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    • 11. 发明授权
    • Integrated circuit device with series-connected field effect transistors and integrated voltage equalization and method of forming the device
    • 具有串联场效应晶体管和集成电压均衡的集成电路器件及其形成方法
    • US08507333B2
    • 2013-08-13
    • US13455176
    • 2012-04-25
    • Andres BryantEdward J. Nowak
    • Andres BryantEdward J. Nowak
    • H01L21/8224
    • H01L21/845H01L21/84H01L27/1203H01L27/1211
    • Disclosed is an integrated circuit device having series-connected planar or non-planar field effect transistors (FETs) with integrated voltage equalization and a method of forming the device. The series-connected FETs comprise gates positioned along a semiconductor body to define the channel regions for the series-connected FETs. Source/drain regions are located within the semiconductor body on opposing sides of the channel regions such that each portion of the semiconductor body between adjacent gates comprises one source/drain region for one field effect transistor abutting another source/drain region for another field effect transistor. Integrated voltage equalization is achieved through a conformal conductive layer having a desired resistance and positioned over the series-connected FETs such that it is electrically isolated from the gates, but in contact with the source/drain regions within the semiconductor body.
    • 公开了具有集成电压均衡的具有串联的平面或非平面场效应晶体管(FET)的集成电路器件和形成器件的方法。 串联连接的FET包括沿着半导体本体定位的门,以限定用于串联连接的FET的沟道区。 源极/漏极区域位于沟道区域的相对侧上的半导体本体内,使得相邻栅极之间的半导体本体的每个部分包括用于一个场效应晶体管的一个源极/漏极区域,用于与另一个场效应晶体管的另一个源极/漏极区域相邻接 。 集成电压均衡通过具有期望电阻的并行导电层实现,并且位于串联连接的FET上,使得其与栅极电隔离,但与半导体本体内的源极/漏极区域接触。
    • 12. 发明申请
    • FIELD EFFECT TRANSISTOR AND A METHOD OF FORMING THE TRANSISTOR
    • 场效应晶体管和形成晶体管的方法
    • US20130193481A1
    • 2013-08-01
    • US13359615
    • 2012-01-27
    • Andres BryantEdward J. Nowak
    • Andres BryantEdward J. Nowak
    • H01L29/78H01L21/335
    • H01L29/66742H01L29/66795H01L29/785H01L29/78621H01L29/78684
    • Disclosed are embodiments of a metal oxide semiconductor field effect transistor (MOSFET) structure and a method of forming the structure. The structure incorporates source/drain regions and a channel region between the source/drain regions. The source/drain regions can comprise silicon, which has high diffusivity to the source/drain dopant. The channel region can comprise a silicon alloy selected for optimal charge carrier mobility and band energy and for its low source/drain dopant diffusivity. During processing, the source/drain dopant can diffuse into the edge portions of the channel region. However, due to the low diffusivity of the silicon alloy to the source/drain dopant, the dopant does not diffuse deep into channel region. Thus, the edge portions of the silicon alloy channel region can have essentially the same dopant profile as the source/drain regions, but a different dopant profile than the center portion of the silicon alloy channel region.
    • 公开了金属氧化物半导体场效应晶体管(MOSFET)结构的实施例和形成该结构的方法。 该结构包括源极/漏极区域和源极/漏极区域之间的沟道区域。 源极/漏极区域可以包括对源极/漏极掺杂剂具有高扩散性的硅。 通道区域可以包括选择用于最佳电荷载流子迁移率和带能量以及其低源极/漏极掺杂剂扩散率的硅合金。 在处理期间,源/漏掺杂剂可以扩散到沟道区的边缘部分。 然而,由于硅合金对源极/漏极掺杂剂的低扩散性,掺杂剂不会深入沟道区域。 因此,硅合金沟道区域的边缘部分可以具有与源极/漏极区域基本相同的掺杂剂分布,但是与硅合金沟道区域的中心部分不同的掺杂剂分布。
    • 17. 发明授权
    • Recessed gate channel with low Vt corner
    • 嵌入门通道低Vt角
    • US08343836B2
    • 2013-01-01
    • US13363944
    • 2012-02-01
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • H01L21/336
    • H01L29/665H01L29/1083H01L29/4236H01L29/517H01L29/66621H01L29/78
    • A recessed gate FET device includes a substrate having an upper and lower portions, the lower portion having a reduced concentration of dopant material than the upper portion; a trench-type gate electrode defining a surrounding channel region and having a gate dielectric material layer lining and including a conductive material having a top surface recessed to reduce overlap capacitance with respect to the source and drain diffusion regions formed at an upper substrate surface at either side of the gate electrode. There is optionally formed halo implants at either side of and abutting the gate electrode, each halo implants extending below the source and drain diffusions into the channel region. Additionally, highly doped source and drain extension regions are formed that provide a low resistance path from the source and drain diffusion regions to the channel region.
    • 凹陷栅极FET器件包括具有上部和下部的衬底,下部具有比上部更低的掺杂剂材料的浓度; 限定周围通道区域并且具有内衬的栅极电介质材料层的沟槽型栅电极,并且包括具有凹陷的顶表面的导电材料,以减少相对于在上基板表面处形成的源极和漏极扩散区域的重叠电容 侧电极。 在栅电极的任一侧和邻接栅电极处可选地形成卤素植入物,每个卤素注入物延伸到源极和漏极扩散到沟道区域之内。 此外,形成高掺杂的源极和漏极延伸区域,其提供从源极和漏极扩散区域到沟道区域的低电阻路径。