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    • 11. 发明授权
    • Secure resource access
    • 安全的资源访问
    • US07373662B2
    • 2008-05-13
    • US10229641
    • 2002-08-27
    • Ward Scott FosterRobert John Madril, Jr.Shell Sterling Simpson
    • Ward Scott FosterRobert John Madril, Jr.Shell Sterling Simpson
    • G06F13/368G06F9/44G06F13/38
    • H04L63/08H04L63/102
    • A method and system for enabling a user to authorize a client, acting under the directed of a first resource, to access a second resource. Before the client accesses the second resource, client programming, that is autonomous of the first and second resources, redirects the client to an authorization service that is also autonomous of the first and second resource. The authorization service authenticates the user, identifies policy data, if any, associated with the user and the first resource, and then returns to the client an interface generated according to the identified policy data, if any, enabling the user to grant or deny authorization. Where policy data does not exist, the authorization service returns an interface to the client enabling the user to set policy data.
    • 一种用于使用户能够授权在第一资源的指导下行动的客户端访问第二资源的方法和系统。 在客户端访问第二资源之前,自动执行第一和第二资源的客户端编程将客户端重定向到也是第一和第二资源自主的授权服务。 授权服务对用户进行认证,识别与用户和第一资源相关联的策略数据(如果有的话),然后将根据所识别的策略数据(如果有的话)生成的接口返回给客户,使得用户能够授予或拒绝授权 。 在策略数据不存在的情况下,授权服务向客户端返回一个接口,使用户能够设置策略数据。
    • 14. 发明授权
    • Method and apparatus for dissipating heat from an electronic device
    • 从电子设备散热的方法和装置
    • US06971442B2
    • 2005-12-06
    • US09897793
    • 2001-06-29
    • Ioan SauciucWard ScottGregory M. Chrysler
    • Ioan SauciucWard ScottGregory M. Chrysler
    • F28D15/02F28D15/06H01L23/427F28D15/00
    • H01L23/427F28D15/0241F28D15/0266F28D15/06H01L2924/0002H01L2924/00
    • The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator. The evaporator is then able to evaporate the liquid coolant and remove thermal energy from the processor.
    • 本发明的方法和装置从电子装置散发热量,为高发热电子器件提供有效且普遍应用的热解决方案。 该装置包括蒸发器,冷凝器,加热器和导管。 蒸发器,冷凝器和管道限定了具有部分填充有液体冷却剂的内部容积的封闭系统。 蒸发器热连接到诸如处理器的电子设备,并且通过蒸发液体冷却剂来从处理器去除热能。 当设备被定向成使得没有液体冷却剂与蒸发器接触时,加热器向冷却剂施加热能直到冷却剂开始沸腾。 沸腾液体冷却剂会在液体冷却剂内形成气泡。 通过沸腾产生的气泡的体积提高了封闭系统内的液体冷却剂的水平,直到液体冷却剂与蒸发器接触。 蒸发器然后能够蒸发液体冷却剂并从处理器去除热能。
    • 16. 发明授权
    • Loading mechanisms for integrated circuit (IC) packages
    • 集成电路(IC)封装的装载机制
    • US07510418B1
    • 2009-03-31
    • US11931805
    • 2007-10-31
    • Ward ScottHong XieIoan Sauciuc
    • Ward ScottHong XieIoan Sauciuc
    • H01R13/62
    • H01L23/4093H01L2224/16H01L2224/73204H01R12/714H01R12/88
    • Disclosed is a socket assembly comprising a retention mechanism, a circuit board, an IC socket, a heat sink unit and a loading mechanism. The retention mechanism includes a support plate, on which the circuit board, the IC socket comprising die and package, and the heat sink unit are stacked respectively. The retention mechanism further includes a plurality of standoffs perpendicular to the support plate and include a pair of latches at different heights. The loading mechanism includes a loading plate configured on end portions of the standoffs and a pair of downwardly extending clips that are capable of engaging to the latches on the both standoffs. Correspondingly, the circuit board, the IC socket and the heat sink unit are sandwiched between the loading plate and the support plate. The heights of the pair of latches on the standoffs are based on the die and package in the IC socket.
    • 公开了一种插座组件,其包括保持机构,电路板,IC插座,散热器单元和装载机构。 保持机构包括支撑板,电路板,包含芯片和封装的IC插座和散热单元分别堆叠在支撑板上。 保持机构还包括垂直于支撑板的多个支座,并且包括在不同高度处的一对闩锁。 装载机构包括配置在支座的端部上的装载板和能够与两个支座上的闩锁接合的一对向下延伸的夹子。 相应地,电路板,IC插座和散热单元夹在装载板和支撑板之间。 支架上的这对闩锁的高度基于IC插座中的裸片和封装。