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    • 11. 发明授权
    • Semiconductor component mounting apparatus
    • 半导体元件安装装置
    • US06398570B1
    • 2002-06-04
    • US09709553
    • 2000-11-13
    • Kenji YoshidaTakashi NaitoShigeru MurayamaKatsuhiko SakamotoTakashi Masaki
    • Kenji YoshidaTakashi NaitoShigeru MurayamaKatsuhiko SakamotoTakashi Masaki
    • H01R1315
    • H05K7/1007G01R1/0416H01R12/88
    • A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor 20 with which the semiconductor component contacts; a substrate 30 which supplies an electric signal to the contactor 20; a plurality of connection components 40, each of which has an electric terminal 48 for supplying the electric signal to the substrate 30 and which is fixed to the substrate 30; a plurality of connectors 50 which has a contact pin 70 including a contact part 74 for contacting with the electric terminal 48 of the connection component 40, a housing 68 for holding the contact pin 70, a pushing part 78 for pushing the contact pin 70 to the electric terminal 48, and which is freely-detachably connected to one of the plurality of the connection components 40; a holder 80 which holds the plurality of the connectors 50, and a fixing part 86 which fixes the holder 80 to the substrate 30, wherein the contact part 74 slides along the electric terminal 48, while contacting with the electric terminal 40, when the pushing part 78 pushes the contact pin 70.
    • 一种用于安装半导体部件以测试半导体部件的电特性的半导体部件安装装置,包括:半导体部件与其接触的接触器20; 将电信号提供给接触器20的基板30; 多个连接部件40,每个连接部件40具有用于将电信号提供到基板30并且固定到基板30的电端子48; 多个连接器50具有接触销70,该接触销70包括用于与连接部件40的电端子48接触的接触部分74,用于保持接触销70的壳体68,用于将接触销70推到的推动部分78 电气端子48,并且可自由拆卸地连接到多个连接部件40之一; 保持多个连接器50的保持器80和将保持器80固定到基板30的固定部86,其中接触部74在与电端子40接触的同时沿着电端子48滑动,当推动 部分78推动接触销70。
    • 12. 发明授权
    • Semiconductor component mounting apparatus
    • 半导体元件安装装置
    • US06184698B2
    • 2001-02-06
    • US09347867
    • 1999-07-09
    • Kenji YoshidaTakashi NaitoShigeru MurayamaKatsuhiko SakamotoTakashi Masaki
    • Kenji YoshidaTakashi NaitoShigeru MurayamaKatsuhiko SakamotoTakashi Masaki
    • G01R3102
    • H05K7/1007G01R1/0416H01R12/88
    • A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor 20 with which the semiconductor component contacts; a substrate 30 which supplies an electric signal to the contactor 20; a plurality of connection components 40, each of which has an electric terminal 48 for supplying the electric signal to the substrate 30 and which is fixed to the substrate 30; a plurality of connectors 50 which has a contact pin 70 including a contact part 74 for contacting with the electric terminal 48 of the connection component 40, a housing 68 for holding the contact pin 70, a pushing part 78 for pushing the contact pin 70 to the electric terminal 48, and which is freely-detachably connected to one of the plurality of the connection components 40; a holder 80 which holds the plurality of the connectors 50; and a fixing part 86 which fixes the holder 80 to the substrate 30, wherein the contact part 74 slides along the electric terminal 48, while contacting with the electric terminal 48, when the pushing part 78 pushes the contact pin 70.
    • 一种用于安装半导体部件以测试半导体部件的电特性的半导体部件安装装置,包括:半导体部件与其接触的接触器20; 将电信号提供给接触器20的基板30; 多个连接部件40,每个连接部件40具有用于将电信号提供到基板30并且固定到基板30的电端子48; 多个连接器50具有接触销70,该接触销70包括用于与连接部件40的电端子48接触的接触部分74,用于保持接触销70的壳体68,用于将接触销70推到的推动部分78 电气端子48,并且可自由拆卸地连接到多个连接部件40之一; 保持多个连接器50的保持器80; 以及固定部分86,其将保持器80固定到基板30,其中当推动部分78推动接触销70时,接触部分74在与电端子48接触的同时沿着电端子48滑动。
    • 13. 发明授权
    • Connector
    • 连接器
    • US07125264B2
    • 2006-10-24
    • US10971437
    • 2004-10-22
    • Shigeru MurayamaMasanori KanekoShigeru MatsumuraTakashi SekizukaHiroyuki Hama
    • Shigeru MurayamaMasanori KanekoShigeru MatsumuraTakashi SekizukaHiroyuki Hama
    • H01R13/648
    • H01R24/52H01R12/716H01R12/721H01R12/725H01R13/6581H01R13/6585H01R31/06H01R2103/00H01R2201/20
    • A connector mounted on a board having a plurality of board signal lines for transmitting a signal and a board ground line grounded. Each of the plurality of board signal lines includes a plurality of signal terminals formed in correspondence to each of the signal lines. Each of the signal terminals comprises: a signal core line formed of conductor by extension in the shape of a line; a shield for core line formed of conductor insulated from the signal core line electrically so as to extend in an axis direction of the signal core line and enclose the signal core line; a signal electrode formed by extension from the signal core line for connecting the signal core line with the board signal line corresponding to the signal terminal; and a plurality of ground electrodes extended from the shield for core line and opposed to each other by intervention of the signal electrode for connecting the shield for core line with the board ground line respectively.
    • 安装在板上的连接器,其具有用于传输信号的多个板信号线和接地的板接地线。 多个板信号线中的每一个包括与每个信号线相对应地形成的多个信号端。 每个信号端子包括:由导线形成的以线形延伸的信号芯线; 用于芯线的屏蔽,由与信号芯线绝缘的导线形成,以沿信号芯线的轴线方向延伸并包围信号芯线; 由信号芯线延伸形成的信号电极,用于将信号芯线与对应于信号端子的电路板信号线相连; 以及从用于芯线的屏蔽件延伸的多个接地电极,并且分别通过用于将芯线的屏蔽与板接地线连接的信号电极彼此相对。
    • 17. 发明授权
    • Semiconductor component mounting apparatus
    • 半导体元件安装装置
    • US06478596B2
    • 2002-11-12
    • US10051825
    • 2002-01-16
    • Kenji YoshidaTakashi NaitoShigeru MurayamaKatsuhiko SakamotoTakashi Masaki
    • Kenji YoshidaTakashi NaitoShigeru MurayamaKatsuhiko SakamotoTakashi Masaki
    • H01R1315
    • H05K7/1007
    • A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor 20 with which the semiconductor component contacts; a substrate 30 which supplies an electric signal to the contractor 20; a plurality of connection components 40, each of which has an electric terminal 48 for supplying the electric signal to the substrate 30 and which is fixed to the substrate 30; a plurality of connectors 50 which has a contact pin 70 including a contact part 74 for contacting with the electric terminal 48 of the connection component 40, a housing 68 for holding the contact pin 70, a pushing apart 78 for pushing the contact pin 70 to the electric terminal 48, and which is freely-detachably connected to one of the plurality of the connection components 40; a holder 80 which holds the plurality of the connectors 50; and a fixing part 86 which fixes the holder 80 to the substrate 30, wherein the contact part 74 slides along the electric terminal 48, while contacting with the electric terminal 40, when the pushing part 78 pushes the contact pin 70.
    • 一种用于安装半导体部件以测试半导体部件的电特性的半导体部件安装装置,包括:半导体部件与其接触的接触器20; 向承包商20提供电信号的基板30; 多个连接部件40,每个连接部件40具有用于将电信号提供到基板30并且固定到基板30的电端子48; 多个连接器50具有接触销70,该接触销70包括用于与连接部件40的电端子48接触的接触部分74,用于保持接触销70的壳体68,用于将接触销70推到的推动部分78 电气端子48,并且可自由拆卸地连接到多个连接部件40之一; 保持多个连接器50的保持器80; 以及固定部分86,其将保持器80固定到基板30上,其中当推动部分78推动接触销70时,接触部分74在与电端子40接触的同时沿着电端子48滑动。