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11. 发明申请

US20160084722A1 Differential Pressure Sensor Assembly 有权
标题翻译：差压传感器组件
公开(公告)号：US20160084722A1
公开(公告)日：2016-03-24
申请号：US14495095
申请日：2014-09-24
申请人： Stephen R. Hooper , Darrel R. Frear , Thomas C. Speight
发明人： Stephen R. Hooper , Darrel R. Frear , Thomas C. Speight
IPC分类号： G01L9/00
CPC分类号： G01L9/0052 , G01L13/025 , G01L19/04 , G01L19/069 , H01L2224/48145 , H01L2924/1815 , H01L2924/00012
摘要： A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance.
摘要翻译：差压传感器组件包括具有第一感测表面和第二感测表面的换能器。第二感测表面包含在腔中。集成电路（IC）与传感器气密耦合。 IC具有与空腔对准的第一孔。引线框架耦合到IC。引线框具有与IC的第一孔对准的第二孔。封装封装了传感器，IC和引线框架。该封装具有暴露于第一感测表面的第三孔。该包装包括在封装的第三孔和IC的第一孔之间提供密封的模塑料。模塑料通过侵入距离与换能器分离。

12. 发明授权

US09285422B2 Tester and method for testing a strip of devices 有权
标题翻译：用于测试一条设备的测试仪和方法
公开(公告)号：US09285422B2
公开(公告)日：2016-03-15
申请号：US13465651
申请日：2012-05-07
申请人： Chad S. Dawson , Stephen R. Hooper , Peter T. Jones , Mark E. Schlarmann
发明人： Chad S. Dawson , Stephen R. Hooper , Peter T. Jones , Mark E. Schlarmann
IPC分类号： G01R31/317 , B81C99/00 , G01R31/06 , G01R31/28
CPC分类号： G01R31/31718 , B81B2207/03 , B81C99/0045 , B81C99/005 , G01R31/06 , G01R31/2829 , G01R31/2844
摘要： A tester configured to test a strip of devices is provided. The tester may include a communications system, a plurality of communication lines, a plurality of multiplexors, each multiplexor having at least two outputs, wherein each multiplexor is configured to receive a signal generated by the communications system via one of the plurality of communication lines, and each multiplexor may be selectably coupled to at least two of the devices in the strip of devices. The tester may be configured to index the plurality of communication lines to a first subset of the devices, initiate at least one test, command the devices to generate data for each of the at least one tests, retrieve data from a first set of the devices, and retrieve data from a second set of the devices.
摘要翻译：提供了一种配置成测试一条设备的测试仪。测试器可以包括通信系统，多个通信线路，多个多路复用器，每个多路复用器具有至少两个输出，其中每个多路复用器被配置为经由多条通信线路之一接收由通信系统产生的信号，并且每个多路复用器可以可选地耦合到设备条带中的至少两个设备。测试器可以被配置为将多个通信线路索引到设备的第一子集，启动至少一个测试，命令设备为每个测试生成数据，从第一组设备检索数据并且从第二组设备检索数据。

13. 发明申请

US20150298966A1 SENSOR PACKAGE HAVING STACKED DIE 有权
标题翻译：传感器包装有堆叠的DIE
公开(公告)号：US20150298966A1
公开(公告)日：2015-10-22
申请号：US14257553
申请日：2014-04-21
申请人： PHILIP H. BOWLES , STEPHEN R. HOOPER
发明人： PHILIP H. BOWLES , STEPHEN R. HOOPER
IPC分类号： B81B7/02 , B81C1/00
CPC分类号： B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2201/0292 , B81B2207/07 , B81C1/0023 , B81C2203/0154 , B81C2203/0792 , H01L2224/05554 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A small area semiconductor device package containing two or more MEMS sensor device die and a controller die for the sensor devices is provided. The controller die is mounted on top of the largest MEMS sensor device die (e.g., a gyroscope) and over a second MEMS sensor device die (e.g., an accelerometer). In one embodiment, the controller die is also mounted on the top of the second MEMS sensor device die. In another embodiment, the controller die overhangs the second MEMS sensor device die, which is of a lesser thickness than the first MEMS sensor device die.
摘要翻译：提供了一种包含两个或更多个MEMS传感器器件管芯和用于传感器器件的控制器管芯的小面积半导体器件封装。控制器管芯安装在最大的MEMS传感器器件管芯（例如，陀螺仪）的顶部上，并且安装在第二MEMS传感器器件管芯（例如，加速度计）上。在一个实施例中，控制器管芯也安装在第二MEMS传感器器件管芯的顶部上。在另一个实施例中，控制器模具突出第二MEMS传感器器件管芯，该第二MEMS传感器器件管芯的厚度小于第一MEMS传感器器件管芯的厚度。

14. 发明授权

US08890308B2 Integrated circuit package and method of forming the same 有权
标题翻译：集成电路封装及其形成方法
公开(公告)号：US08890308B2
公开(公告)日：2014-11-18
申请号：US13441448
申请日：2012-04-06
申请人： Stephen R. Hooper , William C. Stermer, Jr.
发明人： Stephen R. Hooper , William C. Stermer, Jr.
IPC分类号： H01L23/12 , H01L21/44
CPC分类号： G01L19/0084 , B60C23/0433 , G01L19/143 , G01L19/147 , H01L24/48 , H01L24/49 , H01L2224/48137 , H01L2224/49111 , H01L2224/49171 , H01L2924/00014 , H01L2224/45099
摘要： An integrated circuit package includes an electronic sensor protected by a lid structure. The electronic sensor includes a transducer placed on a backside surface of a lead frame assembly. The lid structure is placed over the transducer and is attached to the lead frame assembly on the backside surface. The lid can define an air cavity around the transducer, such that mold compound, gel, or other protective chemical material is not placed in contact with the transducer. The transducer is therefore protected without a chemical protectant, lowering the cost of the integrated circuit package and maintaining the sensitivity and performance of the transducer.
摘要翻译：集成电路封装包括由盖结构保护的电子传感器。电子传感器包括放置在引线框架组件的背面上的换能器。盖结构放置在换能器上方并且附接到背面上的引线框架组件。盖可以在换能器周围限定空气腔，使得模具化合物，凝胶或其它保护性化学材料不与换能器接触。因此，传感器在没有化学保护剂的情况下被保护，降低了集成电路封装的成本并保持了传感器的灵敏度和性能。

15. 发明申请

US20140146509A1 ELECTRONIC DEVICES WITH CAVITY-TYPE, PERMEABLE MATERIAL FILLED PACKAGES, AND METHODS OF THEIR MANUFACTURE 有权
标题翻译：具有密封型，可渗透材料填充包装的电子设备及其制造方法
公开(公告)号：US20140146509A1
公开(公告)日：2014-05-29
申请号：US13686102
申请日：2012-11-27
申请人： STEPHEN R. HOOPER , DARREL R. FREAR , WILLIAM C. STERMER, JR.
发明人： STEPHEN R. HOOPER , DARREL R. FREAR , WILLIAM C. STERMER, JR.
IPC分类号： H05K7/02 , H05K13/04
CPC分类号： H05K13/0469 , B81B7/0038 , G01L19/0654 , H01L23/053 , H01L23/24 , H01L23/49861 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/1461 , Y10T156/10 , H01L2924/00014 , H01L2924/00
摘要： Embodiments include devices and methods of their manufacture. A device embodiment includes a package housing, at least one electronic circuit (e.g., a sensor circuit), a first material, and a second material. The package housing includes a cavity that is partially defined by a cavity bottom surface, and the cavity bottom surface includes a mounting area and a non-mounting area. The at least one electronic circuit is attached to the cavity bottom surface over the mounting area. The first material has a relatively high, first modulus of elasticity, and covers the non-mounting area. The second material has a relatively low, second modulus of elasticity, and is disposed over the first material within the cavity.
摘要翻译：实施例包括其制造的装置和方法。器件实施例包括封装壳体，至少一个电子电路（例如，传感器电路），第一材料和第二材料。包装壳体包括由腔底表面局部限定的空腔，腔体底面包括安装区域和非安装区域。所述至少一个电子电路在所述安装区域上附接到所述空腔底表面。第一种材料具有相对高的第一弹性模量，并且覆盖非安装区域。第二材料具有相对低的第二弹性模量，并且设置在腔内的第一材料之上。

16. 发明授权

US08659167B1 Sensor packaging method and sensor packages 有权
标题翻译：传感器封装方法和传感器封装
公开(公告)号：US08659167B1
公开(公告)日：2014-02-25
申请号：US13597824
申请日：2012-08-29
申请人： Philip H. Bowles , Paige M. Holm , Stephen R. Hooper , Raymond M. Roop
发明人： Philip H. Bowles , Paige M. Holm , Stephen R. Hooper , Raymond M. Roop
IPC分类号： H01L29/84
CPC分类号： H01L23/528 , B81C1/0023 , B81C1/00238 , B81C2201/019 , B81C2203/0792 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method (80) entails providing (82) a structure (117), providing (100) a controller element (102, 24), and bonding (116) the controller element to an outer surface (52, 64) of the structure. The structure includes a sensor wafer (92) and a cap wafer (94). Inner surfaces (34, 36) of the wafers (92, 94) are coupled together, with sensors (30) interposed between the wafers. One wafer (94, 92) includes a substrate portion (40, 76) with bond pads (42) formed on its inner surface (34, 36). The other wafer (94, 92) conceals the substrate portion (40, 76). After bonding, methodology (80) entails forming (120) conductive elements (60) on the element (102, 24), removing (126) material sections (96, 98, 107) from the wafers to expose the bond pads, forming (130) electrical interconnects (56), applying (134) packaging material (64), and singulating (138) to produce sensor packages (20, 70).
摘要翻译：方法（80）需要提供（82）结构（117），提供（100）控制器元件（102,24），并将控制器元件（116）结合（116）到结构的外表面（52,64）。该结构包括传感器晶片（92）和盖晶片（94）。晶片（92,94）的内表面（34,36）被耦合在一起，传感器（30）置于晶片之间。一个晶片（94,92）包括具有形成在其内表面（34,36）上的接合焊盘（42）的衬底部分（40,76）。另一个晶片（94,92）隐藏基板部分（40,76）。在结合之后，方法学（80）需要在元件（102,24）上形成（120）导电元件（60），从晶片去除（126）材料部分（96,98,107）以暴露接合焊盘，形成 130）电互连（56），施加（134）包装材料（64）和单分离（138）以产生传感器封装（20,70）。

17. 发明申请

US20130297248A1 TESTER AND METHOD FOR TESTING A STRIP OF DEVICES 有权
标题翻译：用于测试设备条的测试仪和方法
公开(公告)号：US20130297248A1
公开(公告)日：2013-11-07
申请号：US13465651
申请日：2012-05-07
申请人： Chad S. Dawson , Stephen R. Hooper , Peter T. Jones , Mark E. Schlarmann
发明人： Chad S. Dawson , Stephen R. Hooper , Peter T. Jones , Mark E. Schlarmann
IPC分类号： G06F19/00
CPC分类号： G01R31/31718 , B81B2207/03 , B81C99/0045 , B81C99/005 , G01R31/06 , G01R31/2829 , G01R31/2844
摘要： A tester configured to test a strip of devices is provided. The tester may include a communications system, a plurality of communication lines, a plurality of multiplexors, each multiplexor having at least two outputs, wherein each multiplexor is configured to receive a signal generated by the communications system via one of the plurality of communication lines, and each multiplexor may be selectably coupled to at least two of the devices in the strip of devices. The tester may be configured to index the plurality of communication lines to a first subset of the devices, initiate at least one test, command the devices to generate data for each of the at least one tests, retrieve data from a first set of the devices, and retrieve data from a second set of the devices.
摘要翻译：提供了一种配置成测试一条设备的测试仪。测试器可以包括通信系统，多个通信线路，多个多路复用器，每个多路复用器具有至少两个输出，其中每个多路复用器被配置为经由多条通信线路之一接收由通信系统产生的信号，并且每个多路复用器可以可选地耦合到设备条带中的至少两个设备。测试器可以被配置为将多个通信线路索引到设备的第一子集，启动至少一个测试，命令设备为每个测试生成数据，从第一组设备检索数据并且从第二组设备检索数据。

18. 发明申请

US20110201288A1 DEVICE INCLUDING AN ANTENNA AND METHOD OF USING AN ANTENNA 有权
标题翻译：包括天线的装置和使用天线的方法
公开(公告)号：US20110201288A1
公开(公告)日：2011-08-18
申请号：US12707961
申请日：2010-02-18
申请人： Stephen R. Hooper , James D. MacDonald
发明人： Stephen R. Hooper , James D. MacDonald
IPC分类号： H04B1/04
CPC分类号： H01Q9/0421
摘要： An integrated package is disclosed that includes a conductive structure that can be selectively configured to include a radiating element of a planar antenna or to include a radio-frequency shielding structure. Examples of a planar antenna include PIFA antennas, patch antennas, and the like. The planar antenna can be selectively configured to different tuning profiles, and operate as a diversity antenna by alternating its tuning profile configuration amongst different tuning profiles.
摘要翻译：公开了一种集成封装，其包括可选择性地配置为包括平面天线的辐射元件或包括射频屏蔽结构的导电结构。平面天线的例子包括PIFA天线，贴片天线等。平面天线可以选择性地配置成不同的调谐曲线，并且通过在不同的调谐曲线之间交替调谐轮廓配置来作为分集天线来操作。

19. 发明授权

US07632698B2 Integrated circuit encapsulation and method therefor 有权
标题翻译：集成电路封装及其方法
公开(公告)号：US07632698B2
公开(公告)日：2009-12-15
申请号：US11383649
申请日：2006-05-16
申请人： Stephen R. Hooper , David E. Heeley
发明人： Stephen R. Hooper , David E. Heeley
IPC分类号： H01L21/00
CPC分类号： G01L19/141 , G01L19/147 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/00012
摘要： A device (12) may have a pressure sensitive portion (17) which is protected from corrosion by a pressure transmitting material (20). Pressure transmitting material (20) may also be used to transmit pressure to pressure sensitive portion (17). A masking material (22) may be used to define an opening (26) in encapsulating material (24).
摘要翻译：装置（12）可以具有受压力传递材料（20）防止腐蚀的压力敏感部分（17）。压力传递材料（20）也可用于将压力传递到压敏部分（17）。掩模材料（22）可用于在封装材料（24）中限定开口（26）。

20. 发明申请

US20090250795A1 LEADFRAME FOR PACKAGED ELECTRONIC DEVICE WITH ENHANCED MOLD LOCKING CAPABILITY 有权
标题翻译：用于具有增强的模具锁定能力的包装电子设备的LEADFRAME
公开(公告)号：US20090250795A1
公开(公告)日：2009-10-08
申请号：US12099446
申请日：2008-04-08
申请人： Stephen R. Hooper , James D. MacDonald , Russell S. Shumway
发明人： Stephen R. Hooper , James D. MacDonald , Russell S. Shumway
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L23/3107 , H01L23/49503 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged electronic device (20) includes a die pad (30), leads (32) arranged around the die pad (30), and a die (24) attached to an upper surface (34) of the die pad (30) and electrically connected to the leads (32). A packaging material (28) encapsulates the die pad (30), the die (24), and the leads (32). The die pad (30) includes indentations (42) formed in the upper surface (34) along a sidewall (38) of the die pad (30). The die pad (30) further includes indentations (44) formed in a lower surface (36) of the die pad (30) along the sidewall. The packaging material (28) fills the indentations (42, 44) thereby promoting adhesion between the die pad (30) and the packaging material (28) so that the die pad (30) and packaging material (28) cannot readily delaminate.
摘要翻译：封装的电子设备（20）包括管芯焊盘（30），布置在管芯焊盘（30）周围的引线（32）和连接到管芯焊盘（30）的上表面（34）的管芯（24）电连接到引线（32）。封装材料（28）封装管芯焊盘（30），管芯（24）和引线（32）。管芯焊盘（30）包括沿着管芯焊盘（30）的侧壁（38）形成在上表面（34）中的凹陷（42）。管芯焊盘（30）还包括沿着侧壁形成在管芯焊盘（30）的下表面（36）中的凹陷（44）。包装材料（28）填充凹陷（42,44），从而促进模片垫（30）和包装材料（28）之间的粘附，使得模片垫（30）和包装材料（28）不能容易地分层。

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