专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20180308735A1 SEMICONDUCTOR PROCESS EQUIPMENT 审中-公开
公开(公告)号：US20180308735A1
公开(公告)日：2018-10-25
申请号：US16016767
申请日：2018-06-25
申请人： Applied Materials, Inc.
发明人： Karthik JANAKIRAMAN , Hari K. PONNEKANTI , Juan Carlos ROCHA , Mukund SRINIVASAN
IPC分类号： H01L21/677
摘要： A system for processing a substrate is provided including a first planar motor, a substrate carrier, a first processing chamber, and a first lift. The first planar motor includes a first arrangement of coils disposed along a first horizontal direction, a top surface parallel to the first horizontal direction, a first side, a second side. The substrate carrier has a substrate supporting surface parallel to the first horizontal direction. The first processing chamber has an opening to receive a substrate disposed on the substrate carrier. The first lift includes a second planar motor having a second arrangement of coils disposed along the first horizontal direction. A top surface top surface of the second planar motor is parallel to the first horizontal direction. The first lift is configured to move the top surface of the second planar motor between a first vertical location and a second vertical location.

12. 发明申请

US20180117771A1 WAFER SWAPPER 审中-公开
公开(公告)号：US20180117771A1
公开(公告)日：2018-05-03
申请号：US15860102
申请日：2018-01-02
申请人： Applied Materials, Inc.
发明人： Dale R. DU BOIS , Juan Carlos ROCHA-ALVAREZ , Karthik JANAKIRAMAN , Hari K. PONNEKANTI , Sanjeev BALUJA , Prajeeth WILTON
IPC分类号： B25J11/00 , H01L21/677 , H01L21/67
CPC分类号： B25J11/0095 , H01L21/67196 , H01L21/67742 , H01L21/67748
摘要： The present disclosure generally relates to semiconductor process equipment used to transfer semiconductor substrates between process chambers. More specifically, embodiments described herein are related to systems and methods used to transfer, or swap, semiconductor substrates between process chambers using a transport device that employs at least two blades for the concurrent transfer of substrates between processing chambers.

13. 发明申请

US20180087155A1 SPUTTERING SHOWERHEAD 审中-公开
公开(公告)号：US20180087155A1
公开(公告)日：2018-03-29
申请号：US15704850
申请日：2017-09-14
申请人： Applied Materials, Inc.
发明人： Anantha K. SUBRAMANI , Tza-Jing GUNG , Praburam GOPALRAJA , Hari K. PONNEKANTI
IPC分类号： C23C16/455 , C23C14/34 , C23C14/35 , H01J37/34 , C23C28/02 , C23C28/04
摘要： In one implementation, a sputtering showerhead assembly is provided. The sputtering showerhead assembly comprises a faceplate comprising a sputtering surface comprising a target material and a second surface opposing the sputtering surface, wherein a plurality of gas passages extend from the sputtering surface to the second surface. The sputtering showerhead assembly comprises further comprises a backing plate positioned adjacent to the second surface of the faceplate. The backing plate comprises a first surface and a second surface opposing the first surface. The sputtering showerhead assembly has a plenum defined by the first surface of the backing plate and the second surface of the faceplate. The sputtering showerhead assembly comprises further comprises one or more magnetrons positioned along the second surface of the backing plate.

14. 发明申请

US20180076075A1 SEMICONDUCTOR PROCESS EQUIPMENT 审中-公开
公开(公告)号：US20180076075A1
公开(公告)日：2018-03-15
申请号：US15697492
申请日：2017-09-07
申请人： Applied Materials, Inc.
发明人： Karthik JANAKIRAMAN , Hari K. PONNEKANTI , Juan Carlos ROCHA-ALVAREZ
IPC分类号： H01L21/677
摘要： A substrate transport system is disclosed and includes a chamber having an interior wall, a planar motor disposed on the interior wall, and a substrate carrier magnetically coupled to the planar motor. The substrate carrier comprises a base and a substrate supporting surface coupled to a support member extending from the base in a cantilevered orientation.

15. 发明申请

US20170092511A1 LOADLOCK INTEGRATED BEVEL ETCHER SYSTEM 审中-公开
公开(公告)号：US20170092511A1
公开(公告)日：2017-03-30
申请号：US15013547
申请日：2016-02-02
申请人： Applied Materials, Inc.
发明人： Saptarshi BASU , Jeongmin LEE , Paul CONNORS , Dale R. DU BOIS , Prashant Kumar KULSHRESHTHA , Karthik Thimmavajjula NARASIMHA , Brett BERENS , Kalyanjit GHOSH , Jianhua ZHOU , Ganesh BALASUBRAMANIAN , Kwangduk Douglas LEE , Juan Carlos ROCHA-ALVAREZ , Hiroyuki OGISO , Liliya KRIVULINA , Rick GILBERT , Mohsin WAQAR , Venkatanarayana SHANKARAMURTHY , Hari K. PONNEKANTI
IPC分类号： H01L21/67 , H01J37/32 , H01L21/687
CPC分类号： H01L21/67069 , H01J37/32009 , H01J37/32357 , H01J37/32366 , H01J37/3244 , H01J37/32633 , H01J37/32715 , H01J2237/334 , H01L21/6708 , H01L21/67201 , H01L21/68785
摘要： Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.

16. 发明申请

US20160218029A1 SEMICONDUCTOR PROCESS EQUIPMENT 审中-公开
标题翻译：半导体工艺设备
公开(公告)号：US20160218029A1
公开(公告)日：2016-07-28
申请号：US15004406
申请日：2016-01-22
申请人： Applied Materials, Inc.
发明人： Karthik JANAKIRAMAN , Hari K. PONNEKANTI , Juan Carlos ROCHA , Mukund SRINIVASAN
IPC分类号： H01L21/677 , B25J15/06 , B25J11/00 , C23C16/458 , C23C16/50
CPC分类号： H01L21/67709 , H01L21/67736 , H01L21/67742
摘要： A system for processing a substrate is provided including a first planar motor, a substrate carrier, a first processing chamber, and a first lift. The first planar motor includes a first arrangement of coils disposed along a first horizontal direction, a top surface parallel to the first horizontal direction, a first side, a second side. The substrate carrier has a substrate supporting surface parallel to the first horizontal direction. The first processing chamber has an opening to receive a substrate disposed on the substrate carrier. The first lift includes a second planar motor having a second arrangement of coils disposed along the first horizontal direction. A top surface top surface of the second planar motor is parallel to the first horizontal direction. The first lift is configured to move the top surface of the second planar motor between a first vertical location and a second vertical location.
摘要翻译：提供了一种用于处理衬底的系统，包括第一平面电机，衬底载体，第一处理室和第一电梯。第一平面电动机包括沿着第一水平方向设置的线圈的第一布置，平行于第一水平方向的顶表面，第一侧，第二侧。衬底载体具有平行于第一水平方向的衬底支撑表面。第一处理室具有用于接收设置在基板载体上的基板的开口。第一升降机包括具有沿着第一水平方向设置的线圈的第二布置的第二平面马达。第二平面电动机的顶表面顶表面平行于第一水平方向。第一升降机构造成使第二平面马达的顶表面在第一垂直位置和第二垂直位置之间移动。

17. 发明申请

US20160133489A1 Processing System Containing An Isolation Region separating a Deposition chamber from a treatment chamber 审中-公开
标题翻译：包含隔离区域的处理系统将沉积室与处理室分离
公开(公告)号：US20160133489A1
公开(公告)日：2016-05-12
申请号：US14589990
申请日：2015-01-05
申请人： APPLIED MATERIALS, INC.
发明人： Karthik JANAKIRAMAN , Abhijit Basu MALLICK , Hari K. PONNEKANTI , Mandyam SRIRAM , Alexandros T. DEMOS , Mukund SRINIVASAN , Juan Carlos ROCHA-ALVAREZ , Dale R. DUBOIS
IPC分类号： H01L21/67 , C23C16/458 , H01L21/687 , C23C14/58 , C23C14/50 , B05C13/00 , C23C16/56
CPC分类号： H01L21/67207 , H01L21/67126 , H01L21/6719 , H01L21/67213 , H01L21/67709 , H01L21/6776
摘要： An apparatus and method for processing a substrate in a processing system containing a deposition chamber, a treatment chamber, and an isolation region, separating the deposition chamber from the treatment is described herein. The deposition chamber deposits a film on a substrate. The treatment chamber receives the substrate from the deposition chamber and alters the film deposited in the deposition chamber with a film property altering device. Processing systems and methods are provided in accordance with the above embodiment and other embodiments.
摘要翻译：本文描述了一种用于在包含沉积室，处理室和隔离区域的处理系统中处理衬底的装置和方法，将沉积室与处理分离。沉积室在基板上沉积膜。处理室从沉积室接收衬底并且利用膜性质改变装置改变沉积在沉积室中的膜。根据上述实施例和其他实施例提供处理系统和方法。

18. 发明申请

US20160049323A1 METHOD AND APPARATUS OF PROCESSING WAFERS WITH COMPRESSIVE OR TENSILE STRESS AT ELEVATED TEMPERATURES IN A PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION SYSTEM 审中-公开
标题翻译：在等离子体增强化学蒸气沉积系统中的加压温度下具有压缩或拉伸应力的加工辊的方法和装置
公开(公告)号：US20160049323A1
公开(公告)日：2016-02-18
申请号：US14824229
申请日：2015-08-12
申请人： Applied Materials, Inc.
发明人： Zheng John YE , Jay D. PINSON, II , Hiroji HANAWA , Jianhua ZHOU , Xing LIN , Ren-Guan DUAN , Kwangduk Douglas LEE , Bok Hoen KIM , Swayambhu P. BEHERA , Sungwon HA , Ganesh BALASUBRAMANIAN , Juan Carlos ROCHA- ALVAREZ , Prashant Kumar KULSHRESHTHA , Jason K. FOSTER , Mukund SRINIVASAN , Uwe P. HALLER , Hari K. PONNEKANTI
IPC分类号： H01L21/683 , H02N13/00
CPC分类号： H01L21/6833 , H01L21/68757 , H02N13/00
摘要： Embodiments of the present disclosure provide an electrostatic chuck for maintaining a flatness of a substrate being processed in a plasma reactor at high temperatures. In one embodiment, the electrostatic chuck comprises a chuck body coupled to a support stem, the chuck body having a substrate supporting surface, and the chuck body has a volume resistivity value of about 1×107 ohm-cm to about 1×1015 ohm-cm in a temperature of about 250° C. to about 700° C., and an electrode embedded in the body, the electrode is coupled to a power supply. In one example, the chuck body is composed of an aluminum nitride material which has been observed to be able to optimize chucking performance around 600° C. or above during a deposition or etch process, or any other process that employ both high operating temperature and substrate clamping features.
摘要翻译：本公开的实施例提供了一种静电卡盘，用于在高温下维持在等离子体反应器中正在加工的基板的平坦度。在一个实施例中，静电卡盘包括联接到支撑杆的卡盘体，卡盘主体具有基底支撑表面，卡盘体的体积电阻率值约为1×107ohm-cm至约1×1015ohm- 在约250℃至约700℃的温度下，以及嵌入在本体中的电极，电极耦合到电源。在一个实例中，卡盘主体由氮化铝材料组成，已经被观察到能够在沉积或蚀刻过程期间优化约600℃或更高的夹持性能，或任何其他使用高工作温度和基板夹紧功能。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式