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11. 发明申请

US20070246813A1 EMBEDDED INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM 有权
标题翻译：嵌入式集成电路封装封装系统
公开(公告)号：US20070246813A1
公开(公告)日：2007-10-25
申请号：US11379336
申请日：2006-04-19
申请人： You Yang Ong , Dioscoro Merilo , Seng Guan Chow
发明人： You Yang Ong , Dioscoro Merilo , Seng Guan Chow
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L23/5385 , H01L24/19 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L25/16 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An embedded integrated circuit package-on-package system is provided forming a first integrated circuit package system, forming a second integrated circuit package system, and mounting the second integrated circuit package system over the first integrated circuit package system with the first integrated circuit package system, the second integrated circuit package system, or a combination thereof being an embedded integrated circuit package system or an embedded stacked integrated circuit package system.
摘要翻译：提供一种嵌入式集成电路封装封装系统，其形成第一集成电路封装系统，形成第二集成电路封装系统，以及将所述第二集成电路封装系统安装在所述第一集成电路封装系统上与所述第一集成电路封装系统，第二集成电路封装系统或其组合是嵌入式集成电路封装系统或嵌入式堆叠集成电路封装系统。

12. 发明授权

US08163604B2 Integrated circuit package system using etched leadframe 有权
标题翻译：集成电路封装系统采用蚀刻引线框架
公开(公告)号：US08163604B2
公开(公告)日：2012-04-24
申请号：US11163305
申请日：2005-10-13
申请人： You Yang Ong , Cheong Chiang Ng , Suhairi Mohmad
发明人： You Yang Ong , Cheong Chiang Ng , Suhairi Mohmad
IPC分类号： H01L21/60
CPC分类号： H01L21/4832 , H01L23/49503 , H01L23/49582 , H01L24/48 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package system includes a conductive substrate. A heat sink and a plurality of leads are etched in the substrate to define a conductive film connecting the heat sink and the plurality of leads to maintain their spatial relationship. A die is attached to the heat sink and wire bonded to the plurality of leads. An encapsulant is formed over the die, the heat sink, and the plurality of leads. The conductive film is etched away to expose the encapsulant and the bottom surfaces of the heat sink and the plurality of leads. Wave soldering is used to form solder on at least the plurality of leads. Multiple heat sinks and hanging leads are provided.
摘要翻译：集成电路封装系统包括导电衬底。在衬底中蚀刻散热器和多个引线以限定连接散热器和多个引线的导电膜以保持它们的空间关系。模具附接到散热器并且引线接合到多个引线。在模具，散热器和多个引线上形成密封剂。蚀刻掉导电膜以暴露散热器和多个引线的密封剂和底表面。使用波峰焊在至少多根引线上形成焊料。提供多个散热器和悬挂导线。

13. 发明授权

US07557432B2 Thermally enhanced power semiconductor package system 有权
标题翻译：热增强功率半导体封装系统
公开(公告)号：US07557432B2
公开(公告)日：2009-07-07
申请号：US11307285
申请日：2006-01-31
申请人： Wai Kwong Tang , You Yang Ong , Kuan Ming Kan , Larry Lewellen
发明人： Wai Kwong Tang , You Yang Ong , Kuan Ming Kan , Larry Lewellen
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/4334 , H01L23/49548 , H01L24/37 , H01L24/40 , H01L2224/16 , H01L2224/16245 , H01L2224/37099 , H01L2224/371 , H01L2224/37147 , H01L2224/37599 , H01L2224/40245 , H01L2224/73153 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： The present invention provides a thermally enhanced power semiconductor package system comprising providing a power semiconductor die, forming an upper lead frame on the power semiconductor die and forming a lower lead frame below the power semiconductor die, wherein the upper lead frame and the lower lead frame are provided in an offset configuration relative to each other to provide two heat dissipation paths.
摘要翻译：本发明提供了一种热增强功率半导体封装系统，包括提供功率半导体管芯，在功率半导体管芯上形成上部引线框架，并在功率半导体管芯下方形成下部引线框架，其中上部引线框架和下部引线框架以相对于彼此的偏移配置提供以提供两个散热路径。

14. 发明申请

US20070246806A1 EMBEDDED INTEGRATED CIRCUIT PACKAGE SYSTEM 有权
标题翻译：嵌入式集成电路封装系统
公开(公告)号：US20070246806A1
公开(公告)日：2007-10-25
申请号：US11379332
申请日：2006-04-19
申请人： You Yang Ong , Dioscoro Merilo , Seng Guan Chow
发明人： You Yang Ong , Dioscoro Merilo , Seng Guan Chow
IPC分类号： H01L23/495
CPC分类号： H01L23/3128 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L25/16 , H01L2223/54433 , H01L2223/54473 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/32145 , H01L2224/32245 , H01L2224/73253 , H01L2224/73267 , H01L2224/97 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/18162 , H01L2924/19105 , H01L2924/3025 , H05K1/0206 , H05K1/185 , H05K3/4602
摘要： An embedded integrated circuit package system is provided forming a first conductive pattern on a first structure, connecting a first integrated circuit die on the first conductive pattern, forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern, forming a channel in the substrate forming encapsulation, and applying a conductive material in the channel.
摘要翻译：提供了一种在第一结构上形成第一导电图案的嵌入式集成电路封装系统，将第一集成电路管芯连接在第一导电图案上，形成衬底形成封装以覆盖第一集成电路管芯和第一导电图案，形成在衬底形成封装中的通道，以及在沟道中施加导电材料。

15. 发明申请

US20070200248A1 STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM 有权
标题翻译：堆叠式集成电路封装系统
公开(公告)号：US20070200248A1
公开(公告)日：2007-08-30
申请号：US11307904
申请日：2006-02-27
申请人： You Yang Ong
发明人： You Yang Ong
IPC分类号： H01L23/52 , H01L23/29
CPC分类号： H01L23/49575 , H01L23/3114 , H01L24/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked integrated circuit package system is provided forming a lead and a die paddle from a lead frame, forming a first integrated circuit die having an interconnect provided thereon, placing a second integrated circuit die over the first integrated circuit die and the die paddle, connecting the second integrated circuit die and the lead, and encapsulating the first integrated circuit die and the second integrated circuit die with a portion of the lead and the interconnect exposed.
摘要翻译：提供了一种堆叠集成电路封装系统，其从引线框架形成引线和管芯焊盘，形成具有设置在其上的互连件的第一集成电路管芯，在第一集成电路管芯和管芯焊盘上放置第二集成电路管芯，连接第二集成电路管芯和引线，并且封装第一集成电路管芯和第二集成电路管芯，引线和互连件的一部分被暴露。

16. 发明申请

US20060180904A1 NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM 有权
标题翻译：非引线集成电路封装系统
公开(公告)号：US20060180904A1
公开(公告)日：2006-08-17
申请号：US11164088
申请日：2005-11-10
申请人： You Yang Ong
发明人： You Yang Ong
IPC分类号： H01L23/495
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/49503 , H01L23/49548 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16 , H01L2224/16245 , H01L2224/32145 , H01L2224/32245 , H01L2224/32257 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/48257 , H01L2224/48464 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85439 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： A non-leaded integrated circuits package system is provided including etching differential height lead structures having inner leads at a paddle height, providing mold locks at the bending points of the differential height lead structures, etching an elevated paddle at a same height as the inner leads, mounting a first integrated circuit on the elevated paddle, and electrically connecting first electrical interconnects between the first integrated circuit and the inner leads.
摘要翻译：提供了一种非引线集成电路封装系统，其包括具有桨形高度的内部引线的蚀刻差分高度引线结构，在差分高度引线结构的弯曲点处提供模具锁，在与内部引线相同的高度上蚀刻升高的焊盘将第一集成电路安装在升高的桨上，并且电连接第一集成电路和内引线之间的第一电互连。

17. 发明申请

US20060103008A1 HYPER THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM 审中-公开
公开(公告)号：US20060103008A1
公开(公告)日：2006-05-18
申请号：US11162828
申请日：2005-09-24
申请人： You Yang Ong , Zurina Zukiffly , Saat Shukri Embong
发明人： You Yang Ong , Zurina Zukiffly , Saat Shukri Embong
IPC分类号： H01L23/34
CPC分类号： H01L23/367 , H01L23/13 , H01L23/3128 , H01L23/3677 , H01L23/49816 , H01L2224/16 , H01L2924/15311
摘要： A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second heat slug is attached to the second surface of the semiconductor chip through the substrate opening.

18. 发明公开

US20240026621A1 ELECTRIC DEFROSTER 审中-公开
公开(公告)号：US20240026621A1
公开(公告)日：2024-01-25
申请号：US18352539
申请日：2023-07-14
申请人： You Yang , Hu Lu
发明人： You Yang , Hu Lu
IPC分类号： E01H5/12
CPC分类号： E01H5/12
摘要： The invention discloses an electric defroster, comprising a housing with a handle; a working wheel rotatably connected with housing and at least partially protrudes out of the surface of the housing, scraping pieces extending along the axial direction is arranged on the surface of the working wheel, and a power mechanism used for driving the working wheel to rotate relative to the housing; scraping pieces rotate in the circumferential direction to scrape ice. The invention utilizes the working wheel to roll and deice the glass surface, the flexibility of the position for scraping ice is higher and ice at the corner can be effectively scraped; there are more contact surface can be selected, ice scraping more flexible; scraped ice is quickly discharged from space between adjacent scraping pieces, ensuring ice scraping efficiency; the invention can not only be used for scraping ice, but also for cleaning and removing rust.

19. 发明授权

US09782342B2 Composite magnetic nanoparticle drug delivery system 有权
公开(公告)号：US09782342B2
公开(公告)日：2017-10-10
申请号：US13271172
申请日：2011-10-11
申请人： Ramazan Asmatulu , Heath Misak , Shang-You Yang , Paul Wooley
发明人： Ramazan Asmatulu , Heath Misak , Shang-You Yang , Paul Wooley
IPC分类号： A61M37/00 , A61K9/00 , A61K33/24 , A61K9/50
CPC分类号： A61K9/0009 , A61K9/5031 , A61K9/5094
摘要： A composite magnetic nanoparticle drug delivery system provides targeted controlled release chemotherapies for cancerous tumors and inflammatory diseases. The magnetic nanoparticle includes a biocompatible and biodegradable polymer, a magnetic nanoparticle, the biological targeting agent human serum albumin, and a therapeutic pharmaceutical composition. The composite nanoparticles are prepared by oil-in-oil emulsion/solvent evaporation and high shear mixing. An externally applied magnetic field draws the magnetic nanoparticles to affected areas. The biological targeting agent draws the nanoparticles into the affected tissues. Polymer degradation provides controlled time release delivery of the pharmaceutical agent.

20. 发明授权

US08164182B2 Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip 有权
标题翻译：超热增强半导体封装系统包括在半导体芯片的相对表面上的热塞
公开(公告)号：US08164182B2
公开(公告)日：2012-04-24
申请号：US11164209
申请日：2005-11-14
申请人： You Yang Ong , Zurina binti Zukiffly , Saat Shukri bin Embong
发明人： You Yang Ong , Zurina binti Zukiffly , Saat Shukri bin Embong
IPC分类号： H01L23/34
CPC分类号： H01L23/36 , H01L23/24 , H01L23/3128 , H01L23/3677 , H01L23/3736 , H01L24/05 , H01L24/13 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05624 , H01L2224/131 , H01L2224/13147 , H01L2224/291 , H01L2224/2939 , H01L2224/81193 , H01L2224/81801 , H01L2224/83801 , H01L2224/8385 , H01L2224/92225 , H01L2924/07802 , H01L2924/15311 , H01L2924/3651 , H01L2924/3656 , H01L2924/01014 , H01L2924/01029 , H01L2924/14 , H01L2924/0665 , H01L2924/00
摘要： A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second heat slug is attached to the second surface of the semiconductor chip through the substrate opening.
摘要翻译：提供一种半导体封装系统，包括将半导体芯片安装到具有基板开口的基板上。第一散热片附接到半导体芯片的至少部分地封装半导体芯片的第一表面。第二散热片通过基板开口连接到半导体芯片的第二表面。

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