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    • 16. 发明授权
    • Method of distortion compensation by irradiation of adaptive lithography membrane masks
    • 通过适应光刻膜掩模照射的失真补偿方法
    • US06440619B1
    • 2002-08-27
    • US09578572
    • 2000-05-25
    • Martin Feldman
    • Martin Feldman
    • G03C500
    • G03F1/22G03F1/72Y10S430/143Y10S430/146Y10S430/168
    • Techniques are disclosed to compensate for distortions in lithography by locally heating the membrane in a lithographic mask. The techniques may be used both to shrink and to expand areas of the mask locally, in order to adjust for varying magnitudes and signs of distortion. In one embodiment the correction method comprises two steps: (1) A send-ahead wafer is exposed and measured by conventional means to determine the overlay errors at several points throughout the field. (2) During exposure of subsequent wafers, calibrated beams of light are focused on the mask. The heating from the absorbed light produces displacements that compensate for the overlay errors measured with the send-ahead wafer. Any source of distortion may be corrected—for example, distortion appearing on the mask initially, distortion that only develops on the mask over time, or distortion on the wafer. In another embodiment, a reference pattern is formed on the membrane as a means of measuring mask distortion, and the heat input distribution needed to correct distortion is determined by subsequent measurements of the reference pattern. In this alternative embodiment, any source of distortion in the mask may be corrected.
    • 公开了通过局部加热光刻掩模中的膜来补偿光刻中的变形的技术。 这些技术可以同时用于收缩和局部扩大掩模的区域,以便调整变化的幅度和失真的迹象。 在一个实施例中,校正方法包括两个步骤:(1)通过传统手段对发射晶片进行曝光和测量,以确定整个场中的几个点处的覆盖误差。 (2)在后续晶片曝光期间,校准光束聚焦在掩模上。 来自吸收光的加热产生位移,补偿由发射晶片测量的重叠误差。 可以校正任何失真源 - 例如,最初出现在掩模上的失真,仅在掩模上随时间发生的失真或晶片上的失真。 在另一个实施例中,作为测量掩模失真的手段在膜上形成参考图案,并且通过参考图案的后续测量来确定校正失真所需的热输入分布。 在该替代实施例中,可以校正掩模中的任何失真源。
    • 18. 发明授权
    • Scanning systems for high resolution e-beam and X-ray lithography
    • 用于高分辨率电子束和X射线光刻的扫描系统
    • US5424549A
    • 1995-06-13
    • US136300
    • 1993-10-14
    • Martin Feldman
    • Martin Feldman
    • G03F7/20G21K1/02G21K5/02H01J37/317
    • G03F7/70058G03F7/70216G21K1/025G21K5/02
    • An electron-beam lithography apparatus and method, including an electron source with a mask or photocathode for generating a patterned electron beam; an electron-sensitive resist layer; a conductive plate with a slit, located between the electron source and the resist layer, with the patterned electron beam passing only through the slit; an electric field between the electron source and the conductive plate to accelerate electrons, with the conductive plate causing the electric field between the plate and the resist to be substantially zero; a magnetic field between the electron source and the resist, to focus electrons on the resist; and alignment device for synchronously scanning the mask or photocathode and the resist at the same velocity relative to the slit and to the electron source, and at zero velocity relative to each other, so that substantially all of the pattern of the patterned electron beam is imaged on the resist without substantial change in size.
    • 一种电子束光刻设备和方法,包括具有用于产生图案化电子束的掩模或光电阴极的电子源; 电子敏感抗蚀剂层; 具有狭缝的导电板,位于电子源和抗蚀剂层之间,图案化电子束仅通过狭缝; 电子源和导电板之间的电场以加速电子,导电板使得板和抗蚀剂之间的电场基本上为零; 电子源和抗蚀剂之间的磁场,以将电子聚焦在抗蚀剂上; 以及对准装置,用于以相对于狭缝和电子源的相同速度同时扫描掩模或光电阴极和抗蚀剂,并且以相对于彼此的零速度,使得图案化电子束的基本上所有图案被成像 在抗蚀剂上没有大的变化。