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11. 发明授权

US07296343B2 Electronic component mounting apparatus 有权
标题翻译：电子元件安装装置
公开(公告)号：US07296343B2
公开(公告)日：2007-11-20
申请号：US10259783
申请日：2002-09-30
申请人： Yoshinao Usui , Akihiro Kawai , Manabu Okamoto
发明人： Yoshinao Usui , Akihiro Kawai , Manabu Okamoto
IPC分类号： B23P19/00
CPC分类号： H05K13/0452 , H05K13/0812 , Y10T29/49131 , Y10T29/49133 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When the difference between the thickness of the electronic component detected by a sensor and the data on the thickness stored in the RAM is within the tolerance, a CPU judges that the component is held by a suction nozzle in a normal posture and executes a normal processing control. Then an image of the electronic component is captured by a recognition camera, and a recognition processing is made by an image processing unit to measure the geometry of the component. The CPU, then, judges whether the size of the component is within tolerance or not. When both X-dimension and Y-dimension of the component measured by the image processing unit are within the tolerance, the Y-dimension measured by the image processing unit and the thickness detected by the sensor are compared and the component is judged normal when the Y-dimension is larger.
摘要翻译：即使当部件的宽度和高度之间的差小时，电子部件安装装置也能够可靠地决定部件的异常吸入。当由传感器检测到的电子部件的厚度与存储在RAM中的厚度的数据之间的差异在公差内时，CPU判断该部件被吸嘴保持在正常姿态，并执行正常处理控制。然后，通过识别照相机捕获电子部件的图像，并且由图像处理单元进行识别处理以测量部件的几何形状。然后，CPU判断组件的大小是否在公差范围内。当由图像处理单元测量的分量的X维度和Y维度都在公差内时，比较由图像处理单元测量的Y维度和由传感器检测到的厚度，并且当该分量被判断为正态分布时 Y尺寸较大。

12. 发明授权

US07206193B2 Surface-mount capacitor and method of producing the same 有权
标题翻译：表面贴装电容器及其制造方法
公开(公告)号：US07206193B2
公开(公告)日：2007-04-17
申请号：US11260831
申请日：2005-10-27
申请人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01G2/10 , H01G9/08
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
摘要翻译：表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层叠板状电容器元件而形成，所述电容器元件的相对端部具有阳极引线部分11和位于其中心的阴极部分12，阳极端子18经由一个阳极引线部分11经由条状板14和连接到阴极部分12的阴极端子19。阳极和阴极端子18和19具有扁平形状并且形成在公共平面上作为基板安装表面。模具树脂壳体20具有填充阳极和阴极端子18和19之间的间隙的底部，并且机构地连接阳极和阴极端子18和19以及基本垂直于基板安装表面的侧壁。阳极和阴极端子18和19具有暴露在模制树脂壳体20的内底表面上的上表面，以连接到阳极引线部分11和阴极部分12。

13. 发明申请

US20070148900A1 SURFACE-MOUNT CAPACITOR AND METHOD OF PRODUCING THE SAME 有权
标题翻译：表面安装电容器及其制造方法
公开(公告)号：US20070148900A1
公开(公告)日：2007-06-28
申请号：US11681112
申请日：2007-03-01
申请人： Toshihisa NAGASAWA , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa NAGASAWA , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01L21/20
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
摘要翻译：表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层压板状电容器元件而形成，所述电容器元件的相对端具有阳极引线部分，并且在中心部分具有阴极部分，阳极端子经由条状板连接到每个阳极引线部分以及连接到阴极部分的阴极端子。阳极和阴极端子并且具有平坦形状并且形成在公共平面上作为基板安装表面。模具树脂壳体具有填充阳极和阴极端子之间的间隙的底部部分，并且将阳极和阴极端子和基本上垂直于衬底安装表面的侧壁机械连接。阳极和阴极端子具有暴露在模制树脂壳体的内底表面上的上表面，以连接到阳极引线部分和阴极部分。

14. 发明申请

US20070030629A1 Solid electrolytic capacitor, distributed constant type noise filter, and method of producing the same 有权
标题翻译：固体电解电容器，分布常数型噪声滤波器及其制造方法
公开(公告)号：US20070030629A1
公开(公告)日：2007-02-08
申请号：US11496820
申请日：2006-08-01
申请人： Tadamasa Asami , Toshihisa Nagasawa , Akihiro Kawai , Yuichi Maruko , Yuji Aoki
发明人： Tadamasa Asami , Toshihisa Nagasawa , Akihiro Kawai , Yuichi Maruko , Yuji Aoki
IPC分类号： H01G9/04 , H01G9/145
CPC分类号： H01G9/042 , H01G9/004 , H01G9/08 , H01G9/15 , Y10T29/417
摘要： In a solid electrolytic capacitor, a second dielectric layer made of an oxide of valve action metal is formed on first side, second side, and third side surfaces of an anode portion of an anode member. Between the second dielectric layer and a conductive polymer layer of the cathode layer, an electrical insulating resin layer is formed.
摘要翻译：在固体电解电容器中，在阳极部件的阳极部的第一侧面，第二侧面和第三侧面上形成由阀作用金属的氧化物构成的第二电介质层。在第二介电层和阴极层的导电聚合物层之间形成电绝缘树脂层。

15. 发明授权

US07113390B2 Surface-mount thin-profile capacitor and method of producing the same 有权
标题翻译：表面贴装薄型电容器及其制造方法
公开(公告)号：US07113390B2
公开(公告)日：2006-09-26
申请号：US11037509
申请日：2005-01-18
申请人： Yuichi Maruko , Akihiro Kawai , Toshihisa Nagasawa , Tadamasa Asami
发明人： Yuichi Maruko , Akihiro Kawai , Toshihisa Nagasawa , Tadamasa Asami
IPC分类号： H01G9/00
CPC分类号： H01G9/055 , Y10T29/417
摘要： In a surface-mount thin-profile capacitor including an aluminum foil as a base member composed of an aluminum core and a pair of etched layers covering opposite surfaces of the aluminum core, a resist resin is formed at a boundary between an anode as each of opposite end portions of the aluminum foil and a cathode formed at a center area of each of opposite surfaces of the aluminum foil. The resist resin separates and isolates the etched layer on the side of the anode and a conductive polymer layer from each other. If a part of the conductive polymer layer climbs up onto the resist resin, the climbing part of the conductive polymer layer is covered with an additional resist resin.
摘要翻译：在包括由铝芯构成的铝箔和覆盖铝芯的相对表面的一对蚀刻层的表面安装薄型电容器中，在阳极之间的边界处形成抗蚀剂树脂，铝箔的相对端部和形成在铝箔的每个相对表面的中心区域的阴极。抗蚀树脂将阳极侧的蚀刻层与导电性聚合物层分离并分离。如果导电聚合物层的一部分上升到抗蚀剂树脂上，则导电聚合物层的攀登部分被另外的抗蚀剂树脂覆盖。

16. 发明申请

US20050162814A1 Surface-mount thin-profile capacitor and method of producing the same 有权
标题翻译：表面贴装薄型电容器及其制造方法
公开(公告)号：US20050162814A1
公开(公告)日：2005-07-28
申请号：US11037509
申请日：2005-01-18
申请人： Yuichi Maruko , Akihiro Kawai , Toshihisa Nagasawa , Tadamasa Asami
发明人： Yuichi Maruko , Akihiro Kawai , Toshihisa Nagasawa , Tadamasa Asami
IPC分类号： H01G9/012 , H01G9/00 , H01G9/04 , H01G9/055
CPC分类号： H01G9/055 , Y10T29/417
摘要： In a surface-mount thin-profile capacitor including an aluminum foil as a base member composed of an aluminum core and a pair of etched layers covering opposite surfaces of the aluminum core, a resist resin is formed at a boundary between an anode as each of opposite end portions of the aluminum foil and a cathode formed at a center area of each of opposite surfaces of the aluminum foil. The resist resin separates and isolates the etched layer on the side of the anode and a conductive polymer layer from each other. If a part of the conductive polymer layer climbs up onto the resist resin, the climbing part of the conductive polymer layer is covered with an additional resist resin.
摘要翻译：在包括由铝芯构成的铝箔和覆盖铝芯的相对表面的一对蚀刻层的表面安装薄型电容器中，在阳极之间的边界处形成抗蚀剂树脂，铝箔的相对端部和形成在铝箔的每个相对表面的中心区域的阴极。抗蚀树脂将阳极侧的蚀刻层与导电性聚合物层分离并分离。如果导电聚合物层的一部分上升到抗蚀剂树脂上，则导电聚合物层的攀登部分被另外的抗蚀剂树脂覆盖。

17. 发明申请

US20050013093A1 Thin-type surface-mount capacitor 失效
标题翻译：薄型表面贴装电容器
公开(公告)号：US20050013093A1
公开(公告)日：2005-01-20
申请号：US10891203
申请日：2004-07-13
申请人： Toshihisa Nagasawa , Akihiro Kawai , Yuichi Maruko
发明人： Toshihisa Nagasawa , Akihiro Kawai , Yuichi Maruko
IPC分类号： H01G9/012 , H01G9/00 , H01G9/15 , H01G9/04
CPC分类号： H01G9/15 , H01G11/56 , Y02E60/13 , Y10T29/417
摘要： A thin-type surface-mount capacitor is a solid electrolytic capacitor. The capacitor includes a capacitor element having an anode body in the form of a plate-like or foil-like valve-action metal that is area-increased, and a conductive functional polymer film used as a solid electrolyte. The capacitor further includes thermal adhesive insulating resin impregnated tapes that are stuck to the capacitor element on upper and lower sides thereof, and an element reinforcing metal plate and a solderable cathode terminal metal plate 67 that are stuck to the tapes, respectively. The capacitor is finally formed by applying a curing treatment under high temperature and pressure. Each of the metal plates is applied with a stepping process that provides a difference in level corresponding to a predetermined thickness.
摘要翻译：薄型表面贴装电容器是固体电解电容器。电容器包括电容器元件，其具有面积增加的板状或箔状阀作用金属形式的阳极体和用作固体电解质的导电功能聚合物膜。电容器还包括粘附到电容器元件的上侧和下侧的热粘合绝缘树脂浸渍带，以及分别粘附在带上的元件加强金属板和可焊接阴极端子金属板67。最后通过在高温高压下进行固化处理形成电容器。每个金属板被施加有提供对应于预定厚度的水平差的步进过程。

18. 发明授权

US5981301A Regeneration method and apparatus of wafer and substrate 失效
标题翻译：晶圆和基片再生方法及装置
公开(公告)号：US5981301A
公开(公告)日：1999-11-09
申请号：US804732
申请日：1997-02-21
申请人： Kazuo Muramatsu , Akihiro Kawai , Tsutomu Watanabe , Satoshi Shimamoto
发明人： Kazuo Muramatsu , Akihiro Kawai , Tsutomu Watanabe , Satoshi Shimamoto
IPC分类号： B24B51/00 , B24B53/00 , H01L21/02 , H01L21/304 , H01L21/306 , H01L21/66 , H01L23/544 , H01L21/00
CPC分类号： H01L22/34 , B24B37/042 , H01L21/02032 , H01L2924/0002 , Y10S438/906 , Y10S438/959
摘要： A method for regenerating a used wafer or substrate by removing a functional coating film formed on the used wafer or substrate, comprising the steps of:(a) a step for sorting the used wafer or substrate according to the quality, structure or thickness of the functional coating film;(b) a step for removing the functional coating film, while in a state of holding the used wafer or substrate, (i) by lapping the objective face of the used wafer or substrate with a hard metal-bonded whetstone while applying an electrochemical in-process dressing, (ii) by polishing the objective face while dropping a fine-particle polishing slurry between a polishing plate provided with a pad and the functional coating film, or (iii) by electrolyzing the functional coating film on the objective face placed opposite to an electrode face in an electrolyte solution at a predetermined voltage;(c) a step for mechanically removing the functional coating film adhered to the end face at an adequate stage; and(d) a step for washing and drying the used wafer or substrate after removal of the functional coating film.
摘要翻译：一种用于通过去除在所使用的晶片或衬底上形成的功能性涂层来再生所使用的晶片或衬底的方法，包括以下步骤：（a）根据质量，结构或厚度对所使用的晶片或衬底进行分选的步骤功能性涂膜; （b）在保持所使用的晶片或基板的状态下，（i）通过用硬质金属结合的砂轮研磨所使用的晶片或基板的物镜，同时施加电化学（ii）通过抛光目标面，同时在设置有衬垫的抛光板和功能性涂膜之间滴下细粒抛光浆料，或（iii）通过电解相对放置的物镜面上的功能性涂膜以预定电压在电解质溶液中的电极面; （c）在足够的阶段机械去除附着在端面上的功能性涂膜的步骤; 以及（d）除去功能性涂膜后，对使用过的晶片或基板进行清洗干燥的工序。

19. 发明授权

US09007743B2 Solid electrolytic capacitor 有权
标题翻译：固体电解电容器
公开(公告)号：US09007743B2
公开(公告)日：2015-04-14
申请号：US13446265
申请日：2012-04-13
申请人： Akihiro Kawai , Kenji Araki
发明人： Akihiro Kawai , Kenji Araki
IPC分类号： H01G9/00 , H01G4/228 , H01G9/10 , H01G9/15 , H01G9/012 , H01G9/04 , H01G9/26 , H01G9/042
CPC分类号： H01G9/15 , H01G9/012 , H01G9/04 , H01G9/042 , H01G9/26
摘要： Provided is a solid electrolytic capacitor that is excellent in productivity, has improved volumetric efficiency aiming for capacity increase, a stable fillet shape when mounted, and has excellent ESL characteristics. Included is a capacitor stack element composed of a stack of capacitor elements. The capacitor element includes one anode part of an anode body made of linear, foil-like, or plate-like valve metal and a cathode part composed of dielectric, solid electrolyte, graphite, and silver paste layers, which are sequentially formed to another surface of the anode body separated by insulating resin. A fillet formation part with a recessed part is provided to an end surface of anode and cathode terminals of a mounting electrode side of a first direction end surface of the electrode substrate to which the capacitor stack element is mounted. Further, the anode and cathode terminals for element connection reach the end surface of the first direction.
摘要翻译：提供一种生产率优异的固体电解电容器，具有提高容量增加的体积效率，安装时的稳定的圆角形状，并且具有优异的ESL特性。包括由电容器元件的堆叠组成的电容器堆叠元件。电容器元件包括由直线状，箔状或板状阀金属制成的阳极体的一个阳极部分和由电介质，固体电解质，石墨和银浆层构成的阴极部分，其顺序地形成于另一表面的绝缘树脂隔开的阳极体。在安装有电容器叠层元件的电极基板的第一方向端面的安装电极侧的阳极和阴极端子的端面设置有具有凹部的圆角形状部。此外，用于元件连接的阳极和阴极端子到达第一方向的端面。

20. 外观设计

USD671890S1 Solid electrolytic capacitor 有权
标题翻译：固体电解电容器
公开(公告)号：USD671890S1
公开(公告)日：2012-12-04
申请号：US29392763
申请日：2011-05-26
申请人： Shinya Tokashiki , Akihiro Kawai , Shigetaka Matsubara
设计人： Shinya Tokashiki , Akihiro Kawai , Shigetaka Matsubara

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