee Colbert , John Saunders Corbin, Jr. , Roger Duane Hamilton , Danny E. Massey , Arvind Kumar Sinha
IPC分类号： H05K720
CPC分类号： H01L23/427 , H01L21/4882 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and method are disclosed to provide heat pipe cooling for semiconductor chips mounted on a module. Each chip is provided its own heat pipe for cooling. A piston on the end of each heat pipe is loaded against each chip with a predetermined force without the need for counting turns of a screw or use of torque measurement tools. Each heat pipe draws heat away from the chip it is loaded against, carrying the heat to a heat sink for dissipation into the ambient. A large multichip module can be loaded against a land grid array interposer with uniform loading of the interposer. This interposer loading is accomplished independently of the loading of the heat pipes against the chips.
摘要翻译：公开了一种为安装在模块上的半导体芯片提供热管冷却的装置和方法。每个芯片都设有自己的热管用于冷却。每个热管的端部上的活塞以预定的力加载到每个芯片上，而不需要计数螺杆的转数或使用扭矩测量工具。每个热管将热量从其被加载的芯片上吸走，将热量传递到散热器以耗散到环境中。一个大的多芯片模块可以被加载到具有均匀的插入器负载的焊盘栅格阵列插入器上。该插入器负载独立于热管对芯片的负载而完成。

13. 发明授权

US06180874B2 High density heatsink attachment and method therefor 失效
标题翻译：高密度散热器附件及其方法
公开(公告)号：US06180874B2
公开(公告)日：2001-01-30
申请号：US09097891
申请日：1998-06-15
申请人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Howard Victor Mahaney, Jr. , James Robert Taylor
发明人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Howard Victor Mahaney, Jr. , James Robert Taylor
IPC分类号： H01L2326
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method of mounting an array of different heatsinks to a closely packed array of processors, cache controller devices, and any other type of data processing element utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the comers where the devices are attached to the printed circuit board.
摘要翻译：将不同散热器的阵列安装到紧密堆叠的处理器阵列，高速缓存控制器设备以及在数据处理系统内使用的任何其他类型的数据处理元件的装置和方法。该装置包括在底部具有多个孔的金属框架，以允许接近将提供散热器的装置的顶部。金属框架具有允许访问下面的数据处理元件的顶部的多个孔。金属框架用作用于多个散热器的容纳车辆，并且还提供刚性，其特征在于在设备附接到印刷电路板的拐角特别脆弱的附近的印刷电路板。

14. 发明授权

US07463017B2 Functional and stress testing of LGA devices 失效
公开(公告)号：US07463017B2
公开(公告)日：2008-12-09
申请号：US11747213
申请日：2007-05-10
申请人： John Saunders Corbin, Jr. , Jose Arturo Garza , Dales Morrison Kent , Kenneth Carl Larsen , Howard Victor Mahaney, Jr. , Hoa Thanh Phan , John Joseph Salazar
发明人： John Saunders Corbin, Jr. , Jose Arturo Garza , Dales Morrison Kent , Kenneth Carl Larsen , Howard Victor Mahaney, Jr. , Hoa Thanh Phan , John Joseph Salazar
IPC分类号： G01R31/02
CPC分类号： G01R31/2891
摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

15. 发明授权

US06911836B2 Apparatus for functional and stress testing of exposed chip land grid array devices 失效
标题翻译：暴露芯片阵列阵列器件的功能和应力测试仪器
公开(公告)号：US06911836B2
公开(公告)日：2005-06-28
申请号：US10645038
申请日：2003-08-21
申请人： Lonnie J. Cannon , John Saunders Corbin, Jr. , David Lewis Gardell , Jose Arturo Garza , Jeffrey Frank Kutner , Kenneth Carl Larsen , Howard Victor Mahaney, Jr. , John Joseph Salazar
发明人： Lonnie J. Cannon , John Saunders Corbin, Jr. , David Lewis Gardell , Jose Arturo Garza , Jeffrey Frank Kutner , Kenneth Carl Larsen , Howard Victor Mahaney, Jr. , John Joseph Salazar
IPC分类号： G01R31/26
CPC分类号： G01R31/2891
摘要： A chip testing system with improved thermal performance. In a preferred embodiment, a nest assembly of a chip testing apparatus includes tooling balls and a fitted frame for improving alignment of a coldplate and a chip surface. In preferred embodiments, the coldplate is of unibody design. Thermal performance is also improved by balancing the forces exerted on the coldplate using an adjustable hose mounting bracket. The bracket allows the forces exerted by the hoses on the coldplate to be adjusted so they balance and cancel other unwanted forces on the cold plate.
摘要翻译：具有改善热性能的芯片测试系统。在优选实施例中，芯片测试装置的嵌套组件包括工具球和用于改善冷板和芯片表面的对准的装配框架。在优选实施例中，冷板具有一体设计。通过使用可调节软管安装支架平衡施加在冷板上的力，也可以提高热性能。支架允许由软管施加在冷板上的力进行调节，从而平衡并消除冷板上的其他不必要的力。

16. 发明授权

US06278615B1 Heatsink grounding spring and shield apparatus 失效
标题翻译：散热器接地弹簧和屏蔽装置
公开(公告)号：US06278615B1
公开(公告)日：2001-08-21
申请号：US09343452
申请日：1999-06-30
申请人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Daniel Edward Massey
发明人： Johnny Roy Brezina , John Saunders Corbin, Jr. , Daniel Edward Massey
IPC分类号： H05K900
CPC分类号： H05K9/0039 , H01L23/433 , H01L23/552 , H01L2924/0002 , Y10T24/44923 , H01L2924/00
摘要： A heatsink grounding mechanism and an associated circuit card and computer system. The circuit card includes a printed circuit board to an integrated circuit module is attached. A heatsink is positioned in contact with or in close proximity to the integrated circuit module package. A heatsink grounding piece of the grounding mechanism is utilized to ground the heatsink. The grounding piece includes a substantially rectangular and conductive grounding piece ring that defines an aperture. The dimensions are suitable for receiving and circumventing the integrated circuit module. The grounding piece includes a set of semi-rigid conductive spring arms that extend away from the grounding piece ring. The spring arms are positioned and oriented such that termination points of the spring arms contact grounding pads on the printed circuit board when the grounding piece is compressed between the heatsink and the circuit board. The force of the spring arms against the circuit board maintains the grounding piece ring in electrical contact with the heat sink and the termination points of the spring arms in electrical contact with the grounding plates.
摘要翻译：散热器接地机构及相关电路卡及计算机系统。电路卡包括连接到集成电路模块的印刷电路板。散热器被定位成与集成电路模块封装件接触或紧邻集成电路模块封装。使用接地机构的散热片接地片将散热器接地。接地件包括限定孔的大致矩形且导电的接地片环。尺寸适用于接收和规避集成电路模块。接地件包括远离接地片环延伸的一组半刚性导电弹簧臂。弹簧臂定位和定向，使得当接地片在散热器和电路板之间被压缩时，弹簧臂的端接点接触印刷电路板上的接地焊盘。弹簧臂抵靠电路板的力使接地片环与散热片电气接触，弹簧臂的端接点与接地板电接触。

17. 发明授权

US06229708B1 Multi-axis microprocess or docking mechanism 失效
标题翻译：多轴微处理或对接机制
公开(公告)号：US06229708B1
公开(公告)日：2001-05-08
申请号：US09276336
申请日：1999-03-25
申请人： John Saunders Corbin, Jr. , David Allen Hall , Kenneth Carl Larsen , Mark Wayne Mueller , Peter Matthew Thomsen
发明人： John Saunders Corbin, Jr. , David Allen Hall , Kenneth Carl Larsen , Mark Wayne Mueller , Peter Matthew Thomsen
IPC分类号： H05K700
CPC分类号： H05K7/1431
摘要： A mechanism has a subassembly that contains a microprocessor. The mechanism allows the microprocessor to be easily installed through frontal or rear access into a rack drawer and subsequently docked into a receiving assembly. The docking mechanism is multi-axis in that installation of the subassembly occurs along a single axis, but docking of the microprocessor occurs along an axis that is normal to the installation axis. Actuation of the installation mechanism is accomplished with a front-to-rear motion which sequentially provides a power connection to the microprocessor and displaces it in a vertical motion. This vertical motion registers and mates the microprocessor with the assembly. The microprocessor is preloaded in its final latched position to restrain it from shock and vibration events while supporting the assembly in a fixed and stable position.
摘要翻译：机构具有包含微处理器的子组件。该机构允许微处理器通过正面或后部访问容易地安装到机架抽屉中，并随后对接到接收组件中。对接机构是多轴的，因为子组件的安装沿着单个轴线发生，但是微处理器沿着垂直于安装轴线的轴发生。安装机构的启动是通过前后运动完成的，其顺序地提供到微处理器的电力连接并以垂直运动来移位。该垂直运动将微处理器与组件对齐并配合。微处理器预先装载在其最终的锁定位置，以将其组装在一个固定和稳定的位置上，以防止其受到冲击和振动。

18. 发明授权

US5713690A Apparatus for attaching heatsinks 失效
标题翻译：用于连接散热器的装置
公开(公告)号：US5713690A
公开(公告)日：1998-02-03
申请号：US653893
申请日：1996-05-28
申请人： John Saunders Corbin, Jr. , Ciro Neal Ramirez
发明人： John Saunders Corbin, Jr. , Ciro Neal Ramirez
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , Y10T403/47 , Y10T403/477
摘要： A method and apparatus for attaching heatsinks having a disproportional size relative to the electronic component to which they are attached. In general, the apparatus comprises variable-length attaching means for attaching each corner of the heatsink to the circuit card while maintaining sufficient contact with the electronic component. The variable-length attaching means includes a post and a receiving well. Both the post and receiving well include attaching means, such as threads and nuts, for attachment to the heatsink and circuit board, respectively. The variable-length attaching means accommodates height variations between parts, establishes high structural integrity after assembly, controls static and dynamic loading of the solder columns, allows for module re-work while re-using the heatsink and card, and provides adequate protection from shock, vibration, and handling.
摘要翻译：一种用于连接相对于它们所连接的电子部件具有不成比例尺寸的散热器的方法和装置。通常，该装置包括可变长度的附接装置，用于将散热器的每个角连接到电路卡，同时保持与电子部件的充分接触。可变长度附接装置包括柱和接收井。柱和接收井都分别包括用于附接到散热器和电路板的附接装置，例如螺纹和螺母。可变长度的连接装置适应部件之间的高度变化，在组装之后建立高结构完整性，控制焊料柱的静态和动态负载，允许模块在重新使用散热器和卡片时重新工作，并提供足够的防震保护，振动和处理。

19. 发明授权

US07479796B2 Functional and stress testing of LGA devices 失效
标题翻译： LGA器件的功能和压力测试
公开(公告)号：US07479796B2
公开(公告)日：2009-01-20
申请号：US11747202
申请日：2007-05-10
申请人： John Saunders Corbin, Jr. , Jose Arturo Garza , Dales Morrison Kent , Kenneth Carl Larsen , Howard Victor Mahaney, Jr. , Hoa Thanh Phan , John Joseph Salazar
发明人： John Saunders Corbin, Jr. , Jose Arturo Garza , Dales Morrison Kent , Kenneth Carl Larsen , Howard Victor Mahaney, Jr. , Hoa Thanh Phan , John Joseph Salazar
IPC分类号： G01R31/02
CPC分类号： G01R31/2891
摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.
摘要翻译：公开了用于测试LGA设备的改进的方法，系统和设备。一个示例性实施例包括测试嵌套组件冷却线的垂直布线，以便最小化测试嵌套足迹并增加单个测试卡上的可用测试位置。另一示例性实施例包括将外部负载和力矩隔离并调整到散热器/冷板中，其中这些负载和力矩涉及控制质心以恢复散热片/芯片接口的更理想的热性能。另一个示例性实施例包括便于LGA插座的简单且低成本替换的嵌套架构。最后，另一示例性实施例包括通过使用干式空气排气对测试巢组件部件进行有效的冷凝控制。

20. 发明授权

US07456644B2 Functional and stress testing of LGA devices 失效
公开(公告)号：US07456644B2
公开(公告)日：2008-11-25
申请号：US11747210
申请日：2007-05-10
申请人： John Saunders Corbin, Jr. , Jose Arturo Garza , Dales Morrison Kent , Kenneth Carl Larsen , Howard Victor Mahaney, Jr. , Hoa Thanh Phan , John Joseph Salazar
发明人： John Saunders Corbin, Jr. , Jose Arturo Garza , Dales Morrison Kent , Kenneth Carl Larsen , Howard Victor Mahaney, Jr. , Hoa Thanh Phan , John Joseph Salazar
IPC分类号： G01R31/02
CPC分类号： G01R31/2891
摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

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