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    • 12. 发明申请
    • OPTO-ELECTRONIC ASSEMBLY FOR A LINE CARD
    • 用于线卡的OPTO-ELECTRONIC ASSEMBLY
    • US20120087678A1
    • 2012-04-12
    • US12944875
    • 2010-11-12
    • Mark P. Earnshaw
    • Mark P. Earnshaw
    • H04B10/06G02B6/122G02B6/43
    • G02B6/12019G02B6/12004G02B6/4249G02B6/43H01L2224/48091H01L2224/73257H01S5/005H01S5/02252H01S5/02272H01S5/4031H04B10/506H01L2924/00014
    • In one embodiment, the opto-electronic assembly is a hybrid integrated circuit having an array of avalanche photodiodes (APDs) that are electrically coupled to a corresponding array of transimpedance amplifiers (TIAs), with both the APDs and TIAs being mounted on a common ceramic substrate. The opto-electronic assembly further has an optical subassembly comprising an arrayed waveguide grating (AWG) and an array of turning mirrors, both attached to a temperature-control unit in a side-by-side arrangement and flip-chip mounted on the substrate over the APDs. The opto-electronic assembly employs a silicon-based submount inserted between the APDs and the substrate to accommodate the height difference between the APDs and the TIAs. The submount advantageously enables the placement of APDs in relatively close proximity to the turning mirrors while providing good control of the APD's tilt and offset distance with respect to the substrate. The temperature-control unit enables independent temperature control of the AWG and of the array of turning mirrors, which helps to achieve good optical-coupling efficiency between the AWG and the APDs even when the turning mirrors have a relatively small size.
    • 在一个实施例中,光电组件是具有电耦合到相应的跨阻抗放大器(TIAs)阵列的雪崩光电二极管(APD)阵列的混合集成电路,其中APD和TIA均安装在公共陶瓷 基质。 光电组件还具有光学子组件,该光学子组件包括阵列波导光栅(AWG)和转向镜阵列,它们并排连接到并排布置的温度控制单元和安装在基板上的倒装芯片 APD。 光电组件采用插入在APD和衬底之间的硅基底座,以适应APD和TIA之间的高度差。 底座有利地使得APD的位置相对靠近转向镜同时提供对APD相对于衬底的倾斜和偏移距离的良好控制。 温度控制单元实现了AWG和转向镜阵列的独立温度控制,即使当转向镜具有相对小的尺寸时,这有助于在AWG和APD之间实现良好的光耦合效率。