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    • 14. 发明授权
    • Apparatus for cleaving crystals
    • 用于切割晶体的装置
    • US06223961B1
    • 2001-05-01
    • US09298773
    • 1999-04-22
    • Dmitri BoguslavskyColin SmithArnon Ben-Nathan
    • Dmitri BoguslavskyColin SmithArnon Ben-Nathan
    • B26F300
    • B28D5/0023Y10T225/325Y10T225/371
    • Apparatus for cleaving a crystalline segment, including a pair of aligning pins facing a first cleave plane formed on a first side of a crystalline segment, an impact pin facing a second cleave plane formed on a second side of the crystalline segment opposite to the first side, the crystalline segment having a cleave line extending between and generally perpendicular to the opposing cleave planes, and an actuator connected to at least one of the aligning pins and the impact pin, for causing relative movement of the aligning pins and the impact pin towards each other, such that the aligning pins abut against the first cleave plane and the impact pin abuts against the second cleave plane.
    • 用于切割晶体段的装置,包括面对形成在结晶段的第一侧上的第一解理平面的一对对齐销,面对形成在与第一侧相对的结晶段的第二侧上的第二解理面的冲击销 所述结晶段具有在相对的解理平面之间延伸并且大致垂直于相对的解理平面的切割线,以及连接到对准销和冲击销中的至少一个的致动器,用于使对准销和冲击销相对于每个 另一方面,使得对准销抵靠第一解理面并且冲击销抵靠第二解理面。