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    • 11. 发明授权
    • System and method for cooling an electronic device
    • 用于冷却电子设备的系统和方法
    • US08392035B2
    • 2013-03-05
    • US13024159
    • 2011-02-09
    • Chandrakant PatelCullen E. BashRatnesh K. Sharma
    • Chandrakant PatelCullen E. BashRatnesh K. Sharma
    • G05D23/00H05K7/20
    • G06F1/20G06F1/206H01L2924/0002Y02D10/16H01L2924/00
    • A system for cooling an electronic device having a heat-generating component includes a passive cooling device having a cooling ability designed to expire after a predetermined amount of heat is absorbed from the heat-generating component and an active cooling device configured to at least one of dissipate heat generated by the heat-generating component and cool the passive cooling device, when the active cooling device is activated. The system also includes a controller configured to activate the active cooling device after a determination that a predetermined threshold condition has occurred, wherein the predetermined threshold condition is selected to occur after the passive cooling device cooling ability has substantially expired, to thereby substantially minimize power consumption of the active cooling device in cooling the heat-generating component.
    • 一种用于冷却具有发热部件的电子装置的系统,包括:被动冷却装置,其具有设计成在从所述发热部件吸收预定量的热量之后到期的冷却能力;以及主动冷却装置,其被配置为至少一个 当主动冷却装置启动时,散发由发热部件产生的热量并冷却被动冷却装置。 该系统还包括控制器,该控制器被配置为在确定已经发生预定阈值条件之后激活主动冷却装置,其中在被动冷却装置冷却能力已经基本到期之后选择发生预定阈值条件,从而基本上最小化功耗 主动冷却装置在冷却发热部件时。
    • 12. 发明授权
    • System and method for cooling an electronic device
    • 用于冷却电子设备的系统和方法
    • US07903409B2
    • 2011-03-08
    • US11779624
    • 2007-07-18
    • Chandrakant PatelCullen E. BashRatnesh K. Sharma
    • Chandrakant PatelCullen E. BashRatnesh K. Sharma
    • H05K7/20F28F7/00H01L23/34G05D16/00
    • G06F1/20G06F1/206H01L2924/0002Y02D10/16H01L2924/00
    • A system for cooling an electronic device having a heat-generating component includes a passive cooling device having a cooling ability designed to expire after a predetermined amount of heat is absorbed from the heat-generating component and an active cooling device configured to at least one of dissipate heat generated by the heat-generating component and cool the passive cooling device, when the active cooling device is activated. The system also includes a controller configured to activate the active cooling device after a determination that a predetermined threshold condition has occurred, wherein the predetermined threshold condition is selected to occur after the passive cooling device cooling ability has substantially expired, to thereby substantially minimize power consumption of the active cooling device in cooling the heat-generating component.
    • 一种用于冷却具有发热部件的电子装置的系统,包括:被动冷却装置,其具有设计成在从所述发热部件吸收预定量的热量之后到期的冷却能力;以及主动冷却装置,其被配置为至少一个 当主动冷却装置启动时,散发由发热部件产生的热量并冷却被动冷却装置。 该系统还包括控制器,该控制器被配置为在确定已经发生预定阈值条件之后激活主动冷却装置,其中在被动冷却装置冷却能力已经基本到期之后选择发生预定阈值条件,从而基本上最小化功率消耗 主动冷却装置在冷却发热部件时。
    • 18. 发明授权
    • Dynamic fluid sprayjet delivery system
    • 动态流体喷射喷射系统
    • US07240500B2
    • 2007-07-10
    • US10664256
    • 2003-09-17
    • Cullen E. BashChandrakant D. PatelRatnesh K. Sharma
    • Cullen E. BashChandrakant D. PatelRatnesh K. Sharma
    • F28C1/00
    • H01L23/4735B05B15/68H01L2924/0002H01L2924/00
    • An adaptable semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. Within the enclosure is a sprayer delivery system with a height-controllable sprayer for spraying hot components. The sprayer delivery system has an actuator configured to move the sprayer among positions for spraying different components. The actuator can be of the types used for ink-jet printers or X-Y plotters. Alternatively, the actuator can be a continuous ribbon loop, or a series of radially extending rails. The actuator and sprayer are controlled by a controller, which also controls a configuration system that configures the sprayer delivery system for use with different boards. The controller uses sensors that sense the temperature of the hot components.
    • 一种可适应的半导体芯片冷却系统,其具有容易打开的外壳,其限定了被配置为容纳承载待冷却部件的印刷电路板的室。 在外壳内是一个喷雾器输送系统,具有高度可控的喷雾器,用于喷涂热部件。 喷雾器输送系统具有构造成将喷雾器移动到用于喷射不同部件的位置的致动器。 致动器可以是用于喷墨打印机或X-Y绘图仪的类型。 或者,致动器可以是连续的带状环或一系列径向延伸的轨道。 执行器和喷雾器由控制器控制,控制器还控制配置系统,配置喷雾器输送系统以与不同的板一起使用。 控制器使用感测热部件温度的传感器。