会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 11. 发明申请
    • WAFER CHUCK FOR EUV LITHOGRAPHY
    • WAVER CHUCK FOR EUV LITHOGRAPHY
    • US20110310524A1
    • 2011-12-22
    • US13163100
    • 2011-06-17
    • Stephan Six
    • Stephan Six
    • H01L21/687
    • G03F7/70783G03F7/70708
    • A wafer chuck (1b) having a substrate (2) and having, applied to the substrate (2), an electrically conductive coating (8) for fixing a wafer (6) by electrostatic attraction and preferably having a reflective coating (10) applied to the substrate (2). The coating (8; 10) has at least a first layer (3; 11) under compressive stress and at least a second layer (7; 12) under tensile stress for compensating for the compressive stress of the first layer (3; 11) in order to keep deformation of the wafer chuck (1b) by the coating (8, 10) as low as possible.
    • 一种具有衬底(2)并且具有施加到衬底(2)上的用于通过静电吸引固定晶片(6)的导电涂层(8)并且优选地具有应用反射涂层(10)的晶片卡盘(1b) (2)。 涂层(8; 10)在拉伸应力下至少具有压缩应力下的第一层(3; 11)和至少第二层(7; 12),用于补偿第一层(3; 11)的压缩应力, 以便通过涂层(8,10)保持晶片卡盘(1b)的变形尽可能低。