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11. 发明授权

US07027674B2 Optical module and optical transmission apparatus 有权
标题翻译：光模块和光传输装置
公开(公告)号：US07027674B2
公开(公告)日：2006-04-11
申请号：US10611289
申请日：2003-06-30
申请人： Naoki Matsushima , Kazumi Kawamoto , Hideyuki Kuwano , Yoshiaki Niwa , Tetsuya Katou
发明人： Naoki Matsushima , Kazumi Kawamoto , Hideyuki Kuwano , Yoshiaki Niwa , Tetsuya Katou
IPC分类号： G02B6/12 , G02B6/10
CPC分类号： G02B6/4201 , G02B6/423
摘要： The present invention provides an optical module, and an optical transmission line comprising the optical module. The optical module has a structure in which an optical-modulator-mounted carrier is formed of a semiconductor substrate; a transmission line on the carrier is formed of a coplanar waveguide; a transmission line for inputting a signal into the transmission line is formed on a dielectric substrate; the transmission line on the input side which is a grounded coplanar waveguide is coupled by a conversion line to the transmission line on the output side which is a coplanar waveguide; and an electrical connection between the transmission lines is made by use of a conductor wire.
摘要翻译：本发明提供了一种光学模块和包括该光学模块的光学传输线。光学模块具有其中由光学调制器安装的载体由半导体衬底形成的结构; 载体上的传输线由共面波导形成; 在电介质基板上形成用于将信号输入到传输线的传输线; 作为接地共面波导的输入侧的传输线通过转换线耦合到作为共面波导的输出侧的传输线; 并且通过使用导线来实现传输线之间的电连接。

12. 发明授权

US07011457B2 Optical coupling apparatus 有权
标题翻译：光耦合装置
公开(公告)号：US07011457B2
公开(公告)日：2006-03-14
申请号：US10989290
申请日：2004-11-17
申请人： Kazuyuki Fukuda , Hideyuki Kuwano , Yoshiaki Niwa , Naoki Matsushima
发明人： Kazuyuki Fukuda , Hideyuki Kuwano , Yoshiaki Niwa , Naoki Matsushima
IPC分类号： G02B6/36
CPC分类号： G02B6/4204 , G02B6/4201 , G02B6/4208 , G02B6/4243 , G02B6/4256 , G02B6/4271
摘要： An optical coupling apparatus having a temperature control element on which a semiconductor light emitting element, a substrate and a lens are mounted, the semiconductor light emitting element being mounted on the substrate, and rays of light from the semiconductor light emitting element being introduced into the lens. A base on which the temperature control element is disposed, a through-hole portion formed in a housing wall portion installed on the base, penetrating through the housing wall portion and having a wall surface portion longer than a thickness of the housing wall portion and an optical fiber communicated with the through-hole portion and receiving converted light from the lens introduced thereto. A length of the substrate in a direction connecting the light emitting element to the optical fiber is within a range from 0.1 to 0.25 with respect to a length of the base sandwiched by the housing walls of the substrate.
摘要翻译：一种具有安装有半导体发光元件，基板和透镜的温度控制元件的光耦合装置，半导体发光元件安装在基板上，并将来自半导体发光元件的光线引入到镜片。设置有温度控制元件的基座，形成在安装在基座上的壳体壁部中的通孔部分，穿过壳体壁部分并且具有比壳体壁部分的厚度更长的壁表面部分，以及与通孔部分连通并接收从其引入的透镜的转换光的光纤。在将发光元件连接到光纤的方向上的基板的长度相对于由基板的壳体壁夹持的基板的长度在0.1〜0.25的范围内。

13. 发明授权

US06961357B2 Semiconductor laser module 有权
标题翻译：半导体激光模块
公开(公告)号：US06961357B2
公开(公告)日：2005-11-01
申请号：US10632331
申请日：2003-07-31
申请人： Hiroshi Moriya , Kisho Ashida , Yoshiaki Niwa
发明人： Hiroshi Moriya , Kisho Ashida , Yoshiaki Niwa
IPC分类号： H01S5/022 , H01S3/04 , H01S5/00 , H01S5/02
CPC分类号： H01S5/02252 , H01S5/005 , H01S5/02216 , H01S5/02236 , H01S5/02272
摘要： In a semiconductor laser module, in order to sufficiently reduce the thermal stress arising in a due to the bonding of elements when they are packaged and to improve the yield of production, the semiconductor laser module is provided with a semiconductor laser element, a submount bonded to the semiconductor laser element with a solder layer in-between and thereby mounted with it, and a base mounted with this submount with another solder layer in-between. Herein, T/W≧0.15 holds, where W is the width of the submount in the direction orthogonal to the optical axis of the semiconductor laser element and T is the thickness of the submount.
摘要翻译：在半导体激光器模块中，为了充分降低由于封装时的元件的接合而产生的热应力，并且为了提高生产成本，半导体激光器模块设置有半导体激光元件，到具有焊料层的半导体激光元件，并且由此安装有焊料层，以及安装有该基座的基座，其间具有另一个焊料层。这里，T / W> = 0.15，其中，W是与基板的光轴正交的方向上的基台的宽度，T是基台的厚度。

14. 发明申请

US20050063649A1 Optical coupling apparatus 有权
标题翻译：光耦合装置
公开(公告)号：US20050063649A1
公开(公告)日：2005-03-24
申请号：US10989290
申请日：2004-11-17
申请人： Kazuyuki Fukuda , Hideyuki Kuwano , Yoshiaki Niwa , Naoki Matsushima
发明人： Kazuyuki Fukuda , Hideyuki Kuwano , Yoshiaki Niwa , Naoki Matsushima
IPC分类号： G02B6/42 , H01S5/022 , H01S5/024 , G02B6/36
CPC分类号： G02B6/4204 , G02B6/4201 , G02B6/4208 , G02B6/4243 , G02B6/4256 , G02B6/4271
摘要： An optical coupling apparatus having a temperature control element on which a semiconductor light emitting element, a substrate and a lens are mounted, the semiconductor light emitting element being mounted on the substrate, and rays of light from the semiconductor light emitting element being introduced into the lens. A base on which the temperature control element is disposed, a through-hole portion formed in a housing wall portion installed on the base, penetrating through the housing wall portion and having a wall surface portion longer than a thickness of the housing wall portion and an optical fiber communicated with the through-hole portion and receiving converted light from the lens introduced thereto. A length of the substrate in a direction connecting the light emitting element to the optical fiber is within a range from 0.1 to 0.25 with respect to a length of the base sandwiched by the housing walls of the substrate.
摘要翻译：一种具有安装有半导体发光元件，基板和透镜的温度控制元件的光耦合装置，半导体发光元件安装在基板上，并将来自半导体发光元件的光线引入到镜片。设置有温度控制元件的基座，形成在安装在基座上的壳体壁部中的通孔部分，穿过壳体壁部分并且具有比壳体壁部分的厚度长的壁表面部分，以及与通孔部分连通并接收从其引入的透镜的转换光的光纤。在将发光元件连接到光纤的方向上的基板的长度相对于由基板的壳体壁夹持的基板的长度在0.1〜0.25的范围内。

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