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11. 发明授权

US06951597B2 Dynamic polishing fluid delivery system for a rotational polishing apparatus 有权
标题翻译：用于旋转抛光装置的动态抛光液输送系统
公开(公告)号：US06951597B2
公开(公告)日：2005-10-04
申请号：US10698765
申请日：2003-10-31
申请人： Nikolay N. Korovin
发明人： Nikolay N. Korovin
IPC分类号： B24B37/04 , B24B57/02 , C25F7/00 , H01L21/306 , B24B37/00 , H01L21/304
CPC分类号： B24B37/16 , B24B57/02 , C25F7/00 , H01L21/30625
摘要： Methods and apparatus are provided for performing a chemical-mechanical process on a workpiece surface. The apparatus includes a platen having a top surface and at least one inlet configured to receive a polishing fluid, a plurality of holes formed in the top surface, a manifold system in fluid communication with the at least one inlet and each of the holes, a controller adapted to supply valve command signals, and a plurality of valves, each valve being disposed in one of the holes and coupled to the controller to receive the valve command signals and being operable, in response thereto, to selectively move between an open and a closed position. The method includes the steps of supplying the valve command signals, and selectively opening and closing the valves in response to the valve command signals.
摘要翻译：提供了用于在工件表面上进行化学机械处理的方法和装置。该装置包括具有顶表面和至少一个入口的压板，该入口被配置为容纳抛光流体，在顶表面中形成的多个孔，与至少一个入口和每个孔流体连通的歧管系统，控制器，其适于提供阀命令信号，以及多个阀，每个阀设置在一个孔中并且耦合到控制器以接收阀命令信号，并且响应于此可选择性地在打开和关闭之间移动关闭位置。该方法包括以下步骤：响应于阀门命令信号，提供阀门命令信号，并选择性地打开和关闭阀门。

12. 发明授权

US06612903B2 Workpiece carrier with adjustable pressure zones and barriers 有权
公开(公告)号：US06612903B2
公开(公告)日：2003-09-02
申请号：US10053974
申请日：2002-01-22
申请人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
发明人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
IPC分类号： B24B4900
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： An apparatus and method are disclosed for planarizing a wafer in a carrier with adjustable pressure zones and adjustable barriers between zones. The carrier has an independently controlled central zone and concentric surrounding zones for distributing the pressure on the backside of a wafer while the wafer is being pressed against an abrasive surface in a chemical-mechanical polishing tool. The pressure zones may be created by mounting an elastic web diaphragm to a carrier housing that has a plurality of recesses. A corresponding plurality of elastic ring shaped ribs may extend from the web diaphragm opposite the recesses. The plurality of ring shaped ribs thereby defines a central zone surrounded by one or more concentric surrounding zones. The zones and barriers may be individually pressurized by utilizing corresponding fluid communication paths during the planarization process. A method for practicing the present invention starts by selecting a carrier with adjustable pressure zones that correspond to the number and locations of the bulges and troughs on the wafer. Zones that correspond to high regions receive greater pressure than zones that correspond to low regions on the wafer. The pressure on the barriers between zones may be optimized to prevent leakage between zones or to smooth the pressure distribution between neighboring zones on the back surface of the wafer.

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