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11. 发明授权

US08319320B2 LED module 失效
标题翻译： LED模块
公开(公告)号：US08319320B2
公开(公告)日：2012-11-27
申请号：US12874406
申请日：2010-09-02
申请人： Kazuhiro Inoue , Kazuhisa Iwashita , Teruo Takeuchi , Tatsuo Tonedachi , Hiroaki Oshio , Tetsuro Komatsu , Naoya Ushiyama
发明人： Kazuhiro Inoue , Kazuhisa Iwashita , Teruo Takeuchi , Tatsuo Tonedachi , Hiroaki Oshio , Tetsuro Komatsu , Naoya Ushiyama
IPC分类号： H01L23/495
CPC分类号： H01L24/97 , F21K9/00 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.
摘要翻译：根据一个实施例，LED模块包括板，互连和LED封装。互连形成在板的上表面上。 LED封装安装在电路板上。 LED封装包括彼此分开布置的第一和第二引线框架，并且连接到彼此绝缘的互连部分。 LED封装包括设置在第一引线框架和第二引线框架之上的LED芯片。 LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一端子。此外，LED封装包括覆盖第一引线框架和第二引线框架中的每一个的上表面，下表面和边缘表面的树脂体，还覆盖LED芯片，但是暴露下表面的剩余部分和边缘表面。并且，树脂体的外观是LED封装的外观。

12. 发明申请

US20120080674A1 LED PACKAGE 有权
标题翻译： LED封装
公开(公告)号：US20120080674A1
公开(公告)日：2012-04-05
申请号：US13289587
申请日：2011-11-04
申请人： Satoshi Shimizu , Kazuhisa Iwashita , Teruo Takeguchi , Tetsuro Komatsu , Hiroaki Oshio , Tatsuo Tonedachi , Naoya Ushiyama , Kazuhiro Inoue , Gen Watari
发明人： Satoshi Shimizu , Kazuhisa Iwashita , Teruo Takeguchi , Tetsuro Komatsu , Hiroaki Oshio , Tatsuo Tonedachi , Naoya Ushiyama , Kazuhiro Inoue , Gen Watari
IPC分类号： H01L33/62 , H01L33/50
CPC分类号： H01L33/62 , H01L24/73 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L2224/26175 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01065 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2933/0066 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554
摘要： According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.
摘要翻译：根据一个实施例，LED封装包括彼此间隔开的第一和第二引线框架和LED芯片。第一引线框架和第二引线框架中的每一个包括基部和从基部延伸的多个延伸部。基部的下表面的一部分，基部的侧表面，延伸部的下表面和延伸部的侧表面被树脂覆盖。基部的下表面的剩余部分和延伸部分的末端表面不被树脂覆盖。基部的下表面的一部分包括第一引线框的第一边缘和第二引线框的第二边缘。第一边缘和第二边缘彼此相对。

13. 发明申请

US20110186900A1 LED PACKAGE, METHOD FOR MANUFACTURING LED PACKAGE, AND PACKING MEMBER FOR LED PACKAGE 有权
标题翻译： LED封装，制造LED封装的方法和用于LED封装的封装构件
公开(公告)号：US20110186900A1
公开(公告)日：2011-08-04
申请号：US12849102
申请日：2010-08-03
申请人： Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
发明人： Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
IPC分类号： H01L33/52 , H01L33/62
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.
摘要翻译：根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，并且LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。此外，树脂体覆盖第一和第二引线框架和LED芯片，并且具有表面粗糙度为0.15μm以上的上表面和具有高于上表面的表面粗糙度的表面粗糙度的侧表面。

14. 发明申请

US20090315068A1 LIGHT EMITTING DEVICE 审中-公开
标题翻译：发光装置
公开(公告)号：US20090315068A1
公开(公告)日：2009-12-24
申请号：US12391282
申请日：2009-02-24
申请人： Hiroaki Oshio , Reiji Ono
发明人： Hiroaki Oshio , Reiji Ono
IPC分类号： H01L27/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A light emitting device includes: a light emitting element; a first lead including a die pad portion at its one end portion, the light emitting element being bonded to the die pad portion; a second lead with its one end portion being opposed to the one end portion of the first lead; and a resin molded body including a recess with at least part of the die pad portion being exposed to the bottom thereof so that emission light from the light emitting element can be emitted upward, a lower surface with at least part of the lower surface of the first lead and at least part of the lower surface of the second lead being exposed thereto, and a lateral surface with at least part of the lateral surface of the die pad portion being exposed thereto, the resin molded body embedding the first lead and the second lead so that the other end portion of the first lead and the other end portion of the second lead are projected in directions opposite to each other. The at least part of the lateral surface of the die pad portion which is exposed is located on a first plane which is generally coplanar with the lateral surface of the other end portion of the first lead and the lateral surface of the other end portion of the second lead.
摘要翻译：发光器件包括：发光元件; 第一引线，其一端部具有芯片焊盘部，所述发光元件与所述芯片焊盘部接合; 第二引线，其一端部与第一引线的一端部相对; 以及树脂成型体，其具有凹部，所述凹部的至少一部分露出在所述凹部的底部，使得来自所述发光元件的发光可以向上方射出，下表面的下表面的至少一部分第一引线和第二引线的下表面的至少一部分被暴露于其中，并且具有裸片焊盘部分的侧表面的至少一部分的侧表面暴露于其中，树脂模制体嵌入第一引线和第二引线引线使得第一引线的另一端部和第二引线的另一端部沿彼此相反的方向突出。露出的芯片焊盘部分的侧表面的至少一部分位于与第一引线的另一端部的侧表面和第一引线的另一端部的侧表面大致共面的第一平面上第二个领先。

15. 发明授权

US07242032B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US07242032B2
公开(公告)日：2007-07-10
申请号：US10119524
申请日：2002-04-09
申请人： Hiroaki Oshio
发明人： Hiroaki Oshio
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting device includes a plurality of chips efficiently disposed in a limited space of an opening that has an approximately elliptical or elongate-circular opening shape. The device includes a lead having a slit formed between a portion for bonding a wire to and a portion for mounting chips on, thereby to prevent extrusion of an adhesive and eliminate defective bonding.
摘要翻译：发光器件包括有效地设置在具有大致椭圆形或细长圆形开口形状的开口的有限空间中的多个芯片。该装置包括：引线，其具有形成在用于接合线的部分和用于安装芯片的部分之间的狭缝，从而防止粘合剂的挤出并消除不良接合。

16. 发明申请

US20050280017A1 Semiconductor light emitting device and semiconductor light emitting unit 有权
标题翻译：半导体发光器件和半导体发光单元
公开(公告)号：US20050280017A1
公开(公告)日：2005-12-22
申请号：US11149461
申请日：2005-06-10
申请人： Hiroaki Oshio , Iwao Matsumoto , Takeshi Miyakawa , Hatsuo Takezawa
发明人： Hiroaki Oshio , Iwao Matsumoto , Takeshi Miyakawa , Hatsuo Takezawa
IPC分类号： H01L29/22 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： H01L33/62 , H01L24/73 , H01L24/97 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor light emitting device comprises: embedding resin; a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin; a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin; a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and a wire connecting the semiconductor light emitting chip with the second lead. The first and second inner lead sections and the first and second outer lead sections each have a substantially coplanar rear face. At least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section are not covered with the embedding resin but are exposed.
摘要翻译：一种半导体发光器件包括：嵌入树脂; 第一引线，其具有嵌入在嵌入树脂中的第一内部引线部分和从嵌入树脂的一个侧面突出的第一外部引线部分; 第二引线，其具有嵌入在嵌入树脂中的第二内引线部分和从与嵌入树脂的一个侧面相对的侧面突出的第二外引线部分; 半导体发光芯片，安装在所述第一内引线部分的暴露于设置在所述嵌入树脂的上表面上的凹部中的部分上; 以及将半导体发光芯片与第二引线连接的线。第一和第二内部引线部分以及第一和第二外部引线部分各自具有基本共面的后表面。第一内引线部分的后表面的至少一部分和第二内引线部分的后表面的至少一部分未被嵌入树脂覆盖，但是露出。

17. 发明授权

US08525202B2 LED package, method for manufacturing LED package, and packing member for LED package 有权
标题翻译： LED封装，LED封装制造方法，LED封装用包装件
公开(公告)号：US08525202B2
公开(公告)日：2013-09-03
申请号：US12849102
申请日：2010-08-03
申请人： Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
发明人： Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
IPC分类号： H01L33/00
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.
摘要翻译：根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。第一和第二引线框架彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，并且LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。此外，树脂体覆盖第一和第二引线框架和LED芯片，并且具有表面粗糙度为0.15μm或更高的上表面和具有高于上表面的表面粗糙度的表面粗糙度的侧表面。

18. 发明授权

US08338845B2 LED package and method for manufacturing the same 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US08338845B2
公开(公告)日：2012-12-25
申请号：US12868107
申请日：2010-08-25
申请人： Gen Watari , Satoshi Shimizu , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
发明人： Gen Watari , Satoshi Shimizu , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
IPC分类号： H01L33/00 , H01L27/15 , H01L31/12 , H01L29/04 , H01L31/036
CPC分类号： H01L33/48 , H01L24/97 , H01L33/56 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.
摘要翻译：根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。第一引线框架和第二引线框架由金属材料制成，并且彼此分开设置。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。树脂体由肖氏D硬度为25以上的树脂材料制成。此外，树脂体覆盖第一和第二引线框架和LED芯片。并且，树脂体的外观是LED封装的外观。

19. 发明申请

US20110193112A1 LED MODULE 失效
标题翻译： LED模块
公开(公告)号：US20110193112A1
公开(公告)日：2011-08-11
申请号：US12874406
申请日：2010-09-02
申请人： Kazuhiro Inoue , Kazuhisa Iwashita , Teruo Takeuchi , Tatsuo Tonedachi , Hiroaki Oshio , Tetsuro Komatsu , Naoya Ushiyama
发明人： Kazuhiro Inoue , Kazuhisa Iwashita , Teruo Takeuchi , Tatsuo Tonedachi , Hiroaki Oshio , Tetsuro Komatsu , Naoya Ushiyama
IPC分类号： H01L33/62
CPC分类号： H01L24/97 , F21K9/00 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.
摘要翻译：根据一个实施例，LED模块包括板，互连和LED封装。互连形成在板的上表面上。 LED封装安装在电路板上。 LED封装包括彼此分开布置的第一和第二引线框架，并且连接到彼此绝缘的互连部分。 LED封装包括设置在第一引线框架和第二引线框架之上的LED芯片。 LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一端子。此外，LED封装包括覆盖第一引线框架和第二引线框架中的每一个的上表面，下表面和边缘表面的树脂体，还覆盖LED芯片，但是暴露下表面的剩余部分和边缘表面。并且，树脂体的外观是LED封装的外观。

20. 发明授权

US07719023B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US07719023B2
公开(公告)日：2010-05-18
申请号：US11478793
申请日：2006-06-30
申请人： Hiroaki Oshio
发明人： Hiroaki Oshio
IPC分类号： H01L23/043
CPC分类号： H01L25/167 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting device includes a plurality of chips efficiently disposed in a limited space of an opening that has an approximately elliptical or elongate-circular opening shape. The device includes a lead having a slit formed between a portion for bonding a wire to and a portion for mounting chips on, thereby to prevent extrusion of an adhesive and eliminate defective bonding.
摘要翻译：发光器件包括有效地设置在具有大致椭圆形或细长圆形开口形状的开口的有限空间中的多个芯片。该装置包括：引线，其具有形成在用于将导线接合的部分和用于安装芯片的部分之间的狭缝，从而防止粘合剂的挤出并消除不良接合。

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