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    • 11. 发明申请
    • Piezoelectric MEMS switches and methods of making
    • 压电MEMS开关及制作方法
    • US20070202626A1
    • 2007-08-30
    • US11363791
    • 2006-02-28
    • Lianjun Liu
    • Lianjun Liu
    • H01L21/00
    • H01H57/00H01H2057/006
    • MEMS piezoelectric switches 100 that provide advantages of compact structure ease of fabrication in a single unit, and that are free of high temperature-induced morphological changes of the contact materials and resultant adverse effects on properties. High temperature-induced morphological changes refer to changes that occur during fabrication when metallic contacts such as radio frequency lines 125, 130 and shorting bars 150 are exposed to temperatures required to anneal a piezoelectric layer or those temperatures encountered during high temperature deposition of the piezoelectric layer, if such process is used instead.
    • MEMS压电开关100,其提供在单个单元中制造结构紧凑的结构的优点,并且没有高温引起的接触材料的形态变化和对性能的不利影响。 高温诱导的形态变化是指在制造期间发生的变化,当诸如射频线125,130和短路棒150的金属接触暴露于退火压电层所需的温度或压电层的高温沉积期间遇到的温度 ,如果使用这样的过程。
    • 14. 发明授权
    • Method and apparatus for transferring heat from a substrate to a chuck
    • 用于将热量从基板传递到卡盘的方法和装置
    • US07017652B2
    • 2006-03-28
    • US10639510
    • 2003-08-13
    • Andrej J. MitrovicLianjun Liu
    • Andrej J. MitrovicLianjun Liu
    • F28F7/00
    • H01L21/67109C23C16/4586C30B25/10C30B25/12H01L21/6831H01L21/6833
    • A chuck method of and apparatus (50, 150, 300) for supporting a substrate (W) during processing of the substrate, where the substrate has a lower surface (WL). The apparatus facilitates heat transfer away from the substrate during processing of the substrate. The apparatus comprises a chuck body (60) having an outer edge (70) and a rough upper surface (64U). The substrate is arranged adjacent the rough surface such that the substrate lower surface and the roughened upper surface form a gap (100) therebetween. The apparatus further includes a central gas conduit (80) passing through the chuck body. The central conduit has a second end (82b) open to the roughened upper surface and a first end opposite the second end connected to a gas source (86). The conduit is arranged such that a gas can flow through the conduit into the gap and toward the chuck body outer edge. The gas used has an atomic or molecular weight that is greater than that of helium. The surface roughness, the substrate lower surface and the flow of the heavier gas in the gap contribute to defining an accommodation coefficient α and a mean free path λ such that the ratio α/λ is higher than that of prior art apparatus.
    • 一种用于在基板的处理期间支撑基板(W)的卡盘方法和装置(50,150,300),其中所述基板具有下表面(W L L L)。 该设备有助于在衬底处理期间从衬底传热。 该装置包括具有外边缘(70)和粗糙上表面(64U)的卡盘主体(60)。 衬底布置成与粗糙表面相邻,使得衬底下表面和粗糙化的上表面之间形成间隙(100)。 该装置还包括通过卡盘主体的中心气体导管(80)。 中心导管具有通向粗糙化的上表面的第二端(82b)和与气源(86)连接的第二端相对的第一端。 管道布置成使得气体可以通过导管流入间隙并朝向卡盘主体外边缘流动。 所使用的气体的原子或分子量大于氦气。 间隙中的表面粗糙度,底物下表面和较重气体的流动有助于确定适应系数α和平均自由程λ,使得比率α/λ比​​现有技术装置高。
    • 15. 发明授权
    • Method and apparatus for plasma cleaning of workpieces
    • 用于等离子体清洁工件的方法和装置
    • US06776170B2
    • 2004-08-17
    • US10279928
    • 2002-10-25
    • Lianjun Liu
    • Lianjun Liu
    • B08B600
    • H01L21/02046B08B7/00C23C14/022C23C16/0245H01J37/321H01J37/32733H01L21/67028H01L21/67069
    • A method and apparatus for plasma cleaning a workpiece (W) in a plasma-cleaning chamber (20) having an interior region (30). The method comprises the steps of first, loading the workpiece into the plasma cleaning chamber interior region. The next step is pumping down the plasma cleaning chamber interior region down to a pre-determined pressure, with hydrogen as the ambient gas. The next step is forming from the hydrogen gas a plasma (36) having an ion density in the range between 1010 and 1013 cm−3 and an ion energy lower than 30 eV The last step is exposing the workpiece to the plasma for a predetermined time. The apparatus of the present invention preferably includes first and second vacuum processing chambers (20 and 120), wherein the first chamber performs the plasma cleaning of the workpiece according to the method of the invention, and the second chamber performs an additional process step, e.g., depositing a metal.
    • 一种用于等离子体清洁具有内部区域(30)的等离子体清洁室(20)中的工件(W)的方法和装置。 该方法包括以下步骤:首先将工件装载到等离子体清洁室内部区域中。 下一步骤是将氢气作为环境气体,将等离子体清洗室内部区域下降到预定的压力。 下一步骤是从氢气形成离子密度在10 10和10 13 cm -3之间且离子能低于30eV的等离子体(36)。最后一步是将 工件到等离子体预定的时间。 本发明的装置优选地包括第一和第二真空处理室(20和120),其中第一室根据本发明的方法执行工件的等离子体清洁,并且第二室执行附加的处理步骤,例如 ,沉积金属。
    • 16. 发明申请
    • APPARATUS AND METHOD FOR RESET AND STABILIZATION CONTROL OF A MAGNETIC SENSOR
    • 磁传感器复位和稳定控制的装置和方法
    • US20150054502A1
    • 2015-02-26
    • US14533842
    • 2014-11-05
    • Lianjun LiuPhilip MatherJon Slaughter
    • Lianjun LiuPhilip MatherJon Slaughter
    • G01R33/04
    • G01R33/0029G01R33/0041G01R33/04G01R33/098
    • A magnitude and direction of at least one of a reset current and a second stabilization current (that produces a reset field and a second stabilization field, respectively) is determined that, when applied to an array of magnetic sense elements, minimizes the total required stabilization field and reset field during the operation of the magnetic sensor and the measurement of the external field. Therefore, the low field sensor operates optimally (with the highest sensitivity and the lowest power consumption) around the fixed external field operating point. The fixed external field is created by other components in the sensor device housing (such as speaker magnets) which have a high but static field with respect to the low (earth's) magnetic field that describes orientation information.
    • 确定复位电流和第二稳定电流(分别产生复位场和第二稳定场)中的至少一个的幅度和方向,当应用于磁感测元件的阵列时,使总要求的稳定性最小化 在磁传感器运行期间的场和复位场以及外场测量。 因此,低场传感器在固定的外场操作点周围最佳地运行(具有最高的灵敏度和最低的功耗)。 固定的外部场是由传感器装置外壳(例如扬声器磁体)中的其他部件产生的,这些部件相对于描述取向信息的低(地球)磁场具有高但静止的场。
    • 17. 发明申请
    • MEMS DEVICE AND METHOD FOR FABRICATING MEMS DEVICES
    • 用于制造MEMS器件的MEMS器件和方法
    • US20140374851A1
    • 2014-12-25
    • US13926652
    • 2013-06-25
    • Lianjun Liu
    • Lianjun Liu
    • B81C1/00B81B3/00
    • B81B3/0021B81B2207/096B81C1/00134B81C1/00611B81C2201/0121B81C2203/00
    • A method (60) entails providing a substrate (34) with a structural layer (30) having a thickness (40). A partial etch process is performed at locations (82) on the structural layer (30) so that a portion (92) of the structural layer (30) remains at the locations (82). An oxidation process is performed at the locations which consumes the remaining portion of the structural layer and forms an oxide (36) having a thickness (42) that is similar to the thickness (40) of the structural layer (30). The oxide (36) electrically isolates microstructures (28) in the structural layer (30), thus producing a structure (22). A device substrate (120) is coupled to the structure (22) such that a cavity (48) is formed between them. An active region (44) is formed in the device substrate (120). A short etch process can be performed to expose the microstructures from an overlying oxide layer (110).
    • 方法(60)需要向衬底(34)提供具有厚度(40)的结构层(30)。 在结构层(30)上的位置(82)处执行部分蚀刻工艺,使得结构层(30)的一部分(92)保持在位置(82)处。 在消耗结构层的剩余部分的位置处进行氧化处理,并形成具有类似于结构层(30)的厚度(40)的厚度(42)的氧化物(36)。 氧化物(36)电隔离结构层(30)中的微结构(28),从而产生结构(22)。 器件衬底(120)耦合到结构(22),使得在它们之间形成空腔(48)。 在器件衬底(120)中形成有源区(44)。 可以进行短蚀刻工艺以从上覆的氧化物层(110)露出微结构。
    • 19. 发明申请
    • INTEGRATED INERTIAL SENSOR AND PRESSURE SENSOR, AND FORMING METHOD THEREFOR
    • 一体化传感器和压力传感器及其形成方法
    • US20130340525A1
    • 2013-12-26
    • US14004595
    • 2012-02-23
    • Lianjun Liu
    • Lianjun Liu
    • G01P15/02H01L29/84
    • G01P15/02B81B7/02B81B2201/025B81B2201/0264G01C19/574G01C19/5769G01P15/0802G01P15/125H01L29/84
    • An integrated inertial sensor and pressure sensor may include a first substrate including a first surface and a second surface; at least one or more conductive layers, formed on the first surface of the first substrate; a movable sensitive element, formed by using a first region of the first substrate; a second substrate and a third substrate, the second substrate being coupled to a surface of the conductive layer, the third substrate being coupled to the second surface of the first substrate in which the movable sensitive element of the inertial sensor is formed, and the third substrate and the second substrate are respectively arranged on opposite sides of the movable sensitive element; and a sensitive film of the pressure sensor, including at least a second region of the first substrate, or including at least one of the conductive layers on the second region of the first substrate.
    • 集成的惯性传感器和压力传感器可以包括包括第一表面和第二表面的第一基底; 形成在所述第一基板的所述第一表面上的至少一个或多个导电层; 通过使用第一衬底的第一区域形成的可移动敏感元件; 第二基板和第三基板,所述第二基板耦合到所述导电层的表面,所述第三基板耦合到所述第一基板的形成所述惯性传感器的可移动敏感元件的第二表面,并且所述第三基板 基板和第二基板分别布置在可移动敏感元件的相对侧上; 以及压力传感器的敏感膜,包括第一衬底的至少第二区域,或者在第一衬底的第二区域上包括至少一个导电层。
    • 20. 发明授权
    • Method of forming an electromechanical transducer device
    • 形成机电换能器装置的方法
    • US08513042B2
    • 2013-08-20
    • US13320579
    • 2010-06-15
    • Francois PerruchotLianjun LiuSergio PachecoEmmanuel DefayPatrice Rey
    • Francois PerruchotLianjun LiuSergio PachecoEmmanuel DefayPatrice Rey
    • H01L21/00
    • B81C1/00666B81B2203/0118B81C2201/0167B81C2201/0169
    • A method of forming an electromechanical transducer device comprises forming on a fixed structure a movable structure and an actuating structure of the electromechanical transducer device, wherein the movable structure is arranged in operation of the electromechanical transducer device to be movable in relation to the fixed structure in response to actuation of the actuating structure. The method further comprises providing a stress trimming layer on at least part of the movable structure, after providing the stress trimming layer, releasing the movable structure from the fixed structure to provide a released electromechanical transducer device, and after releasing the movable structure changing stress in the stress trimming layer of the released electromechanical transducer device such that the movable structure is deflected a predetermined amount relative to the fixed structure when the electromechanical transducer device is in an off state.
    • 一种形成机电换能器装置的方法包括在固定结构上形成机电换能器装置的可移动结构和致动结构,其中可移动结构被布置成在机电换能器装置的操作中相对于固定结构可移动 响应致动结构的致动。 该方法还包括在提供应力修剪层之后,在可移动结构的至少一部分上提供应力修剪层,将可移动结构从固定结构释放以提供释放的机电换能器装置,以及在释放可移动结构之后,改变应力 释放的机电换能器装置的应力修剪层,使得当机电换能器装置处于关闭状态时,可移动结构相对于固定结构偏转预定量。