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11. 发明授权

US6111425A Very low power logic circuit family with enhanced noise immunity 有权
标题翻译：超低功耗逻辑电路系列，具有增强的抗噪声能力
公开(公告)号：US6111425A
公开(公告)日：2000-08-29
申请号：US173436
申请日：1998-10-15
申请人： Claude L. Bertin , Russell J. Houghton , Wilbur D. Pricer , William R. Tonti
发明人： Claude L. Bertin , Russell J. Houghton , Wilbur D. Pricer , William R. Tonti
IPC分类号： H03K19/003 , H03K3/356 , H03K19/173 , H03K17/16
CPC分类号： H03K3/356113 , H03K19/1738
摘要： A very low power logic circuit family which advantageously provides 1) retained high performance, 2) significantly reduced power dissipation, and 3) enhanced noise immunity. In a first set of embodiments, dual rail complementary logic signals are utilized to improve circuit immunity to external noise and to reduce noise generated by the logic circuit itself. A receiver portion of the present invention comprises two input FETs having cross coupling of the two gates to the two sources. In one preferred embodiment, both receiver and driver portions are connected in a repeater with all N channel drivers. A second set of embodiments have a single sided input in an unbalanced receiver comprising cross coupled source to gate N channel and cross coupled drain to gate P channel output transistors.
摘要翻译：一个非常低功率的逻辑电路系列，有利地提供1）保持高性能，2）显着降低的功耗，和3）增强的抗噪声能力。在第一组实施例中，使用双轨互补逻辑信号来提高对外部噪声的电路抗扰性并且减少由逻辑电路本身产生的噪声。本发明的接收机部分包括具有两个门到两个源的交叉耦合的两个输入FET。在一个优选实施例中，接收器和驱动器部分都连接在具有所有N个通道驱动器的中继器中。第二组实施例在不平衡接收机中具有单侧输入，包括到栅极N沟道的交叉耦合源极和栅极P沟道输出晶体管的交叉耦合漏极。

12. 发明授权

US06596592B2 Structures and methods of anti-fuse formation in SOI 失效
公开(公告)号：US06596592B2
公开(公告)日：2003-07-22
申请号：US10066759
申请日：2002-02-06
申请人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
发明人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
IPC分类号： H01L21336
CPC分类号： H01L23/5252 , H01L27/10829 , H01L27/10897 , H01L27/1203 , H01L29/66181 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An anti-fuse structure that can be programmed at low voltage and current and which potentially consumes very little chip spaces and can be formed interstitially between elements spaced by a minimum lithographic feature size is formed on a composite substrate such as a silicon-on-insulator wafer by etching a contact through an insulator to a support semiconductor layer, preferably in combination with formation of a capacitor-like structure reaching to or into the support layer. The anti-fuse may be programmed either by the selected location of conductor formation and/or damaging a dielectric of the capacitor-like structure. An insulating collar is used to surround a portion of either the conductor or the capacitor-like structure to confine damage to the desired location. Heating effects voltage and noise due to programming currents are effectively isolated to the bulk silicon layer, permitting programming during normal operation of the device. Thus the potential for self-repair without interruption of operation is realized.

13. 发明授权

US06574763B1 Method and apparatus for semiconductor integrated circuit testing and burn-in 失效
标题翻译：用于半导体集成电路测试和老化的方法和装置
公开(公告)号：US06574763B1
公开(公告)日：2003-06-03
申请号：US09473886
申请日：1999-12-28
申请人： Claude L. Bertin , Erik L. Hedberg , Russell J. Houghton , William R. Tonti
发明人： Claude L. Bertin , Erik L. Hedberg , Russell J. Houghton , William R. Tonti
IPC分类号： G01R3128
CPC分类号： G01R31/287
摘要： A burn-in process is provided for a memory array having redundant bits and addressable storage locations. The burn-in process includes the steps of raising the temperature of the memory array to a pre-determined temperature, testing all bits in the array, detecting faulty bits and operable bits, replacing faulty bits with redundant operable bits, correcting any defects in the array in-situ, and lowering the temperature of the memory array to ambient temperature to complete the burn-in process. An apparatus for carrying out the above process is provided that includes a test circuit for generating a test pattern and for applying the test pattern to the memory array so as to test all bits within the memory array. A comparison circuit, coupled to the test circuit and adapted to couple to the memory array, compares an actual response and an expected response of the memory array to the test pattern and detects faulty and operable bits based thereon. A failed address buffer register, coupled to the comparison circuit and to the test circuit, stores an address of each addressable storage location that has a faulty bit. Sparing control logic, coupled to the failed address buffer register and adapted to couple to the memory array, reads out each address stored by the failed address buffer register and replaces each faulty bit with a redundant operable bit.
摘要翻译：为具有冗余位和可寻址存储位置的存储器阵列提供老化过程。老化过程包括以下步骤：将存储器阵列的温度升高到预定温度，测试阵列中的所有位，检测故障位和可操作位，用冗余的可操作位代替故障位，校正在阵列原位，并将存储器阵列的温度降低到环境温度以完成老化过程。提供了一种用于执行上述处理的装置，其包括用于生成测试图案并将测试图案应用于存储器阵列的测试电路，以便测试存储器阵列内的所有位。耦合到测试电路并且适于耦合到存储器阵列的比较电路将存储器阵列的实际响应和预期响应与测试模式进行比较，并基于此检测故障和可操作的位。耦合到比较电路和测试电路的故障地址缓冲寄存器存储具有错误位的每个可寻址存储位置的地址。冗余控制逻辑耦合到故障地址缓冲寄存器并适于耦合到存储器阵列，读出由故障地址缓冲寄存器存储的每个地址，并用冗余可操作位替换每个故障位。

14. 发明授权

US07226816B2 Method of forming connection and anti-fuse in layered substrate such as SOI 有权
标题翻译：在诸如SOI的层状衬底中形成连接和反熔丝的方法
公开(公告)号：US07226816B2
公开(公告)日：2007-06-05
申请号：US11055106
申请日：2005-02-11
申请人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
发明人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
IPC分类号： H01L21/82
CPC分类号： H01L23/5252 , H01L27/10829 , H01L27/10897 , H01L27/1203 , H01L29/66181 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An anti-fuse structure that can be programmed at low voltage and current and which potentially consumes very little chip spaces and can be formed interstitially between elements spaced by a minimum lithographic feature size is formed on a composite substrate such as a silicon-on-insulator wafer by etching a contact through an insulator to a support semiconductor layer, preferably in combination with formation of a capacitor-like structure reaching to or into the support layer. The anti-fuse may be programmed either by the selected location of conductor formation and/or damaging a dielectric of the capacitor-like structure. An insulating collar is used to surround a portion of either the conductor or the capacitor-like structure to confine damage to the desired location. Heating effects voltage and noise due to programming currents are effectively isolated to the bulk silicon layer, permitting programming during normal operation of the device. Thus the potential for self-repair without interruption of operation is realized.
摘要翻译：可以在低电压和电流下被编程并且潜在地消耗很少的芯片空间并且可以间隙地在间隔最小光刻特征尺寸的元件之间形成的抗熔丝结构形成在复合衬底上，例如绝缘体上硅通过蚀刻通过绝缘体的接触到支撑半导体层，优选结合形成到达或支撑层的电容器状结构。反熔丝可以由导体形成的选定位置和/或损坏电容器状结构的电介质来编程。绝缘环用于围绕导体或电容器状结构的一部分，以将损伤限制在所需位置。由于编程电流导致的加热效应电压和噪声被有效地隔离到体硅层，从而允许在器件正常工作期间进行编程。因此实现了自动修复而不中断操作的可能性。

15. 发明授权

US06436749B1 Method for forming mixed high voltage (HV/LV) transistors for CMOS devices using controlled gate depletion 失效
标题翻译：用于使用受控栅极耗尽的CMOS器件形成混合高压（HV / LV）晶体管的方法
公开(公告)号：US06436749B1
公开(公告)日：2002-08-20
申请号：US09658655
申请日：2000-09-08
申请人： William R. Tonti , Claude L. Bertin , Jeffrey P. Gambino , Russell J. Houghton , Jack A. Mandelman , Wilbur D. Pricer
发明人： William R. Tonti , Claude L. Bertin , Jeffrey P. Gambino , Russell J. Houghton , Jack A. Mandelman , Wilbur D. Pricer
IPC分类号： H01L218238
CPC分类号： H01L27/092 , H01L21/823842
摘要： A method for forming mixed high voltage/low voltage (HV/LV) transistors for CMOS devices is disclosed. In an exemplary embodiment, depletion of the gate conductor is controlled by leaving a fixed region of the gate conductor intrinsic, or lightly doped, thus separating the heavily doped low resistivity portion of the electrode with an intrinsic region by use of a conducting dopant barrier. The barrier is conductive in nature, but acts as a well-controlled diffusion barrier, stopping the “fast” diffusion which normally takes place in polysilicon, and eliminating diffusion between the conductors. Thereby, the device performance may be precisely predicted by carefully controlling the gate conductor thickness.
摘要翻译：公开了一种用于形成用于CMOS器件的混合高压/低压（HV / LV）晶体管的方法。在示例性实施例中，通过将栅极导体的固定区域固有或轻掺杂来控制栅极导体的耗尽，从而通过使用导电掺杂剂屏障将本征区域的重掺杂低电阻率部分与本征区域分离。阻挡层本质上是导电的，但是作为良好控制的扩散屏障，停止通常在多晶硅中发生的“快速”扩散，并消除导体之间的扩散。因此，可以通过仔细地控制栅极导体厚度来精确地预测器件性能。

16. 发明授权

US06396121B1 Structures and methods of anti-fuse formation in SOI 失效
公开(公告)号：US06396121B1
公开(公告)日：2002-05-28
申请号：US09583468
申请日：2000-05-31
申请人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
发明人： Claude L. Bertin , Ramachandra Divakaruni , Russell J. Houghton , Jack A. Mandelman , William R. Tonti
IPC分类号： H01L2900
CPC分类号： H01L23/5252 , H01L27/10829 , H01L27/10897 , H01L27/1203 , H01L29/66181 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An anti-fuse structure that can be programmed at low voltage and current and which potentially consumes very little chip spaces and can be formed interstitially between elements spaced by a minimum lithographic feature size is formed on a composite substrate such as a silicon-on-insulator wafer by etching a contact through an insulator to a support semiconductor layer, preferably in combination with formation of a capacitor-like structure reaching to or into the support layer. The anti-fuse may be programmed either by the selected location of conductor formation and/or damaging a dielectric of the capacitor-like structure. An insulating collar is used to surround a portion of either the conductor or the capacitor-like structure to confine damage to the desired location. Heating effects voltage and noise due to programming currents are effectively isolated to the bulk silicon layer, permitting programming during normal operation of the device. Thus the potential for self-repair without interruption of operation is realized.

17. 发明授权

US06812122B2 Method for forming a voltage programming element 有权
标题翻译：用于形成电压编程元件的方法
公开(公告)号：US06812122B2
公开(公告)日：2004-11-02
申请号：US10095889
申请日：2002-03-12
申请人： Claude L. Bertin , Erik L. Hedberg , Russell J. Houghton , Max G. Levy , Rick L. Mohler , William R. Tonti , Wayne M. Trickle
发明人： Claude L. Bertin , Erik L. Hedberg , Russell J. Houghton , Max G. Levy , Rick L. Mohler , William R. Tonti , Wayne M. Trickle
IPC分类号： H01L2144
CPC分类号： H01L21/763 , H01L23/5252 , H01L27/10861 , H01L27/10894 , H01L2924/0002 , H01L2924/00
摘要： Method for forming a first one time, voltage programmable logic element in a semiconductor substrate of first conductivity type, forming a first layer beneath a surface of the substrate, the first layer having a second conductivity type. A trench is formed through the surface and passing through the first layer. The trench comprises an interior surface, a dielectric material lining the interior surface and a conductive material filling the lined trench. The first logic element is configured so that a predetermined voltage or higher applied between the conductive material and the first layer causes a breakdown within a region of the trench.
摘要翻译：用于形成第一导电类型的半导体衬底中的第一次电压可编程逻辑元件的方法，在所述衬底的表面下方形成第一层，所述第一层具有第二导电类型。沟槽通过表面形成并穿过第一层。沟槽包括内表面，衬在内表面的电介质材料和填充衬里沟槽的导电材料。第一逻辑元件被配置为使得施加在导电材料和第一层之间的预定电压或更高的电压导致沟槽区域内的击穿。

18. 发明授权

US07981731B2 Method of forming a high impedance antifuse 有权
标题翻译：形成高阻抗反熔丝的方法
公开(公告)号：US07981731B2
公开(公告)日：2011-07-19
申请号：US11482688
申请日：2006-07-07
申请人： John A. Fifield , Russell J. Houghton , William R. Tonti
发明人： John A. Fifield , Russell J. Houghton , William R. Tonti
IPC分类号： H01L21/82
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/3011 , Y10S438/957 , H01L2924/00
摘要： A programmable element that has a first diode having an electrode and a first insulator disposed between the substrate and said electrode of said first device, said first insulator having a first value of a given characteristic, and an FET having an electrode and a second insulator disposed between the substrate and said electrode of said second device, said second insulator having a second value of said given characteristic that is different from said first value. The electrodes of the diode and the FET are coupled to one another, and a source of programming energy is coupled to the diode to cause it to permanently decrease in resistivity when programmed. The programmed state of the diode is indicated by a current in the FET, which is read by a sense latch. Thus a small resistance change in the diode translates to a large signal gain/change in the latch. This allows the diode to be programmed at lower voltages.
摘要翻译：一种可编程元件，其具有第一二极管，其具有电极和布置在所述基板和所述第一器件的所述电极之间的第一绝缘体，所述第一绝缘体具有给定特性的第一值，以及具有电极和设置在所述第二绝缘体中的第二绝缘体的FET 在所述基板和所述第二装置的所述电极之间，所述第二绝缘体具有与所述第一值不同的所述给定特性的第二值。二极管和FET的电极彼此耦合，并且编程能量源耦合到二极管，以使其在编程时永久地降低电阻率。二极管的编程状态由FET中的电流表示，该电流由读出锁存器读取。因此，二极管中的小电阻变化转换为锁存器中的大信号增益/变化。这允许二极管在较低的电压下被编程。

19. 发明授权

US07098083B2 High impedance antifuse 失效
标题翻译：高阻抗反熔丝
公开(公告)号：US07098083B2
公开(公告)日：2006-08-29
申请号：US10652534
申请日：2003-08-29
申请人： John A. Fifield , Russell J. Houghton , William R. Tonti
发明人： John A. Fifield , Russell J. Houghton , William R. Tonti
IPC分类号： H01L21/82
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/3011 , Y10S438/957 , H01L2924/00
摘要： A programmable element that has a first diode having an electrode and a first insulator disposed between the substrate and said electrode of said first device, said first insulator having a first value of a given characteristic, and an FET having an electrode and a second insulator disposed between the substrate and said electrode of said second device, said second insulator having a second value of said given characteristic that is different from said first value. The electrodes of the diode and the FET are coupled to one another, and a source of programming energy is coupled to the diode to cause it to permanently decrease in resistivity when programmed. The programmed state of the diode is indicated by a current in the FET, which is read by a sense latch. Thus a small resistance change in the diode translates to a large signal gain/change in the latch. This allows the diode to be programmed at lower voltages.
摘要翻译：一种可编程元件，其具有第一二极管，其具有电极和设置在所述基板和所述第一器件的所述电极之间的第一绝缘体，所述第一绝缘体具有给定特性的第一值，以及设置有电极和第二绝缘体的FET 在所述基板和所述第二装置的所述电极之间，所述第二绝缘体具有与所述第一值不同的所述给定特性的第二值。二极管和FET的电极彼此耦合，并且编程能量源耦合到二极管，以使其在编程时永久地降低电阻率。二极管的编程状态由FET中的电流表示，该电流由读出锁存器读取。因此，二极管中的小电阻变化转换为锁存器中的大信号增益/变化。这允许二极管在较低的电压下被编程。

20. 发明授权

US06577154B2 Constant impedance driver for high speed interface 有权
标题翻译：用于高速接口的恒定阻抗驱动器
公开(公告)号：US06577154B2
公开(公告)日：2003-06-10
申请号：US09848454
申请日：2001-05-03
申请人： John A. Fifield , Russell J. Houghton
发明人： John A. Fifield , Russell J. Houghton
IPC分类号： H03K1716
CPC分类号： H04L25/028 , H03K19/00384 , H04L25/0278
摘要： A compensated driver for maintaining constant impedance during data transfer from an integrated circuit comprises an output portion having an output device to transfer data from the integrated circuit and a mimic circuit portion having a sample output device scaled to a fraction of the output device adapted to accept a reference current and generate a sample voltage. A mimic circuit portion has a sample output device scaled to a fraction of the output device adapted to accept a reference current and generate a sample voltage. A differential amplifier portion is adapted to generate a control voltage in response to a reference voltage and the sample voltage. A predrive portion applies either a ground or the predetermined control voltage from the differential amplifier portion to the output stage portion in response to an input, the control voltage regulating the output device in the output stage portion to achieve a more constant impedance.
摘要翻译：用于在从集成电路进行数据传输期间保持恒定阻抗的补偿驱动器包括具有输出装置以从集成电路传送数据的输出部分和具有缩放到适于接受的输出装置的一部分的样本输出装置的模拟电路部分参考电流并产生采样电压。模拟电路部分具有缩放到适于接受参考电流并且产生采样电压的输出设备的一部分的采样输出设备。差分放大器部分适于响应于参考电压和采样电压而产生控制电压。预驱动部分响应于输入将来自差分放大器部分的接地或预定控制电压施加到输出级部分，控制电压调节输出级部分中的输出器件以实现更恒定的阻抗。

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