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    • 11. 发明授权
    • Parallel fiber optics communications module
    • US06808317B2
    • 2004-10-26
    • US10722894
    • 2003-11-26
    • Hengju ChengLee L. Xu
    • Hengju ChengLee L. Xu
    • G02B636
    • G02B6/4292G02B6/425
    • An optoelectronic subassembly for use in fiber optic communications systems where multiple parallel optical fibers are used in transmitting and receiving optical signals. The subassembly is adapted for optically connecting with a ferrule and electrically connecting to a larger computing or communications system. The ferrule supports a set of optical communications fibers disposed in an array. The subassembly supports an optoelectronic device having a set of photoactive components also disposed in an array corresponding to the fiber array. The optoelectronic device is operative for either converting photonic signals to electrical signals (in a receiver) or electrical signals to photonic signals (in a transmitter). The optoelectronic subassembly includes a carrier which is precisely fabricated using photolithography techniques for aligning and supporting the optoelectronic device and photoactive components within it. The carrier further includes a precisely positioned alignment structure for cooperating with the optical ferrule to align the photoactive components of the optoelectronic device with the fibers in the ferrule when the two are interconnected. Also, the carrier may include a thin film layer and one or more alignment marks applied to the film layer for use in accurately mounting the optoelectronic device on the carrier.
    • 12. 发明授权
    • Method of constructing a fiber optics communications module
    • 构建光纤通信模块的方法
    • US06676302B2
    • 2004-01-13
    • US09954419
    • 2001-09-17
    • Hengju ChengLee L. Xu
    • Hengju ChengLee L. Xu
    • G02B636
    • G02B6/4206G02B6/4231G02B6/4249G02B6/4261G02B6/4266G02B6/4269G02B6/4281G02B6/4284G02B6/4292
    • A method of constructing an optoelectronic module for use in fiber optic communication systems. The module is adapted for mechanically and optically interconnecting with a ferrule supporting a set of optical communications fibers. The module supports an optoelectronic device comprised of a set of photoactive components for use in communicating with the fibers. The module also includes a carrier adapted for supporting the optoelectronic device and a set of guide pins used for alignment with the ferrule. The module is constructed in steps. First, the carrier constructed as a silicon substrate. Structures such as alignment apertures may then be fabricated on the surface of the substrate using photolithography techniques. Guide pins are inserted in an alignment ferrule. The carrier is placed on the ferrule the guide pins engaged with the alignment apertures. The guide pins and carrier are aligned and held in position by the alignment ferrule. The guide pins and carrier can then installed on a support block with the ends of guide pins being cemented in alignment passages within the support block. The support block provides for the guide pins, carrier and optoelectronic device to be permanently supported in accurate alignment with one another.
    • 一种构建用于光纤通信系统的光电子模块的方法。 该模块适用于与支撑一组光通信光纤的套圈的机械和光学互连。 该模块支持由用于与纤维通信使用的一组光活性组件组成的光电子器件。 该模块还包括适于支撑光电子器件的载体和用于与套圈对准的一组引导销。 该模块是按步骤构建的。 首先,载体构造为硅衬底。 然后可以使用光刻技术在基板的表面上制造诸如对准孔的结构。 导销插入对准套圈中。 载体被放置在套圈上,导向销与对准孔接合。 引导销和托架通过对准套圈对准并保持在适当的位置。 然后,引导销和托架可以安装在支撑块上,引导销的端部被胶合在支撑块内的对齐通道中。 支撑块提供引导引脚,载体和光电子器件被永久地支持以彼此精确对准。
    • 13. 发明授权
    • Parallel fiber optics communications module
    • US06739760B2
    • 2004-05-25
    • US09954130
    • 2001-09-17
    • Hengju ChengLee L. Xu
    • Hengju ChengLee L. Xu
    • G02B636
    • G02B6/4292G02B6/425
    • An optoelectronic subassembly for use in fiber optic communications systems where multiple parallel optical fibers are used in transmitting and receiving optical signals. The subassembly is adapted for optically connecting with a ferrule and electrically connecting to a larger computing or communications system. The ferrule supports a set of optical communications fibers disposed in an array. The subassembly supports an optoelectronic device having a set of photoactive components also disposed in an array corresponding to the fiber array. The optoelectronic device is operative for either converting photonic signals to electrical signals (in a receiver) or electrical signals to photonic signals (in a transmitter). The optoelectronic subassembly includes a carrier which is precisely fabricated using photolithography techniques for aligning and supporting the optoelectronic device and photoactive components within it. The carrier further includes a precisely positioned alignment structure for cooperating with the optical ferrule to align the photoactive components of the optoelectronic device with the fibers in the ferrule when the two are interconnected. Also, the carrier may include a thin film layer and one or more alignment marks applied to the film layer for use in accurately mounting the optoelectronic device on the carrier.
    • 15. 发明授权
    • Apparatus for electrical and optical interconnection
    • 用于电气和光学互连的设备
    • US07660128B2
    • 2010-02-09
    • US10955876
    • 2004-09-30
    • Darren S. CrewsLee L. Xu
    • Darren S. CrewsLee L. Xu
    • H05K1/18
    • H05K1/182G02B6/42H01R12/714H01R12/722H01R13/6658H05K2201/10121H05K2201/10446
    • A circuit package includes a circuit substrate having a cutout portion defined therein, an interconnect electrically coupled to the circuit substrate and an active circuit component disposed off the circuit substrate within the cutout portion and electrically coupled to the interconnect. An optical circuit includes a lead frame and an optical component electrically coupled to the lead frame. The lead frame includes a first lead portion at a first level having an upper surface and a lower surface, and a second lead portion at a second level lower than the first level and electrically connected to the first lead portion. The lower surface of the first lead portion is arranged to electrically connect to a surface of a circuit substrate. The second lead portion includes an upper surface and a lower surface. The optical component is disposed on the upper surface of the second lead portion.
    • 电路封装包括具有限定在其中的切口部分的电路基板,电耦合到电路基板的互连和在切除部分内设置在电路基板之外的电连接到互连的有源电路部件。 光学电路包括引线框架和电耦合到引线框架的光学部件。 引线框架包括具有上表面和下表面的第一级的第一引线部分和低于第一级别的第二级别的电连接到第一引线部分的第二引线部分。 第一引线部分的下表面被布置成电连接到电路基板的表面。 第二引线部分包括上表面和下表面。 光学部件设置在第二引线部分的上表面上。